Patents by Inventor Takuhiro Taniguchi
Takuhiro Taniguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12158700Abstract: The present photosensitive resin composition includes a polymer (A) having a structural unit (a1) represented by a formula (a1), a structural unit (a2) represented by a formula (a2), and a structural unit (a3) represented by a formula (a3), and a photoacid generator (B). In the formulae (a1) to (a3), R12, R22, and R32 each independently represent an organic group having 1 to 10 carbon atoms; R21 represents a substituted or non-substituted alkyl group having 1 to 10 carbon atoms; R31 represents a hydrogen atom, a substituted or non-substituted alkyl group having 1 to 10 carbon atoms, or a halogen atom; R13 and R23 each independently represent an acid dissociable group; R33 represents a hydroxyaryl group; and l, m and n independently represent an integer from 0 to 10.Type: GrantFiled: June 14, 2019Date of Patent: December 3, 2024Assignee: JSR CORPORATIONInventors: Hirokazu Sakakibara, Naoki Nishiguchi, Takuhiro Taniguchi, Tomoyuki Matsumoto
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Publication number: 20240385518Abstract: A radiation-sensitive resin composition includes a resin including a structural unit (I) represented by formula (1). Ra is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; Ar1 is a substituted or unsubstituted divalent aromatic hydrocarbon group having 6 to 20 carbon atoms; m is 0 or 1; L1 is a single bond, or —O—, *—COO—, a divalent hydrocarbon group having 1 to 20 carbon atoms, or a combination thereof, and * is a bond on an Ar1 side; Ar2 is a monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms and substituted with X; X is an iodine atom or a bromine atom; and n1 is an integer of 1 to nmax, wherein nmax is the number of Xs when all hydrogen atoms in the monovalent aromatic hydrocarbon group represented by the Ar2 are substituted with X.Type: ApplicationFiled: September 1, 2022Publication date: November 21, 2024Applicant: JSR CORPORATIONInventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Natsuko KINOSHITA, Takuhiro TANIGUCHI, Takuya OMIYA
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Publication number: 20240319596Abstract: A polymer containing a structural unit (I) represented by formula (1) is included in a radiation-sensitive composition. In formula (1), R2 is a single bond, a divalent hydrocarbon group, or the like. R3 is a divalent group represented by formula (2) or formula (3). R4 is a divalent organic group. Y? is a monovalent anion which can generate a sulfonic acid group, an imidic acid group, or a methide acid group through exposure to light. Ma+ is an a-valent cation. a is 1 or 2.Type: ApplicationFiled: June 1, 2022Publication date: September 26, 2024Applicant: JSR CORPORATIONInventors: Hiromu MIYATA, Takuhiro TANIGUCHI
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Patent number: 12092957Abstract: A radiation-sensitive resin composition includes a resin having a partial structure represented by formula (1). R1 and R2 each independently represent a substituted or unsubstituted chain aliphatic hydrocarbon group having 1 to 6 carbon atoms or a substituted or unsubstituted alicyclic hydrocarbon group having 3 to 6 carbon atoms, or R1 and R2 are bonded to each other to form a part of a 3- to 6-membered cyclic structure together with the carbon atom to which R1 and R2 are bonded; R3 represents a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms and containing a fluorine atom. No fluorine atom is bonded to carbon atoms located at ?-, ?- and ?-positions of the carbon atom to which R1 and R2 are bonded; and No fluorine atom is bonded to carbon atoms located at ?- and ?-positions of the carbon atom to which R3 is bonded.Type: GrantFiled: October 22, 2021Date of Patent: September 17, 2024Assignee: JSR CORPORATIONInventors: Kazuya Kiriyama, Katsuaki Nishikori, Takuhiro Taniguchi, Ryuichi Nemoto, Ken Maruyama
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Patent number: 11966161Abstract: A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A? represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.Type: GrantFiled: June 30, 2022Date of Patent: April 23, 2024Assignee: JSR CORPORATIONInventors: Takuhiro Taniguchi, Katsuaki Nishikori, Hayato Namai, Kazuya Kiriyama, Ken Maruyama
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Publication number: 20230244143Abstract: A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A? represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.Type: ApplicationFiled: June 30, 2022Publication date: August 3, 2023Applicant: JSR CORPORATIONInventors: Takuhiro TANIGUCHI, Katsuaki NISHIKORI, Hayato NAMAI, Kazuya KIRIYAMA, Ken MARUYAMA
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Publication number: 20230236501Abstract: A radiation-sensitive resin composition includes: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; a radiation-sensitive acid generator; and a compound represented by formula (1). Ar1 represents a group obtained by removing (a+b+2) hydrogen atoms from an aromatic hydrocarbon ring having 6 to 30 ring atoms; R1 represents a halogen atom or a monovalent organic group having 1 to 20 carbon atoms; L1 represents a divalent linking group; R2 represents a substituted or unsubstituted monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms; a is an integer of 0 to 10, b is an integer of 1 to 10, wherein a sum of a and b is no greater than 10; and X+ represents a monovalent radiation-sensitive onium cation.Type: ApplicationFiled: January 23, 2023Publication date: July 27, 2023Applicant: JSR CORPORATIONInventors: Natsuko KINOSHITA, Takuhiro TANIGUCHI, Katsuaki NISHIKORI, Kazuya KIRIYAMA
