Patents by Inventor Taku Yanagihashi

Taku Yanagihashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connector
    Patent number: 10700446
    Abstract: A connector is provided having a shaft member and a wire substrate. The wire substrate is wound helically on a surface of the shaft member. The wire substrate includes a band-shaped base material, a plurality of conductive wires provided on one surface of the base material, and a plurality of contact pads provided on another surface of the base material. Each of the conductive wires is connected to each of the contact pads, and the contact pads are exposed on an outside of the wire substrate aligned so as to open a gap in a length direction of the shaft member, in a state where the wire substrate is wound helically on the surface of the shaft member.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: June 30, 2020
    Assignee: Molex, LLC
    Inventors: Naoyoshi Tamura, Takeshi Tsukahara, Taku Yanagihashi
  • CONNECTOR
    Publication number: 20200014124
    Abstract: A connector is provided having a shaft member and a wire substrate. The wire substrate is wound helically on a surface of the shaft member. The wire substrate includes a band-shaped base material, a plurality of conductive wires provided on one surface of the base material, and a plurality of contact pads provided on another surface of the base material. Each of the conductive wires is connected to each of the contact pads, and the contact pads are exposed on an outside of the wire substrate aligned so as to open a gap in a length direction of the shaft member, in a state where the wire substrate is wound helically on the surface of the shaft member.
    Type: Application
    Filed: January 3, 2018
    Publication date: January 9, 2020
    Inventors: NAOYOSHI TAMURA, TAKESHI TSUKAHARA, TAKU YANAGIHASHI
  • Conductor connecting structure
    Patent number: 10420217
    Abstract: The present disclosure provides a conductor connecting structure that connects a cable to a substrate, where the substrate includes at least one connection pad, the cable includes at least one core wire, the core wire is connected to an upper surface of the connection pad through soldering, and the connection pad includes a solder storing part that is present further frontward than a front end of the core wire.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: September 17, 2019
    Assignee: Molex, LLC
    Inventors: Taku Yanagihashi, Shingo Izuchi, Takeshi Tsukahara
  • CONDUCTOR CONNECTING STRUCTURE
    Publication number: 20180132352
    Abstract: The present disclosure provides a conductor connecting structure that connects a cable to a substrate, where the substrate includes at least one connection pad, the cable includes at least one core wire, the core wire is connected to an upper surface of the connection pad through soldering, and the connection pad includes a solder storing part that is present further frontward than a front end of the core wire.
    Type: Application
    Filed: August 14, 2017
    Publication date: May 10, 2018
    Applicant: Molex, LLC
    Inventors: Taku Yanagihashi, Shingo Izuchi, Takeshi Tsukahara