Abstract: A thermoelectric conversion substrate includes an insulating substrate and at least one thermoelectric conversion unit. The insulating substrate has a first surface and a second surface at both sides of the insulating substrate in a thickness direction. The at least one thermoelectric conversion unit is incorporated in the insulating substrate. The at least one thermoelectric conversion unit includes a first thermoelectric member, a second thermoelectric member, and a first electrode disposed on the first surface of the insulating substrate. The first thermoelectric member includes a first tubular member having insulation property and a first semiconductor filled in the first tubular member. The second thermoelectric member includes a second tubular member having insulation property and a second semiconductor filled in the second tubular member. The second semiconductor has carriers different from carriers of the first semiconductor.

Abstract: A thermoelectric conversion substrate includes an insulating substrate and at least one thermoelectric conversion unit. The insulating substrate has a first surface and a second surface at both sides of the insulating substrate in a thickness direction. The at least one thermoelectric conversion unit is incorporated in the insulating substrate. The at least one thermoelectric conversion unit includes a first thermoelectric member, a second thermoelectric member, and a first electrode disposed on the first surface of the insulating substrate. The first thermoelectric member includes a first tubular member having insulation property and a first semiconductor filled in the first tubular member. The second thermoelectric member includes a second tubular member having insulation property and a second semiconductor filled in the second tubular member. The second semiconductor has carriers different from carriers of the first semiconductor.

Abstract: The present invention provides an insulating sheet which is excellent in handleability when it is uncured, prevents excessive flowage in laminating press, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, and processability.

Abstract: The present invention provides an insulating sheet which is excellent in handleability when it is uncured, and provides a cured product excellent in dielectric breakdown characteristics, thermal conductivity, heat resistance, acid resistance, and processability, and a multilayer structure produced by the use of the insulating sheet. The insulating sheet comprising: (A) a polymer having a weight average molecular weight of 10,000 or more; (B) at least one of an epoxy resin (B1) having a weight average molecular weight of less than 10,000 and an oxetane resin (B2) having a weight average molecular weight of less than 10,000; (C) a curing agent; and (D) at least one of magnesium carbonate anhydrous (D1) represented by MgCO3 and containing no crystal water and a coated body (D2) obtainable by coating the surface of the magnesium carbonate anhydrous (D1) with an organic resin, a silicone resin, or silica.

Abstract: The present invention provides an insulating sheet which is used for bonding a heat conductor having a thermal conductivity of 10 W/m·K or higher to an electrically conductive layer. The handleability of the insulating sheet is excellent when it is uncured, and a cured product of the insulating sheet has higher adhesion, heat resistance, dielectric breakdown characteristics, and thermal conductivity.