Patents by Inventor Taku Iida

Taku Iida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8641438
    Abstract: In an electronic device, a slider is disposed in an insertion opening of a housing of a card edge connector. The slider is movable with an insertion operation of a circuit board into the insertion opening from an initial position before the circuit board is inserted to an insertion completed position where the insertion operation of the circuit board is completed by being pushed by the circuit board. When the slider is at the initial position, terminal projections are supported on a support surface of the slider in a resiliently deformed condition so that contacts are separated from an electrode-formed surface of the circuit board. When the slider is at the insertion completed position, the terminal projections are completely separated from the slider and in a state of applying a spring back force of resilient deformation to the circuit board through the contacts.
    Type: Grant
    Filed: February 23, 2012
    Date of Patent: February 4, 2014
    Assignee: Denso Corporation
    Inventors: Takashi Kamiya, Taku Iida, Yuji Watanabe
  • Publication number: 20130017702
    Abstract: In an electronic device, a slider is disposed in an insertion opening of a housing of a card edge connector. The slider is movable with an insertion operation of a circuit board into the insertion opening from an initial position before the circuit board is inserted to an insertion completed position where the insertion operation of the circuit board is completed by being pushed by the circuit board. When the slider is at the initial position, terminal projections are supported on a support surface of the slider in a resiliently deformed condition so that contacts are separated from an electrode-formed surface of the circuit board. When the slider is at the insertion completed position, the terminal projections are completely separated from the slider and in a state of applying a spring back force of resilient deformation to the circuit board through the contacts.
    Type: Application
    Filed: February 23, 2012
    Publication date: January 17, 2013
    Applicant: DENSO CORPORATION
    Inventors: Takashi KAMIYA, Taku Iida, Yuji Watanabe
  • Patent number: 8187038
    Abstract: A card edge connector for electrically connecting harnesses to contact electrodes that are located in different positions on a surface of an electronic substrate in an insertion direction includes a housing, harness terminals, and relay terminals. The housing defines a substrate insertion hole for receiving the electronic substrate. The harness terminals are separately connected to the harnesses and located in different positions in a height direction perpendicular to the insertion direction. The relay terminals separately connect the harness terminals to the contact electrodes upon insertion of the electronic substrate into the substrate insertion hole.
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: May 29, 2012
    Assignee: DENSO CORPORATION
    Inventors: Takashi Kamiya, Taku Iida, Yoshio Hironaka, Toshihiro Miyake, Masashi Hori
  • Patent number: 7931502
    Abstract: A card edge connector for electrically coupling between contact electrodes on an electric circuit board and harnesses includes: a housing with a board insertion opening; harness terminals coupling with the harnesses; and junction terminals coupling between contact electrodes and harness terminals. The contact electrodes include first and second contact electrodes on both of first and second surfaces of the board. Each first contact electrode is nearer one end of the board than each second contact electrode. The first and second contact electrodes on the first or second surface are aligned alternately along with a width direction of the board. A first or second end of the junction terminal contacting the contact electrode on the first or second surface extends from a first or second inner wall of the board insertion opening to reach a centerline of the board.
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: April 26, 2011
    Assignee: DENSO CORPORATION
    Inventors: Taku Iida, Takashi Kamiya, Yoshio Hironaka, Toshihiro Miyake, Masashi Hori
  • Publication number: 20110021080
    Abstract: A card edge connector for electrically connecting harnesses to contact electrodes that are located in different positions on a surface of an electronic substrate in an insertion direction includes a housing, harness terminals, and relay terminals. The housing defines a substrate insertion hole for receiving the electronic substrate. The harness terminals are separately connected to the harnesses and located in different positions in a height direction perpendicular to the insertion direction. The relay terminals separately connect the harness terminals to the contact electrodes upon insertion of the electronic substrate into the substrate insertion hole.
    Type: Application
    Filed: July 20, 2010
    Publication date: January 27, 2011
    Applicant: DENSO CORPORATION
    Inventors: Takashi Kamiya, Taku Iida, Yoshio Hironaka, Toshihiro Miyake, Masashi Hori
  • Publication number: 20110021078
    Abstract: A card edge connector for electrically coupling between contact electrodes on an electric circuit board and harnesses includes: a housing with a board insertion opening; harness terminals coupling with the harnesses; and junction terminals coupling between contact electrodes and harness terminals. The contact electrodes include first and second contact electrodes on both of first and second surfaces of the board. Each first contact electrode is nearer one end of the board than each second contact electrode. The first and second contact electrodes on the first or second surface are aligned alternately along with a width direction of the board. A first or second end of the junction terminal contacting the contact electrode on the first or second surface extends from a first or second inner wall of the board insertion opening to reach a centerline of the board.
