Abstract: A process of nickel plating for forming a plated film having a high phosphorus content according to this invention comprises the steps of: a first step of electroless plating a substance to be plated in an electroless plating bath capable of forming an electroless plated film having a phosphorus content of from 0.20 to 0.25 in atomic ratio of phosphorus with respect to nickel taken as one (1); and a second step of electroplating the substance to be plated by applying an electric current having an electric current density of from 1 to 10 A/dm.sup.2, and the substance to be plated being left immersed in the electroless plating bath continuously, thereby laminating an electroplated film on the surface of the electroless plated film. The process of nickel plating can form a plated film having a remarkably improved wettability with respect to solders since the electroplated film is formed on the electroless plated film having the high phosphorus content.