Patents by Inventor Taketo Watashima

Taketo Watashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120111924
    Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.
    Type: Application
    Filed: January 18, 2012
    Publication date: May 10, 2012
    Applicant: FUJI ELECTRIC SYSTEMS CO., LTD.
    Inventors: Kazuyuki MAKITA, Masaki ICHINOSE, Taketo WATASHIMA, Masayuki SOUTOME, Mitsuo YAMASHITA, Takeshi ASAGI, Masatoshi HIRAI, Toru MURATA
  • Publication number: 20090286093
    Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.
    Type: Application
    Filed: July 2, 2009
    Publication date: November 19, 2009
    Applicant: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
    Inventors: Kazuyuki MAKITA, Masaki Ichinose, Taketo Watashima, Masayuki Soutome, Mitsuo Yamashita, Takeshi Asagi, Masatoshi Hirai, Toru Murata
  • Publication number: 20070029678
    Abstract: According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.
    Type: Application
    Filed: August 4, 2006
    Publication date: February 8, 2007
    Inventors: Kazuyuki Makita, Masaki Ichinose, Taketo Watashima, Masayuki Soutome, Mitsuo Yamashita, Takeshi Asagi, Masatoshi Hirai, Toru Murata