Abstract: An R-T-B system rare earth sintered magnet having a high mechanical strength and excellent corrosion resistance is provided. The R-T-B system rare earth sintered magnet of the present invention comprises a sintered body comprising a main phase consisting of an R2T14B phase where R represents one or more rare earth elements and T represents one or more transition metal elements essentially containing Fe, or Fe and Co, and a grain boundary phase containing a higher amount of R than the above described main phase, wherein the surface of the above described sintered body is partially covered with a carbon compound layer. In the R-T-B system rare earth sintered magnet of the present invention, the area ratio of the partial surface of the above described sintered body covered with the above described carbon compound layer to the entire surface thereof is preferably between 10% and 90%.

Abstract: An electronic component according to an embodiment of the present invention comprises a resonator, a mounting substrate, and an electric connection member. The resonator has a terminal. The mounting substrate has a first principal surface, a second principal surface opposite to the first principal surface, and an electrode provided in a hole intersecting with the second principal surface. The electric connection member electrically connects the electrode of the mounting substrate to the terminal of the resonator. One end of the electrode of the mounting substrate is provided along the second principal surface. The electric connection member is provided on the one end of the electrode of the mounting substrate. The resonator is provided on the electric connection member so that the terminal of the resonator is in contact with the electric connection member.

Abstract: A thin-film piezoelectric resonator including a piezoelectric thin film having piezoelectric characteristic, and an upper electrode and a lower electrode arranged on opposite surfaces of the piezoelectric thin film for applying an excitation voltage to the piezoelectric thin film, wherein: each of the upper electrode and the lower electrode includes a resonant portion, and a lead-out portion; and the electrode thickness of at least one part of the lead-out portion in at least one of the upper electrode and the lower electrode is larger than the electrode thickness of the resonant portion formed to be continued from the lead-out portion.

Abstract: An electronic component according to an embodiment of the present invention comprises a resonator, a mounting substrate, and an electric connection member. The resonator has a terminal. The mounting substrate has a first principal surface, a second principal surface opposite to the first principal surface, and an electrode provided in a hole intersecting with the second principal surface. The electric connection member electrically connects the electrode of the mounting substrate to the terminal of the resonator. One end of the electrode of the mounting substrate is provided along the second principal surface. The electric connection member is provided on the one end of the electrode of the mounting substrate. The resonator is provided on the electric connection member so that the terminal of the resonator is in contact with the electric connection member.

Abstract: An R-T-B system rare earth sintered magnet having a high mechanical strength and excellent corrosion resistance is provided. The R-T-B system rare earth sintered magnet of the present invention comprises a sintered body comprising a main phase consisting of an R2T14B phase where R represents one or more rare earth elements and T represents one or more transition metal elements essentially containing Fe, or Fe and Co, and a grain boundary phase containing a higher amount of R than the above described main phase, wherein the surface of the above described sintered body is partially covered with a carbon compound layer. In the R-T-B system rare earth sintered magnet of the present invention, the area ratio of the partial surface of the above described sintered body covered with the above described carbon compound layer to the entire surface thereof is preferably between 10% and 90%.

Abstract: The EL device of the present invention has a structure in which a first electrode, a first insulator layer, an electroluminescence-producing light emitting layer, a second insulator layer, and a second electrode layer are successively stacked on an electrical insulating substrate. At least one of the first insulator layer and the second insulator layer has as a main component barium titanate and in addition 0.1 to 3 mole % magnesium oxide, 0.05 to 1.0 mole % manganese oxide, no more than 1 mole % yttrium oxide, 2 to 12 mole % of barium oxide and calcium oxide, and 2-12 mole % silicon oxide.

Abstract: The invention aims to provide a method for preparing a composite substrate of substrate/electrode/dielectric layer structure having a thick-film dielectric layer with a smooth surface using a sol-gel solution of high concentration capable of forming a film to a substantial thickness without generating cracks, the composite substrate and an EL device using the same. The object is attained by a method for preparing a composite substrate including in order an electrically insulating substrate, an electrode and an insulator layer formed thereon by a thick film technique, wherein a thin-film insulator layer is formed on the insulator layer by applying to the insulator layer a sol-gel solution obtained by dissolving a metal compound in a diol represented by OH(CH2)nOH as a solvent, followed by drying and firing; the composite substrate and an EL device using the same.

Abstract: The invention aims to provide a composite substrate which suppresses reaction of a substrate with a dielectric layer that can otherwise cause degradation of the dielectric layer and which can be sintered at high temperature while minimizing the occurrence of cracks in the dielectric layer, and an EL device using the composite substrate. The object is attained by a composite substrate in which an electrode and a dielectric layer are successively formed on an electrically insulating substrate, the substrate having a coefficient of thermal expansion of 10-20 ppm/K, and an EL device using the composite substrate.

Abstract: A piezoelectric resonant filter comprises a chip having a plurality of thin-film piezoelectric resonators, and a mounting substrate on which the chip is mounted. The chip is mounted on the mounting substrate by flip chip bonding. A plurality of bumps provided on the chip are bonded to a plurality of conductors on the mounting substrate by interdiffusion between atoms, in a solid phase, of the respective metals of which the bumps and the conductors are made, without involving melting of the respective metals of which the bumps and the conductors are made. The chip has a series resonator and a parallel resonator each formed of a thin-film piezoelectric resonator. These resonators constitute a ladder filter circuit.

Abstract: A thin-film piezoelectric resonator including a piezoelectric thin film having piezoelectric characteristic, and an upper electrode and a lower electrode arranged on opposite surfaces of the piezoelectric thin film for applying an excitation voltage to the piezoelectric thin film, wherein: each of the upper electrode and the lower electrode includes a resonant portion, and a lead-out portion; and the electrode thickness of at least one part of the lead-out portion in at least one of the upper electrode and the lower electrode is larger than the electrode thickness of the resonant portion formed to be continued from the lead-out portion.

