Patents by Inventor Taku KIKUCHI
Taku KIKUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10164603Abstract: An elastic wave device includes an elastic wave element that includes first support layers provided on a piezoelectric substrate, a second support layer provided on the piezoelectric substrate so as to surround the first support layers when viewed in a plan view, and a cover member provided on the first support layers and the second support layer, a mounting substrate on which the elastic wave element is mounted, and a mold resin provided on the mounting substrate and sealing the elastic wave element. A thickness of each of the first support layers is less than a thickness of the second support layer. The cover member convexly curves towards the piezoelectric substrate so as to be spaced away from the mounting substrate. A space between the mounting substrate and the cover member is filled with the mold resin.Type: GrantFiled: August 28, 2017Date of Patent: December 25, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Daisuke Sekiya, Taku Kikuchi, Yasuhiko Hirano, Hiroshi Tanaka
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Patent number: 9998091Abstract: An elastic wave device includes a dielectric film on a piezoelectric substrate, an IDT electrode including first and second comb electrodes on the dielectric film, first and second wiring electrodes electrically connected to the first and second comb electrodes, wherein the first comb electrode and the second comb electrode each include electrode fingers and a busbar in contact with the electrode fingers. An electrical conductivity of the piezoelectric substrate is higher than the electrical conductivity of the dielectric film. At least one of the first wiring electrode, the second wiring electrode, the busbar of the first comb electrode, and the busbar of the second comb electrode includes a portion that is in direct contact with the piezoelectric substrate.Type: GrantFiled: June 8, 2016Date of Patent: June 12, 2018Assignee: Murata Manufacturing Co., Ltd.Inventors: Taku Kikuchi, Daisuke Fukuda, Yasumasa Taniguchi, Masakazu Mimura
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Publication number: 20180097501Abstract: An acoustic wave device includes a piezoelectric substrate including an electrode formation surface, and an IDT electrode provided on the electrode formation surface. The IDT electrode includes a close contact layer located on the electrode formation surface, and a main electrode layer located on the close contact layer. The close contact layer includes first and second layers that respectively include first and second lateral surfaces. An area of a surface of the second layer that is in close contact with the main electrode layer is smaller than an area of a surface of the first layer that is in close contact with the piezoelectric substrate. An inclination angle of the second lateral surface is smaller than an inclination angle of the first lateral surface.Type: ApplicationFiled: December 6, 2017Publication date: April 5, 2018Inventors: Taku Kikuchi, Chihiro Konoma, Masashi Tsubokawa, Ryo Nakagawa
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Publication number: 20180013404Abstract: In an elastic wave filter apparatus, IDT electrodes and first and second electrode lands are provided on a first main surface of a piezoelectric substrate. The piezoelectric substrate, a supporting layer, and a covering member define a hollow portion. A signal terminal, a ground terminal, and a heat diffusion layer are provided on a second main surface of the piezoelectric substrate. The first and second electrode lands are electrically connected by first and second connection electrodes to the signal terminal and the ground terminal, respectively. The heat diffusion layer is provided at a position where the heat diffusion layer overlaps at least a portion of the IDT electrodes across the piezoelectric substrate.Type: ApplicationFiled: September 22, 2017Publication date: January 11, 2018Inventors: Koichiro KAWASAKI, Taku KIKUCHI
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Publication number: 20170358728Abstract: An elastic wave device includes an elastic wave element that includes first support layers provided on a piezoelectric substrate, a second support layer provided on the piezoelectric substrate so as to surround the first support layers when viewed in a plan view, and a cover member provided on the first support layers and the second support layer, a mounting substrate on which the elastic wave element is mounted, and a mold resin provided on the mounting substrate and sealing the elastic wave element. A thickness of each of the first support layers is less than a thickness of the second support layer. The cover member convexly curves towards the piezoelectric substrate so as to be spaced away from the mounting substrate. A space between the mounting substrate and the cover member is filled with the mold resin.Type: ApplicationFiled: August 28, 2017Publication date: December 14, 2017Inventors: Daisuke SEKIYA, Taku KIKUCHI, Yasuhiko HIRANO, Hiroshi TANAKA
