Patents by Inventor Takeyuki Sato

Takeyuki Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230271240
    Abstract: To improve forming performance in a smart mill allowing implementation of required forming by moving a forming tool arranged in a stand of a pipe mill automatically to a predetermined position. Non-drive type breakdown rolls BD exclusive to bending are arranged in multiple stands. Drive roll DR stands exclusive to driving are arranged in stages in front of and behind each DR stand. The drive roll DR is configured to apply thrust to a central portion of a raw material using an upper flat roll and a lower flat roll, and has thrust control means and driving rotation number control means for applying thrust required for passage through the step using the drive rolls DR in multiple stages entirely and controlling the thrust.
    Type: Application
    Filed: July 30, 2021
    Publication date: August 31, 2023
    Applicant: NAKATA MANUFACTURING CO., LTD.
    Inventors: Tomoyasu NAKANO, Masato NISHII, Takeyuki SATO, Jilong YIN, Feizhou WANG, Shunichi HARUYAMA
  • Publication number: 20230145306
    Abstract: In a method for manufacturing a metal pipe from a metal plate using a forming tool, the position of the tool is optimized simply and correctly by incorporating individuality of the raw material plate into setting of the tool position. As a preparatory stage, a forming process is analyzed by simulation for each plate. Based on result of the analysis, correlation between a deformed shape value of a raw pipe and tool position information is acquired. Then, the forming process for each plate is stored as correlation between the deformed shape value of the raw pipe and the tool position information. During pipe manufacturing, a deformed shape value of the raw pipe is measured actually while a plate is passed. On the basis of the actually measured deformed shape value, a forming process for the raw pipe is expected and assumed (by using the correlation). Tool position information necessary for implementing the expected and assumed forming process is retrieved from the stored correlation.
    Type: Application
    Filed: April 8, 2021
    Publication date: May 11, 2023
    Applicant: NAKATA MANUFACTURING CO., LTD.
    Inventors: Tomoyasu NAKANO, Takeyuki SATO, Jilong YIN, Feizhou WANG, Shunichi HARUYAMA
  • Patent number: 11618065
    Abstract: Changing of a horizontal roll in a horizontal roll stand involving readjustment of an amount of pressing is to be done readily and promptly. In order to achieve this, a horizontal roll stand 10 with a pair of built-in upper and lower horizontal rolls 11 is configured to retreat toward one side across a forming line. A fixed stand 40 stands upright on a counter-retreating side of the forming line. An overhang part 42 of the fixed stand 40 jutting out over the forming line is provided with a pressure device 43 that applies a pressing force to the horizontal rolls 11. The horizontal roll stand 10 includes a horizontal roll housing 12 with an opened top, receives the pressing force from the pressure device 43 via the opened top, and retreats to the outside of the forming line while the pressure device 43 is left on the forming line.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: April 4, 2023
    Assignee: NAKATA MANUFACTURING CO., LTD.
    Inventors: Takeyuki Sato, Tomoyasu Nakano, Feizhou Wang
  • Patent number: 11305323
    Abstract: To manufacture a high-quality welded pipe, there is provided a welded pipe manufacturing apparatus for manufacturing a welded pipe by bending a metal plate and welding butting end portions of the metal plate. The welded pipe manufacturing apparatus includes a bending unit that bends the metal plate, a light emitter that emits directional light to an inner surface of the metal plate bent by the bending unit, an image capturing unit that captures light emitted by the light emitter and reflected by a surface of the metal plate, and an adjustment assistance unit that assists adjustment of the bending unit in accordance with a shape of the reflected light.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: April 19, 2022
    Assignee: NAKATA MANUFACTURING CO., LTD.
