Abstract: A method of manufacturing a light emitting device includes: a resin layer disposition step including disposing, on a support, a resin layer in an A-stage state; a light emitting element mounting step including mounting a light emitting element on the resin layer such that a first surface faces an upper surface of the resin layer; a load application step including applying a load to the light emitting element so as to embed the semiconductor stack structure at least partly in the resin layer while a second surface of the light emitting element is exposed from the resin layer; a first heating step including heating the resin layer at a first temperature without applying the load, to lower a viscosity of the resin layer; and a second heating step including heating the resin layer at a second temperature higher than the first temperature to harden the resin layer.