Abstract: A retardation film composed of a laminated film which comprises a layer A composed of a material having a positive intrinsic birefringence and a deflection temperature under load of Ts(A) and a layer B composed of a material having a negative intrinsic birefringence and a deflection temperature under load of Ts(B), in which a difference between Ts(A) and Ts(B) is 5° C. or more; the retardation film has a stretching temperature T? which causes delaying of a phase after the stretching to a phase before the stretching and a stretching temperature T? which causes hastening of a phase after the stretching to a phase before the stretching, in cases of uniaxially stretching in a direction of an X axis by draw ratio of 1.

Abstract: A method for producing a retardation film comprising the steps of: (a) uniaxially stretching an original film for producing retardation film in one direction at either a temperature T1 or T2; and then (b) uniaxially stretching the film stretched in the step (a) in a direction perpendicular to the above-mentioned direction of stretching at a temperature T2 or T1 different from the above-mentioned temperature, in which the original film for producing retardation film has a characteristic that a phase of linearly polarized light entering vertically into the film plane and having an oscillating surface of an electric vector in an X-Z plane against linearly polarized light entering vertically into the film plane and having an oscillating surface of an electric vector in a Y-Z plane lags by uniaxially stretching in the direction of the X axis at a temperature T1, and leads by uniaxially stretching in the direction of the X axis at a temperature T2 different from the above-mentioned temperature T1, in which the X ax

Abstract: A method for producing a retardation film comprising the steps of: co-extruding or simultaneously casting a thermoplastic resin A and a thermoplastic resin B to obtain a laminated film comprising a layer of the thermoplastic resin A and a layer of the thermoplastic resin B; and uniaxially stretching the laminated film at least twice to cross a molecular orientation axis in the layer of the thermoplastic resin A and a molecular orientation axis in the layer of the thermoplastic resin B each other at almost right angles.

Abstract: A reflection preventing layered product is provided by laminating a high refractive index layer and a low refractive index layer, which has a refractive index lower than that of the high refractive index layer, in that order on a transparent plastic film, directly or through another layer. The low refractive index layer has a surface resistance of 1.0×1010 ohm/square inch or less, a total light remittance of 94% or more, and a refractive index of 1.25-1.37. An optical member provided with the reflection preventing layered product is also provided. This optical member is preferably a polarizing plate with reflection preventing function used for a liquid crystal display. The reflection preventing layered product excels in transparency, mechanical strength, antistaticity, and reflection preventing characteristics.

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, and (III) biphenyl skeleton-containing epoxy resins, as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc.

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, and (III) biphenyl skeleton-containing epoxy resins, as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc.

Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110° C. after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130° C.