Patents by Inventor Takuji Okamura
Takuji Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10720394Abstract: An electronic component mounting board includes an inorganic substrate, a wiring board, and a bond. The inorganic substrate includes an electronic component mounting portion in a central area of an upper surface of the inorganic substrate in which an electronic component is mountable. The wiring board is a frame surrounding the electronic component mounting portion on the upper surface of the inorganic substrate. The bond is located between the inorganic substrate and the wiring board. The inorganic substrate includes a downward bend outward from a bond area including the bond.Type: GrantFiled: November 9, 2016Date of Patent: July 21, 2020Assignee: KYOCERA CORPORATIONInventors: Takuji Okamura, Akihiko Funahashi
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Patent number: 10319759Abstract: An image pickup element mounting substrate includes: a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body; an electronic component mounted on a lower surface side of the frame body; and a flat plate which is disposed on a lower surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate including an image pickup element mounting section at a part of an upper surface thereof which part is surrounded by the frame body, a lower surface of the electronic component being located above a level of a lower surface of the flat plate.Type: GrantFiled: June 24, 2015Date of Patent: June 11, 2019Assignee: Kyocera CorporationInventors: Takuji Okamura, Akihiko Funahashi
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Publication number: 20180254251Abstract: An electronic component mounting board includes an inorganic substrate, a wiring board, and a bond. The inorganic substrate includes an electronic component mounting portion in a central area of an upper surface of the inorganic substrate in which an electronic component is mountable. The wiring board is a frame surrounding the electronic component mounting portion on the upper surface of the inorganic substrate. The bond is located between the inorganic substrate and the wiring board. The inorganic substrate includes a downward bend outward from a bond area including the bond.Type: ApplicationFiled: November 9, 2016Publication date: September 6, 2018Applicant: KYOCERA CorporationInventors: Takuji OKAMURA, Akihiko FUNAHASHI
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Publication number: 20170351069Abstract: Provided are an electronic component mounting package and an electronic device capable of making heat distribution of a curved electronic component mounting portion uniform. The electronic component mounting package (1) includes: a substrate (2) including a first main surface and a second main surface, and one of a recessed portion (2d) and a convex portion (2e) that is arc-shaped in a vertical cross-sectional view and that is provided in the first main surface; and a curved electronic component mounting portion (11), which is provided in the one of the recessed portion (2d) and the convex portion (2e) and on which the bent curved electronic component (10) is mounted. The substrate (2) has a notch (4) in the second main surface such that the notch (4) overlaps with the curved electronic component mounting portion (11) when the substrate (2) is viewed in a plane perspective from the first main surface side.Type: ApplicationFiled: October 27, 2015Publication date: December 7, 2017Inventors: Hiroshi YAMADA, Takuji OKAMURA, Akihiko FUNAHASHI
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Patent number: 9806005Abstract: An electronic element mounting substrate includes: a first wiring substrate configured to be a frame defining an interior portion as a first through-hole, the first wiring substrate including a lower surface including an external circuit connection electrode; a metal plate disposed on the lower surface of the first wiring substrate so as to cover an opening of the first through-hole, an outer edge thereof being located between an outer edge of the first wiring substrate and an inner edge of the first wiring substrate, an electronic element mounting portion being disposed in a region of an upper surface of the metal plate which region is surrounded by the first wiring substrate; and a second wiring substrate which is disposed in a peripheral region of the metal plate on the lower surface of the first wiring substrate and is electrically connected to the external circuit connection electrode.Type: GrantFiled: April 14, 2015Date of Patent: October 31, 2017Assignee: KYOCERA CORPORATIONInventors: Hiroshi Yamada, Takuji Okamura, Akihiko Funahashi
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Publication number: 20170186672Abstract: An electronic element mounting substrate includes: a first wiring substrate configured to be a frame defining an interior portion as a first through-hole, the first wiring substrate including a lower surface including an external circuit connection electrode; a metal plate disposed on the lower surface of the first wiring substrate so as to cover an opening of the first through-hole, an outer edge thereof being located between an outer edge of the first wiring substrate and an inner edge of the first wiring substrate, an electronic element mounting portion being disposed in a region of an upper surface of the metal plate which region is surrounded by the first wiring substrate; and a second wiring substrate which is disposed in a peripheral region of the metal plate on the lower surface of the first wiring substrate and is electrically connected to the external circuit connection electrode.Type: ApplicationFiled: April 14, 2015Publication date: June 29, 2017Applicant: KYOCERA CorporationInventors: Hiroshi YAMADA, Takuji OKAMURA, Akihiko FUNAHASHI