    Inventors: Jilong Yin, Tomoyasu Nakano, Feizhou Wang, Takeyuki Sato
  • Publication number: 20200360975
    Abstract: Changing of a horizontal roll in a horizontal roll stand involving readjustment of an amount of pressing is to be done readily and promptly. In order to achieve this, a horizontal roll stand 10 with a pair of built-in upper and lower horizontal rolls 11 is configured to retreat toward one side across a forming line. A fixed stand 40 stands upright on a counter-retreating side of the forming line. An overhang part 42 of the fixed stand 40 jutting out over the forming line is provided with a pressure device 43 that applies a pressing force to the horizontal rolls 11. The horizontal roll stand 10 includes a horizontal roll housing 12 with an opened top, receives the pressing force from the pressure device 43 via the opened top, and retreats to the outside of the forming line while the pressure device 43 is left on the forming line.
    Type: Application
    Filed: November 21, 2018
    Publication date: November 19, 2020
    Applicant: NAKATA MANUFACTURING CO., LTD.
    Inventors: Takeyuki SATO, Tomoyasu NAKANO, Feizhou WANG
  • Patent number: 10744578
    Abstract: A pipe cutting machine comprises: rotary blades in a pair, with a plane at a right angle to a center line of a pipe, the rotary blades being arranged to face each other on both sides of a y axis in such a manner that blade edges of the rotary blades overlap each other in an x-axis direction; a straightforward driving mechanism that drives the rotary blades straightforward in opposite directions of a y-axis direction so as to make the rotary blades pass each other on the x axis and in the vicinity of the x axis; and power direction conversion mechanisms that move the rotary blades outwardly to get farther from the y axis for avoiding interference between the blade edges when the rotary blades pass each other on the x axis and in the vicinity of the x axis.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: August 18, 2020
    Assignee: NAKATA MANUFACTURING CO., LTD.
    Inventors: Hiroaki Yabuta, Takeyuki Sato, Feizhou Wang, Hiromasa Kitayama, Jilong Yin
  • Publication number: 20190358690
    Abstract: To manufacture a high-quality welded pipe, there is provided a welded pipe manufacturing apparatus for manufacturing a welded pipe by bending a metal plate and welding butting end portions of the metal plate. The welded pipe manufacturing apparatus includes a bending unit that bends the metal plate, a light emitter that emits directional light to an inner surface of the metal plate bent by the bending unit, an image capturing unit that captures light emitted by the light emitter and reflected by a surface of the metal plate, and an adjustment assistance unit that assists adjustment of the bending unit in accordance with a shape of the reflected light.
    Type: Application
    Filed: October 6, 2017
    Publication date: November 28, 2019
    Applicant: NAKATA MANUFACTURING CO., LTD.
    Inventors: Jilong YIN, Tomoyasu NAKANO, Feizhou WANG, Takeyuki SATO
  • Publication number: 20190255629
    Abstract: To provide a pipe cutting machine capable of cutting a pipe even of a large diameter efficiently in a short period of time, and achieving excellent economical efficiency and excellent durability with a simple, compact, and light-weight configuration. A pipe cutting machine cuts a pipe 10 at a right angle to the center line of the pipe 10.
    Type: Application
    Filed: September 14, 2017
    Publication date: August 22, 2019
    Applicant: NAKATA MANUFACTURING CO., LTD.
    Inventors: Hiroaki YABUTA, Takeyuki SATO, Feizhou WANG, Hiromasa KITAYAMA, Jilong YIN
  • Patent number: 9895758
    Abstract: An object is to prolong the life of a ring tool, and improve the productivity of a welded pipe. A ring tool unit is held in a downstream-side end portion of a mandrel to be inserted into a welded pipe currently being manufactured from the upstream side of a welding position, and is used as a cutting tool for continuously cutting a bead produced on the inner surface of the welded pipe, wherein the ring tool unit is formed by fitting a ring tool having a ring-like blade in a sleeve having a circular hole for holding the outer circumference of the ring tool.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: February 20, 2018
    Assignee: NAKATA MANUFACTURING CO., LTD.
