Patents by Inventor Takeyuki Arai

Takeyuki Arai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10923252
    Abstract: A resistor includes materials including copper, nickel, and lanthanum boride. A content of the materials is 40% by mass or more with respect to a total material content of the resistor. The copper includes copper particles having a particle diameter of 2.5 ?m or more. In addition, a circuit board includes a substrate, the resistor on the substrate, a metal layer on the resistor and a glass layer on the resistor. Further, an electronic device includes the circuit board and an electronic component on the metal layer.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: February 16, 2021
    Assignee: KYOCERA Corporation
    Inventors: Shodai Takayoshi, Yoshio Ohashi, Takeyuki Arai
  • Publication number: 20190279793
    Abstract: A resistor includes materials including copper, nickel, and lanthanum boride. A content of the materials is 40% by mass or more with respect to a total material content of the resistor. The copper includes copper particles having a particle diameter of 2.5 ?m or more. In addition, a circuit board includes a substrate, the resistor on the substrate, a metal layer on the resistor and a glass layer on the resistor. Further, an electronic device includes the circuit board and an electronic component on the metal layer.
    Type: Application
    Filed: September 28, 2017
    Publication date: September 12, 2019
    Inventors: Shodai TAKAYOSHI, Yoshio OHASHI, Takeyuki ARAI
  • Patent number: 9170003
    Abstract: There are provided a light-emitting element mounting substrate having high bonding strength between a substrate main body and a metal portion, and a light-emitting device having high bonding strength between the substrate main body and the metal portion and high reliability. A light-emitting element mounting substrate includes a substrate main body (20) formed of a ceramic sintered body; and a silver-containing metal portion (2), a silver-containing region (4) existing in a portion of the substrate main body which faces the metal portion across a bonding portion bonding the substrate main body and the silver-containing metal portion. Accordingly, it is possible to increase bonding strength between the substrate main body (20) and the metal portion (2).
    Type: Grant
    Filed: November 25, 2011
    Date of Patent: October 27, 2015
    Assignee: Kyocera Corporation
    Inventors: Takeyuki Arai, Minoru Nakasuga, Tetsurou Nakamoto
  • Publication number: 20130242565
    Abstract: There are provided a light-emitting element mounting substrate having high bonding strength between a substrate main body and a metal portion, and a light-emitting device having high bonding strength between the substrate main body and the metal portion and high reliability. A light-emitting element mounting substrate includes a substrate main body (20) formed of a ceramic sintered body; and a silver-containing metal portion (2), a silver-containing region (4) existing in a portion of the substrate main body which faces the metal portion across a bonding portion bonding the substrate main body and the silver-containing metal portion. Accordingly, it is possible to increase bonding strength between the substrate main body (20) and the metal portion (2).
    Type: Application
    Filed: November 25, 2011
    Publication date: September 19, 2013
    Applicant: Kyocera Corporation
    Inventors: Takeyuki Arai, Minoru Nakasuga, Tetsurou Nakamoto
  • Patent number: D248766
    Type: Grant
    Filed: May 20, 1976
    Date of Patent: August 1, 1978
    Assignee: Kabushiki Kaisha Tamron
    Inventor: Takeyuki Arai