Patents by Inventor Takesi Yamamoto

Takesi Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip ceramic module for mounting electric parts on both substrate and cap connected through interconnecting pins
    Patent number: 5633783
    Abstract: Multi-layer wiring structures are respectively formed in upper and lower ceramic substrates for electric parts, and interconnecting pins held in contact with contact pads establish electrical connections between the multi-layer wiring structures so as to prevent a multi-chip module from an undesirable disconnection between the multi-layer wiring structures.
    Type: Grant
    Filed: September 29, 1995
    Date of Patent: May 27, 1997
    Assignee: Fujitsu Limited
    Inventor: Takesi Yamamoto