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Publication number: 20230236506Abstract: A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R1 represents a monovalent organic group having 1 to 30 carbon atoms; and X+ represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000.Type: ApplicationFiled: July 19, 2022Publication date: July 27, 2023Applicant: JSR CORPORATIONInventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Takuhiro TANIGUCHI, Ken MARUYAMA
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Patent number: 11609495Abstract: A radiation-sensitive resin composition includes a polymer including a phenolic hydroxyl group, a compound represented by formula (1-1) or formula (1-2), and a compound represented by formula (2). In the formula (1-1), a sum of a, b, and c is no less than 1; at least one of R1, R2, and R3 represents a fluorine atom or the like; and R4 and R5 each independently represent a hydrogen atom, a fluorine atom, or the like. In the formula (1-2), in a case in which d is 1, R6 represents a fluorine atom or the like, and in a case in which d is no less than 2, at least one of the plurality of R6s represents a fluorine atom or the like; and R8 represents a single bond or a divalent organic group having 1 to 20 carbon atoms.Type: GrantFiled: October 27, 2020Date of Patent: March 21, 2023Assignee: JSR CORPORATIONInventors: Katsuaki Nishikori, Kazuya Kiriyama, Takuhiro Taniguchi, Ken Maruyama
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Patent number: 11592746Abstract: A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; and a radiation-sensitive acid generating agent. The radiation-sensitive acid generating agent includes a sulfonate anion and a radiation-sensitive cation. The sulfonate anion includes two or more rings, and an iodine atom and a monovalent group having 0 to 10 carbon atoms which includes at least one of an oxygen atom and a nitrogen atom bond to at least one of the two or more rings. The ring is preferably an aromatic ring. The radiation-sensitive acid generating agent is preferably a compound represented by formula (1). In the formula (1), A1 represents a group obtained from a compound which includes a ring having 3 to 20 ring atoms by removing (p+q+r+1) hydrogen atoms on the ring.Type: GrantFiled: March 11, 2020Date of Patent: February 28, 2023Assignee: JSR CORPORATIONInventors: Kazuya Kiriyama, Katsuaki Nishikori, Takuhiro Taniguchi, Ken Maruyama
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Publication number: 20220413385Abstract: The radiation-sensitive resin composition contains: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which has a structural unit represented by the following formula (1); and a radiation-sensitive acid generating agent. L represents a single bond, —COO—, —O—, or —CONH—. X represents a single bond, —O—, -G-O—, —CH2—, —S—, —SO2—, —NRA—, or —CONH—, wherein G represents a divalent aliphatic hydrocarbon group having 1 to 20 carbon atoms, and RA represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. R2 and R3 each independently represent a halogen atom, a hydroxy group, a sulfanyl group, or an organic group having 1 to 20 carbon atoms.Type: ApplicationFiled: June 1, 2022Publication date: December 29, 2022Applicant: JSR CORPORATIONInventors: Kazuya KIRIYAMA, Takuhiro Taniguchi, Katsuaki Nishikori, Natsuko Kinoshita
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Publication number: 20220382152Abstract: A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R1 represents a monovalent organic group having 1 to 30 carbon atoms; and X represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000.Type: ApplicationFiled: July 19, 2022Publication date: December 1, 2022Applicant: JSR CORPORATIONInventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Takuhiro TANIGUCHI, Ken MARUYAMA
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Publication number: 20220334481Abstract: A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A? represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Applicant: JSR CORPORATIONInventors: Takuhiro TANIGUCHI, Katsuaki NISHIKORI, Hayato NAMAI, Kazuya KIRIYAMA, Ken MARUYAMA
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Publication number: 20220283498Abstract: A radiation-sensitive resin composition includes: a resin having a polystyrene-equivalent weight-average molecular weight of 8,000 or less; a radiation-sensitive acid generator; and a solvent. The resin includes: a structural unit A represented by formula (1); a structural unit B having a phenolic hydroxyl group; and a structural unit C having an acid-dissociable group. The structural unit B is other than the structural unit A; and the structural unit C is other than the structural unit A or B. In the formula (1), RX is a hydrogen atom or a methyl group; and Ar is a monovalent aromatic hydrocarbon group having a substituent represented by —ORY. The substituent is bonded to a carbon atom next to a carbon atom bonded to a main chain of the resin. RY is a hydrogen atom or a protective group to be deprotected by action of an acid.Type: ApplicationFiled: February 11, 2022Publication date: September 8, 2022Applicant: JSR CORPORATIONInventors: Katsuaki NISHIKORI, Kazuya Kiriyama, Natsuko Kinoshita, Takuhiro Taniguchi
