Patents by Inventor Taki Adachi

Taki Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive for electroless plating and method of producing the same
    Patent number: 6359035
    Abstract: This adhesive for electroless plating can be produced without causing dust explosion and is excellent as an interlaminar resin insulating layer and is obtained by mixing an organic solvent dispersion of cured particles of heat resistant resin soluble or decomposable in an acid or an oxidizing agent with an uncured resin. The dispersion of the cured particles of the heat resistant resin in the organic solvent is obtained by dispersing cured particles formed in the production of heat resistant resin cured particles into the organic solvent without drying, and the uncured resin is a resin becoming hardly soluble in an acid or an oxidizing agent through curing treatment and capable of forming a heat resistant cured resin.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: March 19, 2002
    Assignees: Ibiden Co., Ltd., Sanyo Chemical Industries, Ltd.
    Inventors: Yoshitaka Ono, Taki Adachi