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Publication number: 20170273183Abstract: An electronic component includes an electronic component element including first and second main surfaces, a heat-dissipation accelerating member on the first main surface, a sealing resin layer sealing the electronic component element, and a shielding member provided on the sealing resin layer and electrically connected to the heat-dissipation accelerating member. The heat-dissipation accelerating member includes fourth and fifth main surfaces. The electronic component includes a connecting member disposed on the fifth main surface of the heat-dissipation accelerating member and electrically connecting at least one portion of the heat-dissipation accelerating member and the shielding member. The connecting member has a higher thermal conductivity than the sealing resin layer. The contact area between the heat-dissipation accelerating member and the connecting member is smaller than the area of the fifth main surface.Type: ApplicationFiled: June 1, 2017Publication date: September 21, 2017Inventors: Koichiro KAWASAKI, Taku KIKUCHI, Takashi KITAHARA, Hiroki NOTO
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Publication number: 20170237406Abstract: An elastic wave device includes IDT electrodes on a first main surface of a piezoelectric substrate and a heat dissipating film on a second main surface and including a pair of opposing main surfaces and side surfaces connecting the pair of main surfaces. At least a portion of the side surfaces of the heat dissipating film is located in an inner side portion relative to the outer circumference of the second main surface of the piezoelectric substrate on an arbitrary cross section along a direction connecting the pair of main surfaces of the heat dissipating film.Type: ApplicationFiled: May 4, 2017Publication date: August 17, 2017Inventors: Daisuke SEKIYA, Taku KIKUCHI, Hiroshi TANAKA
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Publication number: 20170155372Abstract: An elastic wave device includes interdigital transducer electrodes on a piezoelectric substrate and wires electrically connected to the interdigital transducer electrodes. The wires include a first wire and a second wire. The device further includes an interlayer insulating film made from an inorganic dielectric material and covering a portion of the first wire. A portion of the second wire bridges a portion of the first wire with the interlayer insulating film provided therebetween. In a region, in a bridged area, where the second wire extends from a region on an outer side portion of the interlayer insulating film to above the interlayer insulating film, first auxiliary wire electrodes are provided on the piezoelectric substrate, such that when viewed in plan view, the first auxiliary wire electrodes at least partially overlap with the second wire and extend to within the interlayer insulating film.Type: ApplicationFiled: February 13, 2017Publication date: June 1, 2017Inventors: Taku KIKUCHI, Akira MICHIGAMI, Daisuke SEKIYA, Masashi TSUBOKAWA
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Publication number: 20170093366Abstract: An elastic wave device includes a piezoelectric substrate, functional electrodes on the piezoelectric substrate, a support layer on the piezoelectric substrate with a frame shape surrounding the functional electrodes, a cover member on the support layer to seal an opening of the support layer, the cover member including a first main surface facing the support layer, and a second main surface opposite to the first main surface. Recesses are located in the cover member and are open to the second main surface. Via holes extend through the support layer and to bottom surfaces of the recesses of the cover member, the via holes each including an opening that is open to the bottom surface. The area of the opening of each of the via holes is not more than the area of the bottom surface of the corresponding recess of the cover member. First via conductor portions are provided in the via holes and second via conductor portions are provided in the recesses of the cover member.Type: ApplicationFiled: December 13, 2016Publication date: March 30, 2017Applicant: Murata Manufacturing Co., Ltd.Inventors: Taku Kikuchi, Seiji KAI, Motoji TSUDA, Mitsuyoshi HIRA
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Patent number: 9584088Abstract: A method for manufacturing an acoustic wave device with an excellent frequency-temperature profile is performed such that the acoustic wave device produced includes a piezoelectric substrate, an IDT electrode located on the piezoelectric substrate, and a dielectric film mainly including Si and O and arranged on the piezoelectric substrate to cover the IDT electrode. The dielectric film is formed by sputtering in a sputtering gas containing H2O.Type: GrantFiled: October 3, 2012Date of Patent: February 28, 2017Assignee: Murata Manufacturing Co., Ltd.Inventors: Taku Kikuchi, Hideaki Takahashi
