Patents by Inventor Taku Konno

Taku Konno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9134608
    Abstract: A positive photosensitive resin composition including: (a) a resin capable of being dissolved in an aqueous alkaline solution; (b) a compound having two or more oxetanyl groups; (c) a diazonaphthoquinone compound; and (d) a solvent.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: September 15, 2015
    Assignee: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
    Inventors: Masashi Kotani, Masayuki Ooe, Taku Konno, Tomonori Minegishi, Keishi Ono
  • Patent number: 8614051
    Abstract: A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: December 24, 2013
    Assignee: Hitachi Chemical Dupont Microsystems, Ltd.
    Inventors: Tomonori Minegishi, Rika Nogita, Dai Kawasaki, Keiko Suzuki, Taku Konno
  • Publication number: 20120328856
    Abstract: A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).
    Type: Application
    Filed: June 28, 2012
    Publication date: December 27, 2012
    Applicant: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
    Inventors: Tomonori MINEGISHI, Rika NOGITA, Dai KAWASAKI, Keiko SUZUKI, Taku KONNO
  • Publication number: 20120288798
    Abstract: A positive photosensitive resin composition including: (a) a resin capable of being dissolved in an aqueous alkaline solution; (b) a compound having two or more oxetanyl groups; (c) a diazonaphthoquinone compound; and (d) a solvent.
    Type: Application
    Filed: January 18, 2011
    Publication date: November 15, 2012
    Applicant: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
    Inventors: Masashi Kotani, Masayuki Ooe, Taku Konno, Tomonori Minegishi, Keishi Ono
  • Patent number: 8304160
    Abstract: A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).
    Type: Grant
    Filed: April 13, 2010
    Date of Patent: November 6, 2012
    Assignee: Hitachi Chemical Dupont Microsystems, Ltd.
    Inventors: Tomonori Minegishi, Rika Nogita, Dai Kawasaki, Keiko Suzuki, Taku Konno
  • Publication number: 20100260983
    Abstract: A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).
    Type: Application
    Filed: April 13, 2010
    Publication date: October 14, 2010
    Applicant: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
    Inventors: Tomonori MINEGISHI, Rika NOGITA, Dai KAWASAKI, Keiko SUZUKI, Taku KONNO