Patents by Inventor Takuji Okaya

Takuji Okaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5403905
    Abstract: Process for producing polyvinyl ester having a high degree of polymerization and an intrinsic viscosity of from 15 dl g.sup.-1 to 3.2 dl g.sup.-1, and a polyvinyl ester obtained thereby. The process comprises subjecting a vinyl ester monomer to emulsion polymerization using nonionic emulsifiers nonionic-anionic emulsifiers, or anionic emulsifiers and a redox initiator at a temperature of -60.degree. to 15.degree. C.
    Type: Grant
    Filed: February 3, 1994
    Date of Patent: April 4, 1995
    Assignee: Kuraray Company, Ltd.
    Inventors: Toshiaki Sato, Ken Yuki, Junnosuke Yamauchi, Takuji Okaya
  • Patent number: 5360670
    Abstract: This invention provides an ethylene-vinyl alcohol copolymer composition having specific flow characteristics in the relationship between the heating time and the extrusion rate measured with a capillary rheometer (Koka Flow Tester), and a multilayered structure utilizing the same.From the EVOH composition according to the present invention, can be obtained a molded article, particularly a multilayered structure, having an excellent appearance; more particularly, in a continuous melt molding operation over a long period, a molded article, particularly a multilayered structure, having an excellent appearance can always be obtained without worsening the appearance with running time.
    Type: Grant
    Filed: November 20, 1992
    Date of Patent: November 1, 1994
    Assignee: Kuraray Co., Ltd.
    Inventors: Kiyoshi Yonezu, Akimasa Aoyama, Takuji Okaya, Satoshi Hirofuji, Yukio Ozeki
  • Patent number: 5310827
    Abstract: Novel polyamide copolymers having skeletons of a specific structure are disclosed. The polyamide copolymers have excellent resistance to hydrolysis, low temperature characteristics (low temperature softness), heat aging resistance and mechanical properties as compared to conventional polyamide copolymers. The polyamide copolymers also show excellent efficiencies in fabrication properties and transparency. In particular, the polyamide copolymers having a branched structure in the molecule thereof provide good results.
    Type: Grant
    Filed: November 13, 1991
    Date of Patent: May 10, 1994
    Assignee: Kuraray Co., Ltd.
    Inventors: Yukiatsu Komiya, Masao Ishida, Koji Hirai, Setuo Yamashita, Shinji Komori, Takuji Okaya
  • Patent number: 5310790
    Abstract: Disclosed herein is a new process for producing polyvinyl ester having a high degree of polymerization having an intrinsic viscosity not less than 1.5 dl/g, preferably not less than 2.2 dl/g, and most preferably higher than 3.2 dl/g, said process comprising subjecting vinyl ester monomer to low-temperature emulsion polymerization under specific conditions.Disclosed also herein is a new process for producing polyvinyl alcohol having a high degree of polymerization having an intrinsic viscosity not less than 1.5 dl/g, preferably not less than 2.2 dl/g, and most preferably higher than 3.2 dl/g, said process comprising saponifying in the usual way the polyvinyl ester obtained by low-temperature emulsion polymerization under specific conditions.
    Type: Grant
    Filed: June 28, 1993
    Date of Patent: May 10, 1994
    Assignee: Kuraray Co. Ltd.
    Inventors: Toshiaki Sato, Ken Yuki, Junnosuke Yamauchi, Takuji Okaya
  • Patent number: 5134036
    Abstract: Ethylene-vinyl alcohol copolymers wherein ethylene content is 10-70 mol % diad syndiotacticity is not less than 55 mol %, and intrinsic viscosity [.eta.] is not less than 0.05 l/g when measured with a mixed solvent of 85 weight % of phenol and 15 weight % of water at 30 20 C., which show less decrease of resistance to gas permeation under high temperature and high humidity, while retaining resistance to get permeation under low humidity, transparency and melt moldability, and moldings and laminates formed thereof.
    Type: Grant
    Filed: May 9, 1991
    Date of Patent: July 28, 1992
    Assignee: Kuraray Co., Ltd.
