Abstract: Provided is a coating material composition that enables an efficient repair operation of a coating film after coating, a (meth)acrylic copolymer that is suitable for obtaining the coating material composition, and a coated article and a method for forming a multilayer coating film using the coating material composition. The (meth)acrylic copolymer includes: a constituent unit derived from a macromonomer (a); and a constituent unit derived from a vinyl monomer (b), a hydroxyl value of the (meth)acrylic copolymer is equal to or greater than 120 mgKOH/g and equal to or less than 260 mgKOH/g, and the content of a constituent unit that has a primary hydroxyl group of the (meth)acrylic copolymer is equal to or less than 30 parts by mass with respect to 100 parts by mass of the constituent unit derived from the macromonomer (a) and the constituent unit derived from the vinyl monomer (b).

Abstract: A porous carbon material wherein a particle diameter is 10 ?m or more but 1 cm or less; wherein a bulk specific gravity is 0.20 g/cm3 or more; and wherein a mesopore volume is 0.10 cm3/g or more.

Abstract: Provided is a coating material composition that enables an efficient repair operation of a coating film after coating, a (meth)acrylic copolymer that is suitable for obtaining the coating material composition, and a coated article and a method for forming a multilayer coating film using the coating material composition. The (meth)acrylic copolymer includes: a constituent unit derived from a macromonomer (a); and a constituent unit derived from a vinyl monomer (b), a hydroxyl value of the (meth)acrylic copolymer is equal to or greater than 120 mgKOH/g and equal to or less than 260 mgKOH/g, and the content of a constituent unit that has a primary hydroxyl group of the (meth)acrylic copolymer is equal to or less than 30 parts by mass with respect to 100 parts by mass of the constituent unit derived from the macromonomer (a) and the constituent unit derived from the vinyl monomer (b).

Abstract: A porous carbon material wherein a particle diameter is 10 ?m or more but 1 cm or less; wherein a bulk specific gravity is 0.20 g/cm3 or more; and wherein a mesopore volume is 0.10 cm3/g or more.

Abstract: A heat conductive sheet is provided in which the frequency of contact between fibrous fillers is high. In the heat conductive sheet, the exposed ends of fibrous fillers do not remain exposed and are embedded into the sheet, and it is unnecessary to apply a load that may interfere with the normal operation of a heat generating body and a heat dissipator to the heat generating body and the heat dissipator when the heat conductive sheet is disposed therebetween. The heat conductive sheet contains fibrous fillers and a binder resin, and the ratio of the fibrous fillers that are not oriented in the direction of the thickness of the heat conductive sheet in all the fibrous fillers is 45 to 95%.

Abstract: A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 ?m to 250 ?m, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and wherein the thermally conductive sheet has an average thickness of 500 ?m or less.

Abstract: Provided is a method of manufacturing a heat conductive sheet with improved adhesion and heat conductivity. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and pressing the molded product sheet.

Abstract: Provided is a method of manufacturing a heat conductive sheet that itself is imparted with stickiness and has reduced heat resistance due to improved adhesion to a heat generator and a heat dissipater and that may be fixed provisionally without the need for using an adhesive agent or the like. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and coating an entire surface of a sheet main body (7) with an uncured component (8) of the binder resin oozing from the sheet main body (7).

Abstract: A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.

Abstract: Provided is a method of manufacturing a heat conductive sheet with improved adhesion and heat conductivity. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and pressing the molded product sheet.

Abstract: Provided is a method of manufacturing a heat conductive sheet that itself is imparted with stickiness and has reduced heat resistance due to improved adhesion to a heat generator and a heat dissipater and that may be fixed provisionally without the need for using an adhesive agent or the like. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and coating an entire surface of a sheet main body (7) with an uncured component (8) of the binder resin oozing from the sheet main body (7).

Abstract: A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.

Abstract: A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 ?m to 250 ?m, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and wherein the thermally conductive sheet has an average thickness of 500 ?m or less.

Abstract: A heat conductive sheet is provided in which the frequency of contact between fibrous fillers is high. In the heat conductive sheet, the exposed ends of fibrous fillers do not remain exposed and are embedded into the sheet, and it is unnecessary to apply a load that may interfere with the normal operation of a heat generating body and a heat dissipator to the heat generating body and the heat dissipator when the heat conductive sheet is disposed therebetween. The heat conductive sheet contains fibrous fillers and a binder resin, and the ratio of the fibrous fillers that are oriented in the direction of the thickness of the heat conductive sheet in all the fibrous fillers is 45 to 95%.

Abstract: A three-dimensional wiring board comprises a metal base having a roughed surface, a heat-bonding type of polyimide film without using adhesive, bonded to the roughed surface and serving as an electric insulating layer, and a copper foil for a conductive layer, bonded to the other surface of the polyimide film. A method for manufacturing the wiring board comprises a roughing treatment process for plating or oxidizing the surface of a metal base, thereby forming a roughed surface, a contact bonding process for attaching a polyimide film to the roughed surface and a copper foil by thermocompression bonding, thereby forming a laminate material, a patterning process for etching the copper foil into a desired conductive pattern, and a bending process for bending the laminate material into a desired three-dimensional shape by press working.