Patents by Inventor Takuji Okada
Takuji Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9607868Abstract: The present invention provides a substrate heat treatment apparatus capable of uniformly heat a substrate at high speed with less breakage of constituent members due to thermal expansion even at high temperature. An embodiment of the present invention is a substrate heat treatment apparatus to perform heat treatment for a substrate and includes: a peripheral ring capable of supporting the substrate; a connection ring; a lifting device to raise and lower the peripheral ring; balls having a lower heat conductivity than that of the peripheral ring; and a lamp to heat the substrate supported by the peripheral ring. The balls are different members from both of the peripheral ring and the connection ring. The lifting device raises and lowers the peripheral ring between a first position close to the lamp and a second position distant from the lamp.Type: GrantFiled: June 12, 2013Date of Patent: March 28, 2017Assignee: CANON ANELVA CORPORATIONInventors: Takuji Okada, Toshikazu Nakazawa, Naoyuki Suzuki
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Publication number: 20130272686Abstract: The present invention provides a substrate heat treatment apparatus capable of uniformly heat a substrate at high speed with less breakage of constituent members due to thermal expansion even at high temperature. An embodiment of the present invention is a substrate heat treatment apparatus to perform heat treatment for a substrate and includes: a peripheral ring capable of supporting the substrate; a connection ring; a lifting device to raise and lower the peripheral ring balls having a lower heat conductivity than that of the peripheral ring; and a lamp to heat the substrate supported by the peripheral ring. The balls are different members from both of the peripheral ring and the connection ring. The lifting device raises and lowers the peripheral ring between a first position close to the lamp and a second position distant from the lamp.Type: ApplicationFiled: June 12, 2013Publication date: October 17, 2013Inventors: Takuji OKADA, Toshikazu NAKAZAWA, Naoyuki SUZUKI
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Publication number: 20110253037Abstract: The vacuum heating and cooling apparatus can rapidly heat and cool only the substrate after film-forming treatment while maintaining high vacuum. The temperature rise of members in the chamber with time caused by accumulation of heat is suppressed, and the variation of temperature between substrates is decreased.Type: ApplicationFiled: April 26, 2011Publication date: October 20, 2011Applicant: CANON ANELVA CORPORATIONInventors: Koji Tsunekawa, Yoshinori Nagamine, Naoyuki Suzuki, Takuji Okada, Shinichi Inaba
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Patent number: 7976716Abstract: A method of using a heat exchanger efficiently and uniformly to cool or heats portions to be controlled to a prescribed temperature, and then continuously carry out stable processing. The heat exchanger is constructed by arranging partition walls between two plates to form a fluid channel and a fin parallel with the channel or inclined by a prescribed angle on each of the two plates insides the channel so that the plate or a member in contact with the plate is cooled or heated with the fluid flowing through the channel.Type: GrantFiled: February 25, 2009Date of Patent: July 12, 2011Assignee: Canon Anelva CorporationInventors: Yasumi Sago, Masayoshi Ikeda, Kazuaki Kaneko, Takuji Okada
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Publication number: 20090197418Abstract: A method of using a heat exchanger efficiently and uniformly to cool or heats portions to be controlled to a prescribed temperature, and then continuously carry out stable processing. The heat exchanger is constructed by arranging partition walls between two plates to form a fluid channel and a fin parallel with the channel or inclined by a prescribed angle on each of the two plates insides the channel so that the plate or a member in contact with the plate is cooled or heated with the fluid flowing through the channel.Type: ApplicationFiled: February 25, 2009Publication date: August 6, 2009Applicant: CANON ANELVA CORPORATIONInventors: Yasumi SAGO, Masayoshi IKEDA, Kazuaki KANEKO, Takuji OKADA