    Inventors: Junichi Uemura, Akimasa Aoyama, Hitoshi Maruyama, Toshiaki Sato, Takuji Okaya
  • Patent number: 5118743
    Abstract: This invention provides an ethylene-vinyl alcohol copolymer composition having specific flow characteristics in the relationship between the heating time and the extrusion rate measured with a capillary rheometer (Koka Flow Tester), and a multilayered structure utilizing the same.From the EVOH composition according to the present invention, can be obtained a molded article, particularly a multilayered structure, having an excellent appearance; more particularly, in a continuous melt molding operation over a long period, a molded article, particularly a multilayered structure, having an excellent appearance can always be obtained without worsening the appearance with running time.
    Type: Grant
    Filed: August 31, 1988
    Date of Patent: June 2, 1992
    Assignee: Kuraray Co., Ltd.
    Inventors: Kiyoshi Yonezu, Akimasa Aoyama, Takuji Okaya, Satoshi Hirofuji, Yukio Ozeki
  • Patent number: 5093437
    Abstract: Novel polyamide copolymers having skeletons of a specific structure are disclosed. The polyamide copolymers have excellent resistance to hydrolysis, low temperature characteristics (low temperature softness), heat aging resistance and mechanical properties as compared to conventional polyamide copolymers. The polyamide copolymers also show excellent efficiencies in fabrication properties and transparency. In particular, the polyamide copolymers having a branched structure in the molecule thereof provide good results.
    Type: Grant
    Filed: October 1, 1990
    Date of Patent: March 3, 1992
    Assignee: Kuraray Co., Ltd.
    Inventors: Yukiatsu Komiya, Masao Ishida, Koji Hirai, Setuo Yamashita, Shinji Komori, Takuji Okaya
  • Patent number: 5057390
    Abstract: A photosensitive composition characterized by comprising:(a) a vinyl alcohol polymer containing the following structural unit A and having a saponification degree of a vinyl ester unit of not less than 70 mol %: ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 each represents H or a hydrocarbon group having 1 to 4 carbon atoms;(b) a radically polymerizable ethylenic unsaturated compound; and,(c) a photopolymerization initiator,having flexiblity and impact resistance which can maintain sufficient softness but are not broken particularly even at low temperature and low humidity so that resin plates showing high printing quality can be obtained from the photosensitive composition.
    Type: Grant
    Filed: November 20, 1986
    Date of Patent: October 15, 1991
    Assignee: Kuraray Company, Ltd.
    Inventors: Toshiaki Sato, Junnosuke Yamuchi, Takuji Okaya
  • Patent number: 5034451
    Abstract: This invention provides a water-soluble binder and a hot-melt binder for ceramics molding, said binder being composed of a polyvinyl alcohol-based copolymer containing (meth)allyl group-containing nonionic monomer units or nitrogeneous group-containing nonionic monomer units.
    Type: Grant
    Filed: November 23, 1988
    Date of Patent: July 23, 1991
    Assignee: Kuraray Co., Ltd.
    Inventors: Taku Tanaka, Toshiaki Sato, Hitoshi Maruyama, Junnosuke Yamauchi, Takuji Okaya
  • Patent number: 4983318
    Abstract: This invention relates to a method for electric field orientation of liquid crystal polymers and oriented materials of liquid crystal polymers obtained by the method. This electric field orientation method comprises applying a pulsating electric field which is predominantly unidirectional and whose magnitude is varying periodically or non-periodically to a liquid crystal polymer capable of forming an optically anisotropic melt phase. The oriented material of liquid crystal polymer thus obtained has been unidirectionally oriented and polarized. This oriented, polarized material of liquid crystal polymer can be utilized as a piezoelectric material, pyroelectric material, electret material, non-linear optical element or the like.
    Type: Grant
    Filed: June 3, 1988
    Date of Patent: January 8, 1991
    Assignee: Kuraray Co., Ltd.
    Inventors: Mitsuo Matsumoto, Kiyoto Ohtsuka, Koichi Sato, Takuji Okaya
  • Patent number: 4977212
    Abstract: An adhesive resin composition useful for bonding a resin having gas barrier properties and a hydrophobic thermoplastic resin which comprises an ethylene-acrylate or methacrylate copolymer grafted with an ethylenic unsaturated carboxylic acid or its acid anhydride; and 0.02 to 0.6 equivalent to the ethylenic unsaturated carboxylic acid or its acid anhydride of a periodic table group Ia or IIa metal hydroxide, or said metal hydroxide and an ethylene-acrylate or methacrylate copolymer. A laminated material of a resin having gas barrier properties and a hydrophobic thermoplastic resin laminated with the adhesive resin composition and a resin composition comprising the adhesive resin composition, a resin having gas barrier properties and a hydrophobic thermoplastic resin are also disclosed.