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Publication number: 20170104022Abstract: An image pickup element mounting substrate includes: a frame body composed of an insulating layer, a through hole being defined by an internal periphery of the frame body; an electronic component mounted on a lower surface side of the frame body; and a flat plate which is disposed on a lower surface of the frame body and covers an opening of the through hole while being partly kept in out-of-contact with the electronic component, the flat plate including an image pickup element mounting section at a part of an upper surface thereof which part is surrounded by the frame body, a lower surface of the electronic component being located above a level of a lower surface of the flat plate.Type: ApplicationFiled: June 24, 2015Publication date: April 13, 2017Applicant: KYOCERA CorporationInventors: Takuji OKAMURA, Akihiko FUNAHASHI
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Patent number: 9596751Abstract: There is provided a substrate for mounting electronic elements, including: a frame-shaped first wiring substrate with a first through hole formed in an interior portion thereof; a flat plate-shaped or frame-shaped second wiring substrate arranged to overlap with a bottom surface of the first wiring substrate and electrically connected thereto; and a sheet-shaped metal sheet arranged to overlap with a bottom surface of the second wiring substrate such that the second wiring substrate is sandwiched between the first wiring substrate and the metal sheet, an area inside the frame-shaped first wiring substrate or areas inside the frame-shaped first wiring substrate and second wiring substrate being electronic element mounting areas, and the second wiring substrate having an elastic modulus lower than those of the first wiring substrate and the metal sheet.Type: GrantFiled: March 30, 2015Date of Patent: March 14, 2017Assignee: KYOCERA CORPORATIONInventors: Hiroshi Yamada, Takuji Okamura
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Publication number: 20160128181Abstract: There is provided a substrate for mounting electronic elements, including: a frame-shaped first wiring substrate with a first through hole formed in an interior portion thereof; a flat plate-shaped or frame-shaped second wiring substrate arranged to overlap with a bottom surface of the first wiring substrate and electrically connected thereto; and a sheet-shaped metal sheet arranged to overlap with a bottom surface of the second wiring substrate such that the second wiring substrate is sandwiched between the first wiring substrate and the metal sheet, an area inside the frame-shaped first wiring substrate or areas inside the frame-shaped first wiring substrate and second wiring substrate being electronic element mounting areas, and the second wiring substrate having an elastic modulus lower than those of the first wiring substrate and the metal sheet.Type: ApplicationFiled: March 30, 2015Publication date: May 5, 2016Applicant: KYOCERA CorporationInventors: Hiroshi Yamada, Takuji Okamura
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Patent number: 8314346Abstract: A wiring board for a light-emitting element includes a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, the conductor layer having a mounting region mounting a light-emitting element on one surface of the insulating substrate. The insulating substrate includes a heat-conducting pole-like conductor having a thermal conductivity higher than that of the insulating substrate. The heat-conducting pole-like conductor extends through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.Type: GrantFiled: March 24, 2011Date of Patent: November 20, 2012Assignee: Kyocera CorporationInventors: Tomohide Hasegawa, Minako Izumi, Yasuhiro Sasaki, Noriaki Hamada, Takuji Okamura, Koichi Motomura
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Publication number: 20110169037Abstract: A wiring board for light-emitting element, comprising a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, and having a mounting region mounting a light-emitting element on one surface of the insulating substrate; wherein the insulating substrate is provided with a heat-conducting pole-like conductor having a thermal conductivity higher than that of said insulating substrate; and the heat-conducting pole-like conductor is extending through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.Type: ApplicationFiled: March 24, 2011Publication date: July 14, 2011Applicant: KYOCERA CORPORATIONInventors: Tomohide HASEGAWA, Minako IZUMI, Yasuhiro SASAKI, Noriaki HAMADA, Takuji OKAMURA, Koichi MOTOMURA
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Publication number: 20080043444Abstract: A wiring board for light-emitting element, comprising a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, and having a mounting region mounting a light-emitting element on one surface of the insulating substrate; wherein the insulating substrate is provided with a heat-conducting pole-like conductor having a thermal conductivity higher than that of said insulating substrate; and the heat-conducting pole-like conductor is extending through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.Type: ApplicationFiled: March 30, 2005Publication date: February 21, 2008Applicant: KYOCERA CORPORATIONInventors: Tomohide Hasegawa, Minako Izumi, Yasuhiro Sasaki, Noriaki Hamada, Takuji Okamura, Koichi Motomura