Patents by Inventor Taku Maruo

Taku Maruo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing device and method of polishing semiconductor wafer
    Patent number: 9550273
    Abstract: According to an embodiment, a polishing device includes a stage, a polishing unit, and a strain measuring unit. The stage is rotatable together with a semiconductor wafer. The polishing unit polishes the rear surface of the semiconductor wafer mounted on the stage beside the stage. The strain measuring unit measures a first strain that is a radial-direction strain of the semiconductor wafer and a second strain that is a circumferential-direction strain of the semiconductor wafer during the polishing.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: January 24, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shiguma Kato, Yuichiro Fujiyama, Takumi Takahashi, Taku Maruo
  • POLISHING DEVICE AND METHOD OF POLISHING SEMICONDUCTOR WAFER
    Publication number: 20160207165
    Abstract: According to an embodiment, a polishing device includes a stage, a polishing unit, and a strain measuring unit. The stage is rotatable together with a semiconductor wafer. The polishing unit polishes the rear surface of the semiconductor wafer mounted on the stage beside the stage. The strain measuring unit measures a first strain that is a radial-direction strain of the semiconductor wafer and a second strain that is a circumferential-direction strain of the semiconductor wafer during the polishing.
    Type: Application
    Filed: June 11, 2015
    Publication date: July 21, 2016
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Shiguma KATO, Yuichiro Fujiyama, Takumi Takahashi, Taku Maruo