Abstract: A composite substrate in which the surface of the insulating layer is not influenced by the electrode layer and which requires neither a grinding process nor a sol-gel process, is easy to produce and can provide a thin-film EL device having a high display quality when used therein; a thin-film EL device using the substrate; and a production process for the device. The thin-film EL device is produced by forming a luminescent layer, other insulating layer and other electrode layer successively on a composite substrate comprising a substrate; an electrode layer embedded in the substrate in such a manner that the electrode layer and the substrate are in one plane; and an insulating layer formed on the surface of a composite comprising the substrate and the electrode layer.

Abstract: The invention aims to provide a method for preparing a composite substrate, which prevents an insulating layer surface from becoming rugged under the influence of an electrode layer, and eliminates a polishing step, whereby the composite substrate is easy to manufacture and ensures high display quality when applied to thin-film light emitting devices, the composite substrate and an thin-film EL device using the same. The object is attained by a method for preparing a composite substrate by successively applying an electrode paste and an insulator paste onto an electrically insulating substrate as thick films to form a composite substrate precursor having a green electrode layer and a green insulator layer laminated, subjecting the precursor to pressing treatment for smoothing its surface, and firing; the composite substrate and an EL device using the same.

Abstract: The invention aims to provide a method for preparing a composite substrate which has minimized surface asperities on a dielectric layer, which are otherwise developed under the influence of an electrode layer, unevenness upon printing, and surface roughness inherent to thick-film dielectrics, which eliminates a need for a polishing step, which is easy to manufacture, and which is applicable to the fabrication of a thin-film light-emitting device of high display quality, as well as the resulting composite substrate and a thin-film EL device using the same.

Abstract: A piezoelectric resonant filter comprises a chip having a plurality of thin-film piezoelectric resonators, and a mounting substrate on which the chip is mounted. The chip is mounted on the mounting substrate by flip chip bonding. A plurality of bumps provided on the chip are bonded to a plurality of conductors on the mounting substrate by interdiffusion between atoms, in a solid phase, of the respective metals of which the bumps and the conductors are made, without involving melting of the respective metals of which the bumps and the conductors are made. The chip has a series resonator and a parallel resonator each formed of a thin-film piezoelectric resonator. These resonators constitute a ladder filter circuit.

Abstract: A composite substrate in which the surface of the insulating layer is not influenced by the electrode layer and which requires neither a grinding process nor a sol-gel process, is easy to produce and can provide a thin-film EL device having a high display quality when used therein; a thin-film EL device using the substrate; and a production process for the device. The thin-film EL device is produced by forming a luminescent layer, other insulating layer and other electrode layer successively on a composite substrate comprising a substrate; an electrode layer embedded in the substrate in such a manner that the electrode layer and the substrate are in one plane; and an insulating layer formed on the surface of a composite comprising the substrate and the electrode layer.

Abstract: A composite substrate in which the surface of the insulating layer is not influenced by the electrode layer and which requires neither a grinding process nor a sol-gel process, is easy to produce and can provide a thin-film EL device having a high display quality when used therein; a thin-film EL device using the substrate; and a production process for the device. The thin-film EL device is produced by forming a luminescent layer, other insulating layer and other electrode layer successively on a composite substrate comprising a substrate; an electrode layer embedded in the substrate in such a manner that the electrode layer and the substrate are in one plane; and an insulating layer formed on the surface of a composite comprising the substrate and the electrode layer.

Abstract: The invention aims to provide a method for preparing a composite substrate of substrate/electrode/dielectric layer structure having a thick-film dielectric layer with a smooth surface using a sol-gel solution of high concentration capable of forming a film to a substantial thickness without generating cracks, the composite substrate and an EL device using the same. The object is attained by a method for preparing a composite substrate including in order an electrically insulating substrate, an electrode and an insulator layer formed thereon by a thick film technique, wherein a thin-film insulator layer is formed on the insulator layer by applying to the insulator layer a sol-gel solution obtained by dissolving a metal compound in a diol represented by OH(CH2)nOH as a solvent, followed by drying and firing; the composite substrate and an EL device using the same.

Abstract: The invention aims to provide a method for preparing a composite substrate, which prevents an insulating layer surface from becoming rugged under the influence of an electrode layer, and eliminates a polishing step, whereby the composite substrate is easy to manufacture and ensures high display quality when applied to thin-film light emitting devices, the composite substrate and an thin-film EL device using the same. The object is attained by a method for preparing a composite substrate by successively applying an electrode paste and an insulator paste onto an electrically insulating substrate as thick films to form a composite substrate precursor having a green electrode layer and a green insulator layer laminated, subjecting the precursor to pressing treatment for smoothing its surface, and firing; the composite substrate and an EL device using the same.

Abstract: The invention aims to provide a method for preparing a composite substrate which has minimized surface asperities on a dielectric layer, which are otherwise developed under the influence of an electrode layer, unevenness upon printing, and surface roughness inherent to thick-film dielectrics, which eliminates a need for a polishing step, which is easy to manufacture, and which is applicable to the fabrication of a thin-film light-emitting device of high display quality, as well as the resulting composite substrate and a thin-film EL device using the same.

Abstract: The invention aims to provide a composite substrate which suppresses reaction of a substrate with a dielectric layer that can otherwise cause degradation of the dielectric layer and which can be sintered at high temperature while minimizing the occurrence of cracks in the dielectric layer, and an EL device using the composite substrate. The object is attained by a composite substrate in which an electrode and a dielectric layer are successively formed on an electrically insulating substrate, the substrate having a coefficient of thermal expansion of 10-20 ppm/K, and an EL device using the composite substrate.