    Inventors: Feizhou Wang, Takeyuki Sato, Mitsuru Nakata, Tomoyasu Nakano, Takamitsu Miura
  • Publication number: 20170080507
    Abstract: An object is to prolong the life of a ring tool, and improve the productivity of a welded pipe. A ring tool unit is held in a downstream-side end portion of a mandrel to be inserted into a welded pipe currently being manufactured from the upstream side of a welding position, and is used as a cutting tool for continuously cutting a bead produced on the inner surface of the welded pipe, wherein the ring tool unit is formed by fitting a ring tool having a ring-like blade in a sleeve having a circular hole for holding the outer circumference of the ring tool.
    Type: Application
    Filed: March 18, 2014
    Publication date: March 23, 2017
    Applicant: NAKATA MANUFACTURING CO., LTD
    Inventors: Feizhou WANG, Takeyuki SATO, Mitsuru NAKATA, Tomoyasu NAKANO, Takamitsu MIURA
  • Patent number: 9259772
    Abstract: In a forming apparatus, inner frames are arranged in a forming roll stand so as to move up and down. Mechanical structures of convexo-concave engagement are provided on opposed faces between respective roll chocks and yokes and the inner frames. After connection with a pressing device is released, the roll chocks and yokes are guided utilizing the moving-downward motion of the inner frames, and a stack body is formed in series so as to be withdrawn from the roll stand. The stack body is disassembled utilizing the moving-upward motion of the inner frames, and the roll chocks and yokes can be guided to the desired positions inside the stand and locked.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: February 16, 2016
    Assignee: Nakata Manufacturing Co., Ltd.
    Inventors: Takeyuki Sato, Manabu Ninomiya, Hiroaki Yabuta, Takeshi Watanabe, Tomoyasu Nakano
  • Publication number: 20120285005
    Abstract: In a forming apparatus, inner frames are arranged in a forming roll stand so as to move up and down. Mechanical structures of convexo-concave engagement are provided on opposed faces between respective roll chocks and yokes and the inner frames. After connection with a pressing device is released, the roll chocks and yokes are guided utilizing the moving-downward motion of the inner frames, and a stack body is formed in series so as to be withdrawn from the roll stand. The stack body is disassembled utilizing the moving-upward motion of the inner frames, and the roll chocks and yokes can be guided to the desired positions inside the stand and locked.
    Type: Application
    Filed: December 28, 2009
    Publication date: November 15, 2012
    Applicant: NAKATA MANUFACTURING CO., LTD.
    Inventors: Takeyuki Sato, Manabu Ninomiya, Hiroaki Yabuta, Takeshi Watanabe, Tomoyasu Nakano
  • Patent number: 6726533
    Abstract: In a method for polishing leads of a semiconductor package, a plurality of semiconductor packages is arranged in a certain manner. Then, the leads are automatically polished. The semiconductor packages may be masked to expose at least a part of the leads to be polished.
    Type: Grant
    Filed: November 28, 2001
    Date of Patent: April 27, 2004
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Takeyuki Sato
  • Publication number: 20020032940
    Abstract: In a method for polishing leads of a semiconductor package, a plurality of semiconductor packages is arranged in a certain manner. Then, the leads are automatically polished. The semiconductor packages may be masked to expose at least a part of the leads to be polished.
    Type: Application
    Filed: November 28, 2001
    Publication date: March 21, 2002
    Applicant: OKI ELECTRIC INDUSTRY CO., LTD.
    Inventor: Takeyuki Sato
  • Patent number: 6336848
    Abstract: An apparatus for polishing leads of a semiconductor package includes a package holder unit on which a plurality of semiconductor packages are arranged; and a polishing member that automatically polished the leads of the semiconductor package on the package holder unit. A mask may be used to cover the plurality of semiconductor packages to expose at least a part of the leads to the polishing member.
    Type: Grant
    Filed: July 22, 1998
    Date of Patent: January 8, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Takeyuki Sato