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Publication number: 20220269172Abstract: Provided are: a radiation-sensitive resin composition, a method of forming a resist pattern, and a polymer which enable forming a resist pattern with favorable sensitivity to exposure light and superiority in terms of CDU performance and resolution. The radiation-sensitive resin composition contains: a polymer having: a first structural unit represented by formula (1), and a second structural unit derived from a (meth)acrylic acid ester including an acid-labile group; and a radiation-sensitive acid generator.Type: ApplicationFiled: February 17, 2022Publication date: August 25, 2022Applicant: JSR CORPORATIONInventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Takuhiro TANIGUCHI, Ken MARUYAMA
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Publication number: 20220177424Abstract: A radiation-sensitive resin composition contains: an onium salt compound represented by formula (1); a resin containing a structural unit having an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent organic group having a cyclic structure, or a chain hydrocarbon group having 2 or more carbon atoms. X is an oxygen atom, a sulfur atom, or —NR?—. R? is a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. Z+ is a monovalent onium cation.Type: ApplicationFiled: February 24, 2022Publication date: June 9, 2022Applicant: JSR CORPORATIONInventors: Ryuichi NEMOTO, Katsuaki Nishikori, Ryosuke Nakamura, Takuhiro Taniguchi
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Publication number: 20220043350Abstract: A radiation-sensitive resin composition includes a resin having a partial structure represented by formula (1). R1 and R2 each independently represent a substituted or unsubstituted chain aliphatic hydrocarbon group having 1 to 6 carbon atoms or a substituted or unsubstituted alicyclic hydrocarbon group having 3 to 6 carbon atoms, or R1 and R2 are bonded to each other to form a part of a 3- to 6-membered cyclic structure together with the carbon atom to which R1 and R2 are bonded; R3 represents a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms and containing a fluorine atom. No fluorine atom is bonded to carbon atoms located at ?-, ?- and ?-positions of the carbon atom to which R1 and R2 are bonded; and No fluorine atom is bonded to carbon atoms located at ?- and ?-positions of the carbon atom to which R3 is bonded.Type: ApplicationFiled: October 22, 2021Publication date: February 10, 2022Applicant: JSR CORPORATIONInventors: Kazuya Kiriyama, Katsuaki Nishikori, Takuhiro Taniguchi, Ryuichi Nemoto, Ken Maruyama
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Publication number: 20210389667Abstract: A radiation-sensitive resin composition includes a polymer including a phenolic hydroxyl group, a compound represented by formula (1-1) or formula (1-2), and a compound represented by formula (2). In the formula (1-1), a sum of a, b, and c is no less than 1; at least one of R1, R2, and R3 represents a fluorine atom or the like; and R4 and R5 each independently represent a hydrogen atom, a fluorine atom, or the like. In the formula (1-2), in a case in which d is 1, R6 represents a fluorine atom or the like, and in a case in which d is no less than 2, at least one of the plurality of R6s represents a fluorine atom or the like; and R8 represents a single bond or a divalent organic group having 1 to 20 carbon atoms.Type: ApplicationFiled: October 27, 2020Publication date: December 16, 2021Applicant: JSR CORPORATIONInventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Takuhiro TANIGUCHI, Ken MARUYAMA
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Publication number: 20210325783Abstract: The present photosensitive resin composition includes a polymer (A) having a structural unit (a1) represented by a formula (a1), a structural unit (a2) represented by a formula (a2), and a structural unit (a3) represented by a formula (a3), and a photoacid generator (B). In the formulae (a1) to (a3), R12, R22, and R32 each independently represent an organic group having 1 to 10 carbon atoms; R21 represents a substituted or non-substituted alkyl group having 1 to 10 carbon atoms; R31 represents a hydrogen atom, a substituted or non-substituted alkyl group having 1 to 10 carbon atoms, or a halogen atom; R13 and R23 each independently represent an acid dissociable group; R33 represents a hydroxyaryl group; and l, m and n independently represent an integer from 0 to 10.Type: ApplicationFiled: June 14, 2019Publication date: October 21, 2021Applicant: JSR CORPORATIONInventors: Hirokazu SAKAKIBARA, Naoki NISHIGUCHI, Takuhiro TANIGUCHI, Tomoyuki MATSUMOTO
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Publication number: 20210311391Abstract: The present photosensitive resin composition includes a polymer (A) having a structural unit (a1) represented by a formula (a1), a structural unit (a2) represented by a formula (a2), and a structural unit (a3) represented by a formula (a3) and a photoacid generator (B). In the formulae (a1) to (a3), R11, R21, and R31 each independently represent a hydrogen atom, a substituted or non-substituted alkyl group having 1 to 10 carbon atom or a halogen atom; R12 and R32 each independently represent a divalent organic group; R22 represents a substituted or non-substituted alkanediyl group having 2 to 10 carbon atoms; R13 represents an acid dissociable group having an alicyclic structure; R23 represents an alkyl group having 1 to 10 carbon atoms; R33 represents a hydroxyaryl group; and 1, m and n each independently represent an integer from 0 to 10.Type: ApplicationFiled: July 1, 2019Publication date: October 7, 2021Applicant: JSR CORPORATIONInventors: Takuhiro TANIGUCHI, Naoki NISHIGUCHI, Tomoyuki MATSUMOTO, Hirokazu SAKAKIBARA, Akito HIRO, Hisanori AKIMARU