Abstract: An electronic device assembly 10 includes: an electronic device 20 having flexibility; and a protection member 50 bonded to the electronic device 20. The protection member 50 includes a metal foil 53 that is supported by a support member 51 having flexibility and an adhesive layer 54 formed on the metal foil 53. The metal foil 53 included in the protection member 50 is bonded to the electronic device 20 via the adhesive layer 54.

Abstract: An electronic device assembly 10 includes: an electronic device 20 having flexibility; and a protection member 50 bonded to the electronic device 20. The protection member 50 includes a metal foil 53 that is supported by a support member 51 having flexibility and an adhesive layer 54 formed on the metal foil 53. The metal foil 53 included in the protection member 50 is bonded to the electronic device 20 via the adhesive layer 54.

Abstract: A self-limiting reaction deposition apparatus includes a first guide roller, a second guide roller, and at least one first head. The first guide roller changes, while supporting a first surface of a base material conveyed by a roll-to-roll process, a conveying direction of the base material from a first direction to a second direction that is not parallel to the first direction. The second guide roller changes, while supporting the first surface of the base material, the conveying direction of the base material from the second direction to a third direction that is not parallel to the second direction. The at least one first head is disposed between the first guide roller and the second guide roller, faces a second surface opposite to the first surface of the base material, and discharges, towards the second surface, a raw material gas for self-limiting reaction deposition.

Abstract: The part of an MR element 25 which lies close to a medium-facing surface 10a overlaps that part of a flux-guiding element 24 which lies remote from the medium-facing surface 10a, with a second gap film 23b interposed between the elements 24 and 25. Further, the MR element 25 overlaps the flux-guiding element 24 for a distance that falls within a range of 15 to 25% of the length of the MR height of the element 25 as measured in a direction perpendicular to the medium-facing surface 10a.

Abstract: The part of an MR element 25 which lies close to a medium-facing surface 10a overlaps that part of a flux-guiding element 24 which lies remote from the medium-facing surface 10a, with a second gap film 23b interposed between the elements 24 and 25. Further, the MR element 25 overlaps the flux-guiding element 24 for a distance that falls within a range of 15 to 25% of the length of the MR height of the element 25 as measured in a direction perpendicular to the medium-facing surface 10a.