    Type: Application
    Filed: June 8, 2010
    Publication date: January 27, 2011
    Applicant: DENSO CORPORATION
    Inventors: Taku Iida, Takashi Kamiya, Yoshio Hironaka, Toshihiro Miyake, Masashi Hori
  • Patent number: 7748988
    Abstract: A card edge connector includes a housing, a first conductive part, a second conductive part, a connecting element, a first harness, and a second harness. The housing has an insertion hole for receiving an electronic substrate therein. The first conductive part and the second conductive part are disposed in the insertion hole and are configured to come in contact with respective terminals disposed on a surface of the electronic substrate. The connecting element is coupled with the second conductive part and extends in a direction approximately vertical to a planer direction of the electronic substrate so as to be away from the surface of the electronic substrate. The first harness is coupled with the first conductive part and the second harness penetrates a penetrated part of the connecting element.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: July 6, 2010
    Assignees: DENSO CORPORATION, Nippon Soken, Inc.
    Inventors: Masashi Hori, Taku Iida, Yasushi Matsumura, Yoshio Hironaka, Takashi Kamiya, Masashi Hiramatsu, Toshihiro Miyake, Hiroki Kamiya
  • Patent number: 7628654
    Abstract: A card edge connector includes a housing, a first conductive part, a second conductive part, a supporting conductive part, a connecting element, a first harness, and a second harness. The housing has an insertion hole for receiving an electronic substrate therein. The first conductive part and the second conductive part are disposed in the insertion hole and are configured to come in contact with respective terminals disposed on a surface of the electronic substrate. The supporting conductive part is disposed in the housing in such a manner that supporting conductive part is farther away from the surface of the electronic substrate than the first conductive part is. The connecting element couples the second conductive part and the supporting conductive part, the first harness is coupled with the first conductive part, and the second harness is coupled with the supporting conductive part.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: December 8, 2009
    Assignees: Nippon Soken, Inc., DENSO CORPORATION
    Inventors: Masashi Hori, Taku Iida, Yasushi Matsumura, Yoshio Hironaka, Takashi Kamiya, Masashi Hiramatsu, Toshihiro Miyake, Hiroki Kamiya
  • Publication number: 20090191760
    Abstract: A card edge connector includes a housing, a first conductive part, a second conductive part, a supporting conductive part, a connecting element, a first harness, and a second harness. The housing has an insertion hole for receiving an electronic substrate therein. The first conductive part and the second conductive part are disposed in the insertion hole and are configured to come in contact with respective terminals disposed on a surface of the electronic substrate. The supporting conductive part is disposed in the housing in such a manner that supporting conductive part is farther away from the surface of the electronic substrate than the first conductive part is. The connecting element couples the second conductive part and the supporting conductive part, the first harness is coupled with the first conductive part, and the second harness is coupled with the supporting conductive part.
    Type: Application
    Filed: November 20, 2008
    Publication date: July 30, 2009
    Applicants: NIPPON SOKEN, INC., DENSO CORPORATION
    Inventors: Masashi Hori, Taku Iida, Yasushi Matsumura, Yoshio Hironaka, Takashi Kamiya, Masashi Hiramatsu, Toshihiro Miyake, Hiroki Kamiya
  • Publication number: 20090191764
    Abstract: A card edge connector includes a housing, a first conductive part, a second conductive part, a connecting element, a first harness, and a second harness. The housing has an insertion hole for receiving an electronic substrate therein. The first conductive part and the second conductive part are disposed in the insertion hole and are configured to come in contact with respective terminals disposed on a surface of the electronic substrate. The connecting element is coupled with the second conductive part and extends in a direction approximately vertical to a planer direction of the electronic substrate so as to be away from the surface of the electronic substrate. The first harness is coupled with the first conductive part and the second harness penetrates a penetrated part of the connecting element.
    Type: Application
    Filed: November 20, 2008
    Publication date: July 30, 2009
    Applicants: NIPPON SOKEN, INC., DENSO CORPORATION
    Inventors: Masashi Hori, Taku Iida, Yasushi Matsumura, Yoshio Hironaka, Takashi Kamiya, Masashi Hiramatsu, Toshihiro Miyake, Hiroki Kamiya
  • Patent number: 7144275
    Abstract: A circuit board supporting electronic components mounted thereon is housed in a casing. The casing has a joint hole defined therein, and a connector is inserted in the joint hole with a water-resistant seal placed in a gap between the connector and edges of the casing which define the joint hole. The casing is of a trapezoidal shape and has a pair of parallel sides spaced from each other by a distance, the parallel sides having respective lengths greater than the distance between the parallel sides. The casing has a tooth as a stop which has a tip end held against the connector at a position in which the casing and the connector closely confront each other in or near a region of at least one of the parallel sides which is sealed by the water-resistant seal.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: December 5, 2006
    Assignee: Denso Corporation
    Inventor: Taku Iida
  • Publication number: 20060046535
    Abstract: A circuit board supporting electronic components mounted thereon is housed in a casing. The casing has a joint hole defined therein, and a connector is inserted in the joint hole with a water-resistant seal placed in a gap between the connector and edges of the casing which define the joint hole. The casing is of a trapezoidal shape and has a pair of parallel sides spaced from each other by a distance, the parallel sides having respective lengths greater than the distance between the parallel sides. The casing has a tooth as a stop which has a tip end held against the connector at a position in which the casing and the connector closely confront each other in or near a region of at least one of the parallel sides which is sealed by the water-resistant seal.
