Patents by Inventor Takeshil Kato

Takeshil Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical module, method for manufacturing optical module and optical communication apparatus
    Patent number: 7165898
    Abstract: An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by injection using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: January 23, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Takeshil Kato, Koji Yoshida, Toshinori Hirataka, Toshiaki Ishii, Kazuyuki Fukuda, Tadaaki Ishikawa, Toshimasa Miura, Tsutomu Kono, Kimio Tatsuno
  • Optical module, method for manufacturing optical module and optical communication apparatus
    Patent number: 6726375
    Abstract: An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by injection using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.
    Type: Grant
    Filed: August 16, 2002
    Date of Patent: April 27, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Takeshil Kato, Koji Yoshida, Toshinori Hirataka, Toshiaki Ishii, Kazuyuki Fukuda, Tadaaki Ishikawa, Toshimasa Miura, Tsutomu Kono, Kimio Tatsuno
  • Optical module, method for manufacturing optical module and optical communication apparatus
    Publication number: 20020197026
    Abstract: The present invention is to reduce the package cost and secure the high reliability in an optical module having an optical device and an optical fiber.
    Type: Application
    Filed: August 16, 2002
    Publication date: December 26, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Takeshil Kato, Koji Yoshida, Toshinori Hirataka, Toshiaki Ishii, Kazuyuki Fukuda, Tadaaki Ishikawa, Toshimasa Miura, Tsutomu Kono, Kimio Tatsuno
  • Optical module, method for manufacturing optical module and optical communication apparatus
    Patent number: 6457877
    Abstract: An optical module for an optical device and an optical fiber is constituted by a pre-molded plastic package. In forming the plastic package, the main flowing direction of the molding resin is substantially parallel with the optical axis of the optical fiber. The optical module is formed by molding the resin by an injection method using pressure and then solidifying the resin. When the plastic package is formed by comprehensive molding, the flowing direction of the resin is parallel with the optical axis direction of the optical fiber to be installed in the optical module. As a result, for comprehensive molding, the molding pressure applied to the optical fiber is reduced. By using the resin case that is formed, the resulting package exhibits high rigidity and low thermal expansion properties in connection with the flowing direction of the resin, thus reducing the external stress and thermal stress applied to the optical fiber.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: October 1, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Takeshil Kato, Koji Yoshida, Toshinori Hirataka, Toshiaki Ishii, Kazuyuki Fukuda, Tadaaki Ishikawa, Toshimasa Miura, Tsutomu Kono, Kimio Tatsuno
  • Optical module, method for manufacturing optical module and optical communication apparatus
    Publication number: 20010009599
    Abstract: The present invention is to reduce the package cost and secure the high reliability in an optical module having an optical device and an optical fiber.
    Type: Application
    Filed: February 21, 2001
    Publication date: July 26, 2001
    Applicant: Hitachi, Ltd.
    Inventors: Takeshil Kato, Koji Yoshida, Toshinori Hirataka, Toshiaki Ishii, Kazuyuki Fukuda, Tadaaki Ishikawa, Toshimasa Miura, Tsutomu Kono, Kimio Tatsuno