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Publication number: 20170033763Abstract: An electronic component includes a functional electrode provided on a first substrate that has a rectangular or substantially rectangular plate shape and a support layer including resin that surrounds the functional electrode. A cover member closes an opening of the support layer. A via conductor penetrating the support layer is provided in at least one corner portion of the support layer. A resin reinforcing portion having the same height or substantially the same height as the support layer is provided in an outer side portion of the corner portion provided with the via conductor.Type: ApplicationFiled: October 11, 2016Publication date: February 2, 2017Inventors: Mitsuyoshi HIRA, Taku KIKUCHI
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Publication number: 20160285430Abstract: An elastic wave device includes a dielectric film on a piezoelectric substrate, an IDT electrode including first and second comb electrodes on the dielectric film, first and second wiring electrodes electrically connected to the first and second comb electrodes, wherein the first comb electrode and the second comb electrode each include electrode fingers and a busbar in contact with the electrode fingers. An electrical conductivity of the piezoelectric substrate is higher than the electrical conductivity of the dielectric film. At least one of the first wiring electrode, the second wiring electrode, the busbar of the first comb electrode, and the busbar of the second comb electrode includes a portion that is in direct contact with the piezoelectric substrate.Type: ApplicationFiled: June 8, 2016Publication date: September 29, 2016Inventors: Taku KIKUCHI, Daisuke FUKUDA, Yasumasa TANIGUCHI, Masakazu MIMURA
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Publication number: 20160277003Abstract: An elastic wave device includes a multilayer film provided on a support substrate and including a piezoelectric thin film and a layer other than the piezoelectric thin film, an interdigital transducer electrode provided on one surface of the piezoelectric thin film, and an external connection terminal electrically connected to the interdigital transducer electrode. In a plan view, the multilayer film is partially absent or omitted in a region outside a region where the interdigital transducer electrode is provided, and the elastic wave device further includes a first insulating layer provided on the support substrate in at least a portion of a region where the multilayer film is absent or omitted.Type: ApplicationFiled: June 2, 2016Publication date: September 22, 2016Inventors: Taku KIKUCHI, Shin SAIJO, Hisashi YAMAZAKI, Masahiro FUKUSHIMA, Yuji MIWA
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Publication number: 20160190423Abstract: In an elastic wave device, IDT electrodes on a piezoelectric substrate are electrically connected to wiring electrodes. A support member covers at least portions of the wiring electrodes. Through-holes in the support member expose upper surfaces of the wiring electrodes and have conductive layers filled therein. The wiring electrodes each have a multilayer structure in which a refractory metal film having a melting point of 900° C. or higher, a diffusion preventive film, and an Al or Al-alloy film are laminated successively from the upper surface side.Type: ApplicationFiled: March 9, 2016Publication date: June 30, 2016Inventors: Masashi TSUBOKAWA, Taku KIKUCHI
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Publication number: 20160156331Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode, wiring, a pad, an under bump metal, a first dielectric layer, and a second dielectric layer. At least a portion of the IDT electrode includes a first electrically conductive film, at least a portion of the wiring includes a multilayer body including the first electrically conductive film and a second electrically conductive film, and at least a portion of the pad includes the second electrically conductive film. The second dielectric layer covers the region other than the contact region between the second electrically conductive film and the under bump metal. Consequently, the second electrically conductive film is covered with the second dielectric layer and the under bump metal and is not exposed to air.Type: ApplicationFiled: February 3, 2016Publication date: June 2, 2016Inventors: Yuji MIWA, Hijiri SUMII, Junpei YASUDA, Taku KIKUCHI, Hisashi YAMAZAKI
