Patents by Inventor Takio Oono

Takio Oono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing interconnection structure in semiconductor device
    Patent number: 4977105
    Abstract: Conductive layers (5a, 8a) included in a multi-layer structure (30a) are electrically interconnected through an conductive connection wall (13a) provided in a contact hole (12) and contacting the side surface (22) of the multi-layer structure (30a). The upper conductive layer (11a) existing on the multi-layer structure (30a) and the lower conductive layer (3) existing under the multi-layer structure (30a) are electrically interconnected through a conductive film (11b) provided in the contact hole (12). These two interconnections are insulated from each other by an insulating film (18) provided on the connection wall (13a).
    Type: Grant
    Filed: August 9, 1989
    Date of Patent: December 11, 1990
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tatsuo Okamoto, Hideo Kotani, Takio Oono, Kiyoto Watabe, Yasushi Kinoshita, Yoshikazu Nishikawa
  • Interconnection structure in semiconductor device and manufacturing method of the same
    Patent number: 4872050
    Abstract: Conductive layers (5a, 9a) included in a multi-layer structure (30a) are electrically interconnected through a conductive connection wall (13a) provided in a contact hole (12) and contacting the side surface (22) of the multi-layer structure (30a). The upper conductive layer (11a) existing on the multi-layer structure (30a) and the lower conductive layer (3) exisitng under the multi-layer structure (30a) are electrically interconnected through a conductive film (11b) provided in the contact hole (12). These two interconnections are insulated from each other by an insulating film (18) provided on the connection wall (13a).
    Type: Grant
    Filed: March 15, 1988
    Date of Patent: October 3, 1989
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tatsuo Okamoto, Hideo Kotani, Takio Oono, Kiyoto Watabe, Yasushi Kinoshita, Yoshikazu Nishikawa