    Type: Grant
    Filed: July 20, 1988
    Date of Patent: December 11, 1990
    Assignees: Kuraray Co., Ltd., Nippon Petrochemicals Co., Ltd.
    Inventors: Toshiyuki Akazawa, Takuji Okaya, Takashi Inoue, Toshitaka Kobayashi
  • Patent number: 4906679
    Abstract: A process for production of corrugated board using an aqueous adhesive which contains polyvinyl alcohol and clay, or polyvinyl alcohol, clay and water-soluble boron compound, the ratio of clay to polyvinyl alcohol being in the range of 200 to 600 parts by weight based on 100 parts by weight of polyvinyl alcohol, the ratio of water-soluble boron compound being not more than 15 parts by weight based on 100 parts by weight of polyvinyl alcohol, the solid content of the adhesive being 25 to 60% by weight characterized in that(a) a polyvinyl alcohol concentration in the solution excluding solid other than polyvinyl alcohol from adhesive being in the region bounded by the following formulas:Y.gtoreq.-0.0014 X+9.4 (i)Y.ltoreq.-0.0061 X+26.3 (ii)200.ltoreq.X.ltoreq.3500 (iii)wherein Y is defined by the following formula: ##EQU1## and X is degree of polymerization of polyvinyl alcohol, (b) the viscosity of the adhesive measured by a Brookfield viscometer being from 200 to 6000 centipoises at 85.degree. C.
    Type: Grant
    Filed: November 29, 1988
    Date of Patent: March 6, 1990
    Assignees: Kuraray Co., Ltd., Rengo Co., Ltd.
    Inventors: Masateru Tokuno, Kinichi Shirakawa, Takatoshi Koyakumaru, Takuji Okaya, Hiroji Kohno, Hiroyuki Onishi
  • Patent number: 4835198
    Abstract: Disclosed herein is a highly compatible polymer composition which comprises (A) starch, (B) vinyl alcohol polymer having an alkyl group of 4 to 50 carbon atoms at the terminal, and/or (C) polyvinyl alcohol. Disclosed also herein is a textile sizing agent having outstanding weavability which comprises (A) starch, (B) vinyl alcohol polymer having an alkyl group of 4 to 50 carbo atoms at the terminal, (C) polyvinyl alcohol, and (D) oil for textile sizing.
    Type: Grant
    Filed: May 28, 1987
    Date of Patent: May 30, 1989
    Assignee: Kuraray Co., Ltd.
    Inventors: Hiroji Kohno, Kohji Moritani, Toshiaki Sato, Junnosuke Yamauchi, Takuji Okaya
  • Patent number: 4824904
    Abstract: The present invention relates to resin compositions and laminates using saponified ethylene-vinyl acetate copolymers containing a polyether component. Formed products and laminates obtained from the resin compositions are flexible, excellent in flexural fatigue resistance and gas barrier properties and extremely useful as flexible laminates.
    Type: Grant
    Filed: March 19, 1987
    Date of Patent: April 25, 1989
    Assignee: Kuraray Co., Ltd.
    Inventors: Akimasa Aoyama, Takeshi Moritani, Kiyoshi Yonezu, Takuji Okaya
  • Patent number: 4824696
    Abstract: A process for production of corrugated board using an aqueous adhesive which contains polyvinyl alcohol and clay, or polyvinyl alcohol, clay and water-soluble boron compound, the ratio of clay to polyvinyl alcohol being in the range of 200 to 600 parts by weight based on 100 parts by weight of polyvinyl alcohol, the ratio of water-soluble boron compound being not more than 15 parts by weight based on 100 parts by weight of polyvinyl alcohol, the solid content of the adhesive being 25 to 60% by weight characterized in that(a) a polyvinyl alcohol concentration in the solution excluding solid other than polyvinyl alcohol from adhesive being in the region bounded by the following formulas:Y.gtoreq.-0.0014 X+9.4 (i)Y.ltoreq.-0.0061 X+26.3 (II)200.ltoreq.X.ltoreq.
    Type: Grant
    Filed: October 30, 1985
    Date of Patent: April 25, 1989
    Assignees: Kuraray Co., Ldt., Rengo Co., Ltd.