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Publication number: 20160079957Abstract: A surface acoustic wave device includes a piezoelectric substrate, a dielectric film, IDT electrodes, and a resin member. The surface acoustic wave device includes a resin contact region where the piezoelectric substrate and the resin member are in direct contact with each other. The resin contact region has a shape surrounding the IDT electrodes. Because the resin member exhibits a strong adhesion force with respect to the piezoelectric substrate, peeling-off between the piezoelectric substrate and the resin member is significantly reduced or prevented, and an airtight condition is maintained in the interior of the surface acoustic wave device.Type: ApplicationFiled: November 16, 2015Publication date: March 17, 2016Inventors: Taku KIKUCHI, Masahiro FUKUSHIMA
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Patent number: 9130539Abstract: An elastic wave device includes a first elastic wave element, a second elastic wave element, and a first substrate. The first elastic wave element includes a first piezoelectric substrate. The second elastic wave element includes a second piezoelectric substrate. The second piezoelectric substrate is stacked on the first piezoelectric substrate. A coefficient of linear expansion of the second piezoelectric substrate is greater than a coefficient of linear expansion of the first piezoelectric substrate. The first substrate is bonded to the second piezoelectric substrate. A coefficient of linear expansion of the first substrate is lower than the coefficient of linear expansion of the second piezoelectric substrate.Type: GrantFiled: January 5, 2015Date of Patent: September 8, 2015Assignee: Murata Manufacturing Co. Ltd.Inventors: Taku Kikuchi, Hisashi Yamazaki
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Publication number: 20150109071Abstract: An elastic wave device includes a first elastic wave element, a second elastic wave element, and a first substrate. The first elastic wave element includes a first piezoelectric substrate. The second elastic wave element includes a second piezoelectric substrate. The second piezoelectric substrate is stacked on the first piezoelectric substrate. A coefficient of linear expansion of the second piezoelectric substrate is greater than a coefficient of linear expansion of the first piezoelectric substrate. The first substrate is bonded to the second piezoelectric substrate. A coefficient of linear expansion of the first substrate is lower than the coefficient of linear expansion of the second piezoelectric substrate.Type: ApplicationFiled: January 5, 2015Publication date: April 23, 2015Inventors: Taku KIKUCHI, Hisashi YAMAZAKI
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Patent number: 8575818Abstract: A surface acoustic wave element has a small energy loss and when it is used in a filter device, suppresses a spurious component occurring near the resonant frequency of a principal response and improves the frequency characteristic near the pass band of the filter device. The surface acoustic wave element includes a piezoelectric substrate, a comb-shaped electrode, and an insulating film. The comb-shaped electrode is disposed on the piezoelectric substrate. The insulating film is disposed so as to cover the piezoelectric substrate and the comb-shaped electrode. Where ? is the wavelength of an elastic wave that propagates in the piezoelectric substrate and h is the difference between the maximum and minimum values of a thickness dimension from the top surface of the piezoelectric substrate to the top surface of the insulating film, 0.01?h/??0.03 is satisfied.Type: GrantFiled: August 29, 2011Date of Patent: November 5, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Hisashi Yamazaki, Hideaki Takahashi, Taku Kikuchi
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Publication number: 20110309719Abstract: A surface acoustic wave element has a small energy loss and when it is used in a filter device, suppresses a spurious component occurring near the resonant frequency of a principal response and improves the frequency characteristic near the pass band of the filter device. The surface acoustic wave element includes a piezoelectric substrate, a comb-shaped electrode, and an insulating film. The comb-shaped electrode is disposed on the piezoelectric substrate. The insulating film is disposed so as to cover the piezoelectric substrate and the comb-shaped electrode. Where ? is the wavelength of an elastic wave that propagates in the piezoelectric substrate and h is the difference between the maximum and minimum values of a thickness dimension from the top surface of the piezoelectric substrate to the top surface of the insulating film, 0.01?h/??0.03 is satisfied.Type: ApplicationFiled: August 29, 2011Publication date: December 22, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Hisashi YAMAZAKI, Hideaki TAKAHASHI, Taku KIKUCHI