Patents by Inventor Takiharu Yamada

Takiharu Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 9451720
    Abstract: According to one embodiment, electronic device includes casing, circuit board, joint component, and bonding agent. The circuit board is held in the casing, includes first face and second face opposite the first face, and includes a first opening provided on the first face. The joint component includes: insertion portion that is inserted into the first opening; protruding portion that protrudes from the insertion portion toward a side opposite the second face; first end of the protruding portion provided at a side opposite the second face; and support portion extended along the first face. The joint component includes a second opening provided on the first end, extended to the insertion portion, and into which a joint tool is inserted. The bonding agent is provided between the insertion portion and the first opening and between the support portion and the first face, and bonds the circuit board and the joint component.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: September 20, 2016
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takiharu Yamada, Tsutomu Sato
  • ELECTRONIC DEVICE
    Publication number: 20140177184
    Abstract: According to one embodiment, electronic device includes casing, circuit board, joint component, and bonding agent. The circuit board is held in the casing, includes first face and second face opposite the first face, and includes a first opening provided on the first face. The joint component includes: insertion portion that is inserted into the first opening; protruding portion that protrudes from the insertion portion toward a side opposite the second face; first end of the protruding portion provided at a side opposite the second face; and support portion extended along the first face. The joint component includes a second opening provided on the first end, extended to the insertion portion, and into which a joint tool is inserted. The bonding agent is provided between the insertion portion and the first opening and between the support portion and the first face, and bonds the circuit board and the joint component.
    Type: Application
    Filed: August 29, 2013
    Publication date: June 26, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takiharu Yamada, Tsutomu Sato