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Patent number: 7513063Abstract: A heat exchanger efficiently and uniformly cools or heats portions to be controlled to a prescribed temperature, and then provides a surface processing apparatus which makes it possible to continuously carry out stable processing. The heat exchanger is constructed by arranging partition walls between two plates to form a fluid channel and a fin parallel with the channel or inclined by a prescribed angle on each of the two plates insides the channel so that the plate or a member in contact with the plate is cooled or heated with the fluid flowing through the channel.Type: GrantFiled: February 28, 2003Date of Patent: April 7, 2009Assignee: Canon Anelva CorporationInventors: Yasumi Sago, Masayoshi Ikeda, Kazuaki Kaneko, Takuji Okada
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Patent number: 7220319Abstract: This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.Type: GrantFiled: April 15, 2003Date of Patent: May 22, 2007Assignee: Canon Anelva CorporationInventors: Yasumi Sago, Kazuaki Kaneko, Takuji Okada, Masayoshi Ikeda, Toshihiro Tachikawa, Tadashi Inokuchi, Takashi Kayamoto
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Patent number: 7175737Abstract: This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses optimum total thickness of the ESC stage, optimum volume ratio of composite which the moderation layer is made of, and an optimum range of the thermal expansion coefficient of the composite. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.Type: GrantFiled: April 15, 2003Date of Patent: February 13, 2007Assignee: Canon Anelva CorporationInventors: Yasumi Sago, Kazuaki Kaneko, Takuji Okada, Masayoshi Ikeda
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Publication number: 20030222416Abstract: This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.Type: ApplicationFiled: April 15, 2003Publication date: December 4, 2003Inventors: Yasumi Sago, Kazuaki Kaneko, Takuji Okada, Masayoshi Ikeda, Toshihiro Tachikawa, Tadashi Inokuchi, Takashi kayamoto
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Publication number: 20030198005Abstract: This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses optimum total thickness of the ESC stage, optimum volume ratio of composite which the moderation layer is made of, and an optimum range of the thermal expansion coefficient of the composite. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.Type: ApplicationFiled: April 15, 2003Publication date: October 23, 2003Inventors: Yasumi Sago, Kazuaki Kaneko, Takuji Okada, Masayoshi Ikeda
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Publication number: 20030159307Abstract: The object of this invention is to realize a heat exchanger which efficiently and uniformly cools or heats portions to be controlled to a prescribed temperature, and then to provide a surface processing apparatus which makes it possible to continuously carry out stable processing.Type: ApplicationFiled: February 28, 2003Publication date: August 28, 2003Applicant: ANELVA CORPORATIONInventors: Yasumi Sago, Masayoshi Ikeda, Kazuaki Kaneko, Takuji Okada
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Patent number: 4929501Abstract: A thermal transfer medium which has a heat meltable or heatsublimable ink layer on one side of a stretched polyamide film which mainly consists of polytetramethylenediapamide and has a melting point of at least 270.degree. C. The film shows good heat resistance and nonsticking properties.Type: GrantFiled: August 17, 1988Date of Patent: May 29, 1990Assignee: Stamicarbon B.V.Inventors: Takuji Okada, Kunio Murakami
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Patent number: 4305865Abstract: A polyamide composition comprises (a) 50 to 99 wt. % of a polyamide; and (b) 50 to 1 wt. % of a modified polyolefin which is modified with 0.001 to 10 mole % of an adduct component selected from alicyclic carboxylic acids or functional derivatives thereof which has a cis-form double bond in the ring, which can be substituted with a nonmodified polyolefin at a ratio of 1 to 90 wt. parts per 100 wt. parts of said modified polyolefin.Type: GrantFiled: June 2, 1980Date of Patent: December 15, 1981Assignee: Unitika Ltd.Inventors: Takuji Okada, Teijiro Arai, Yoshinori Ichikawa, Kikuo Tanaka
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Patent number: RE42175Abstract: This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.Type: GrantFiled: May 21, 2009Date of Patent: March 1, 2011Assignees: Canon Anelva Corporation, NHK Spring Co., Ltd.Inventors: Yasumi Sago, Kazuaki Kaneko, Takuji Okada, Masayoshi Ikeda, Toshihiro Tachikawa, Tadashi Inokuchi, Takashi Kayamoto