Abstract: A semiconductor device has an LCD driver formed over a silicon substrate. The LCD driver is arranged in a source output circuit region and includes two or more source output cells for generating data signals and two or more output pads for receiving the data signals and sending them to the outside. The two or more pads are arranged over the silicon substrate along a row direction, and the two or more source output cells are arranged in two rows and N columns along the row direction. A source output cell arranged at an Nth column of a first row is electrically coupled to a (2N?1)th output pad. Also, a source output cell CS1 arranged at the Nth column of a second row is electrically coupled to a (2N)th output pad. The arrangement allows for a reduced chip size.

Abstract: A semiconductor device has an LCD driver formed over a silicon substrate. The LCD driver is arranged in a source output circuit region and includes two or more source output cells for generating data signals and two or more output pads for receiving the data signals and sending them to the outside. The two or more pads are arranged over the silicon substrate along a row direction, and the two or more source output cells are arranged in two rows and N columns along the row direction. A source output cell arranged at an Nth column of a first row is electrically coupled to a (2N?1)th output pad. Also, a source output cell CS1 arranged at the Nth column of a second row is electrically coupled to a (2N)th output pad. The arrangement allows for a reduced chip size.