Patents by Inventor Taketoshi FUKUSHIMA

Taketoshi FUKUSHIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 10586777
    Abstract: To improve the reliability of a semiconductor device. The semiconductor device includes a plurality of wiring layers formed on a semiconductor substrate, a pad formed on an uppermost wiring layer of the plurality of wiring layers, a surface protection film which includes an opening on the pad and is made of an inorganic insulating film, a rewiring formed on the surface protection film; a pad electrode formed on the rewiring, and a wire connected to the pad electrode. The rewiring includes a pad electrode mounting portion on which the pad electrode is mounted, a connection portion which is connected to the pad, and an extended wiring portion which couples the pad electrode mounting portion and the connection portion, and the pad electrode mounting portion has a rectangular shape when seen in a plan view.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: March 10, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kentaro Yamada, Shigeki Tomaru, Taketoshi Fukushima
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20180108629
    Abstract: To improve the reliability of a semiconductor device. The semiconductor device includes a plurality of wiring layers formed on a semiconductor substrate, a pad formed on an uppermost wiring layer of the plurality of wiring layers, a surface protection film which includes an opening on the pad and is made of an inorganic insulating film, a rewiring formed on the surface protection film; a pad electrode formed on the rewiring, and a wire connected to the pad electrode. The rewiring includes a pad electrode mounting portion on which the pad electrode is mounted, a connection portion which is connected to the pad, and an extended wiring portion which couples the pad electrode mounting portion and the connection portion, and the pad electrode mounting portion has a rectangular shape when seen in a plan view.
    Type: Application
    Filed: December 15, 2017
    Publication date: April 19, 2018
    Inventors: Kentaro YAMADA, Shigeki TOMARU, Taketoshi FUKUSHIMA
  • Semiconductor Device and Method of Manufacturing the Same
    Publication number: 20160240499
    Abstract: To improve the reliability of a semiconductor device. The semiconductor device includes a plurality of wiring layers formed on a semiconductor substrate, a pad formed on an uppermost wiring layer of the plurality of wiring layers, a surface protection film which includes an opening on the pad and is made of an inorganic insulating film, a rewiring formed on the surface protection film; a pad electrode formed on the rewiring, and a wire connected to the pad electrode. The rewiring includes a pad electrode mounting portion on which the pad electrode is mounted, a connection portion which is connected to the pad, and an extended wiring portion which couples the pad electrode mounting portion and the connection portion, and the pad electrode mounting portion has a rectangular shape when seen in a plan view.
    Type: Application
    Filed: January 24, 2016
    Publication date: August 18, 2016
    Inventors: Kentaro YAMADA, Shigeki TOMARU, Taketoshi FUKUSHIMA