    Type: Application
    Filed: August 29, 2005
    Publication date: March 2, 2006
    Applicant: Denso Corporation
    Inventor: Taku Iida
  • Patent number: 6782522
    Abstract: A semiconductor electronic part, having a lot of bumps allocated in a checkered pattern, is solder-mounted on a multilayer circuit board. In the multilayer circuit board, a first wiring pattern linked with a first land is finer than a second wiring pattern linked with a second land. Only one first wiring pattern is passable between lands. The second lands are allocated in the outmost line on the uppermost layer of the multilayer circuit board. In the semiconductor electronic part, bumps connectable with the second lands are allocated in the outermost line.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: August 24, 2004
    Assignee: Denso Corporation
    Inventors: Taku Iida, Satoru Kawamoto, Toshiaki Yagura
  • Publication number: 20030159122
    Abstract: A semiconductor electronic part, having a lot of bumps allocated in a checkered pattern, is solder-mounted on a multilayer circuit board. In the multilayer circuit board, a first wiring pattern linked with a first land is finer than a second wiring pattern linked with a second land. Only one first wiring pattern is passable between lands. The second lands are allocated in the outmost line on the uppermost layer of the multilayer circuit board. In the semiconductor electronic part, bumps connectable with the second lands are allocated in the outermost line.
    Type: Application
    Filed: November 12, 2002
    Publication date: August 21, 2003
    Inventors: Taku Iida, Satoru Kawamoto, Toshiaki Yagura
  • Publication number: 20020186551
    Abstract: In an electronic control unit for controlling operation of various devices, a circuit board carrying electronic components thereon and a connector for connecting the control unit to outside devices are electrically connected through a flexible printed-circuit sheet. A casing of the control unit is designed to contain therein a circuit board selected from variously sized circuit boards. The circuit board may be functionally divided into a certain number of circuit boards. Some varieties of each functionally divided circuit board are prepared, and circuit boards meeting a particular requirement are selected from the varieties and used in a control unit. Thus, the electronic control units meeting various requirements are efficiently and economically manufactured.
    Type: Application
    Filed: July 24, 2002
    Publication date: December 12, 2002
    Inventors: Toru Murowaki, Toshiaki Yagura, Fujio Sahara, Kazuya Sanada, Taku Iida, Minoru Hozuka
  • Patent number: 6466447
    Abstract: In an electronic control unit for controlling operation of various devices, a circuit board carrying electronic components thereon and a connector for connecting the control unit to outside devices are electrically connected through a flexible printed-circuit sheet. A casing of the control unit is designed to contain therein a circuit board selected from variously sized circuit boards. The circuit board may be functionally divided into a certain number of circuit boards. Some varieties of each functionally divided circuit board are prepared, and circuit boards meeting a particular requirement are selected from the varieties and used in a control unit. Thus, the electronic control units meeting various requirements are efficiently and economically manufactured.
    Type: Grant
    Filed: January 24, 2001
    Date of Patent: October 15, 2002
    Assignee: Denso Corporation
    Inventors: Toru Murowaki, Toshiaki Yagura, Fujio Sahara, Kazuya Sanada, Taku Iida, Minoru Hozuka
  • Patent number: 6341066
    Abstract: In an electronic control unit, a drive element liable to generate heat and a control processing element liable to be affected by heat are respectively mounted on a drive circuit board and a control circuit board different from each other, and the two boards are connected to each other by a flexible printed circuit board. The bonding portion of the flexible printed circuit board to the control circuit board is a back side portion of a connector mounted on the control circuit board at the same side as the control processing element. Therefore, heat generated by the drive element is suppressed from being transferred to the control processing element without causing layout hindrances.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: January 22, 2002
    Assignee: Denso Corporation
    Inventors: Toru Murowaki, Toshiaki Yagura, Yoshitaka Nakano, Taku Iida
  • Publication number: 20010017766
    Abstract: In an electronic control unit for controlling operation of various devices, a circuit board carrying electronic components thereon and a connector for connecting the control unit to outside devices are electrically connected through a flexible printed-circuit sheet. A casing of the control unit is designed to contain therein a circuit board selected from variously sized circuit boards. The circuit board may be functionally divided into a certain number of circuit boards. Some varieties of each functionally divided circuit board are prepared, and circuit boards meeting a particular requirement are selected from the varieties and used in a control unit. Thus, the electronic control units meeting various requirements are efficiently and economically manufactured.
    Type: Application
    Filed: January 24, 2001
    Publication date: August 30, 2001
    Inventors: Toru Murowaki, Toshiaki Yagura, Fujio Sahara, Kazuya Sanada, Taku Iida, Minoru Hozuka