    Inventors: Masateru Tokumo, Kinichi Shirakawa, Takatoshi Koyakumaru, Takuji Okaya, Hiroyuki Onishi, Hiroji Kohno
  • Patent number: 4818787
    Abstract: The present invention provides a process for producing easily on an industrial scale a polyvinyl ester having a high degree of polymerization and PVA having a high degree of polymerization derived by saponification form such a polyvinyl ester. The process of this invention makes it possible to produce the desired product especially even when the polymerization is carried out until a high conversion to polymer is attained, as well as even when the polymerization is suspended while the conversion to polymer is still low.
    Type: Grant
    Filed: June 16, 1986
    Date of Patent: April 4, 1989
    Assignee: Kuraray Co., Ltd.
    Inventors: Toshiaki Sato, Junnosuke Yamauchi, Takuji Okaya
  • Patent number: 4818788
    Abstract: Disclosed herein is a new process for producing polyvinyl ester having a high degree of polymerization having an intrinsic viscosity not less than 1.5 dl/g, preferably not less than 2.2 dl/g, and most preferably higher than 3.2 dl/g, said process comprising subjecting vinyl ester monomer to low-temperature emulsion polymerization under specific conditions.Disclosed also herein is a new process for producing polyvinyl alcohol having a high degree of polymerization having an intrinsic viscosity not less than 1.5 dl/g, preferably not less than 2.2 dl/g, and most preferably higher than 3.2 dl/g, said process comprising saponifying in the usual way the polyvinyl ester obtained by low-temperature emulsion polymerization under specific conditions.
    Type: Grant
    Filed: July 29, 1987
    Date of Patent: April 4, 1989
    Assignee: Kuraray Co., Ltd.
    Inventors: Toshiaki Sato, Ken Yuki, Junnosuke Yamauchi, Takuji Okaya
  • Patent number: 4816544
    Abstract: Disclosed are novel polyamideimide elastomers obtained by reaction of carboxyl-telechelic polymer(s) having a molecular weight of 500 to 10,000 aromatic diisocyanate(s), trimellitic acid anhydride and a dicarboxylic acid having 4 to 18 carbon atoms in a particular proportion. The polyamideimide elastomers have excellent heat resistance, oil resistance and low temperature characteristics and have mechanical properties which are comparable to those of polyurethane elastomers. Further, the said elastomers have a particular characteristic that they may retain a rubber-like property even at a high temperature.
    Type: Grant
    Filed: May 11, 1988
    Date of Patent: March 28, 1989
    Assignee: Kuraray Co., Ltd.
    Inventors: Yukiatsu Komiya, Masao Ishida, Koji Hirai, Takuji Okaya
  • Patent number: 4810581
    Abstract: An adhesive resin composition useful for bonding a resin having gas barrier properties and a hydrophobic thermoplastic resin which comprises an ethylene-acrylate or methacrylate copolymer grafted with an ethylenic unsaturated carboxylic acid or its acid anhydride; and 0.02 to 0.6 equivalent to the ethylenic unsaturated carboxylic acid or its acid anhydride of a periodic table group Ia or IIa metal hydroxide, or said metal hydroxide and an ethylene-acrylate or methacrylate copolymer. A laminated material of a resin having gas barrier properties and a hydrophobic thermoplastic resin laminated with the adhesive resin composition and a resin composition comprising the adhesive resin composition, a resin having gas barrier properties and a hydrophobic thermoplastic resin are also disclosed.
    Type: Grant
    Filed: July 19, 1988
    Date of Patent: March 7, 1989
    Assignees: Kurarav Co., Ltd., Nippon Petrochemicals Co., Ltd.
    Inventors: Toshiyuki Akazawa, Takuji Okaya, Takashi Inoue, Toshitaka Kobayashi
  • Patent number: 4810755
    Abstract: An adhesive resin composition useful for bonding a resin having gas barrier properties and a hydrophobic thermoplastic resin which comprises an ethylene-acrylate or methacrylate copolymer grafted with an ethylenic unsaturated carboxylic acid or its acid anhydride; and 0.02 to 0.6 equivalent to the ethylenic unsaturated carboxylic acid or its acid anhydride of a periodic table group Ia or IIa metal hydroxide, or said metal hydroxide and an ethylene-acrylate or methacrylate copolymer. A laminated material of a resin having gas barrier properties and a hydrophobic thermoplastic resin laminated with the adhesive resin composition and a resin composition comprising the adhesive resin composition, a resin having gas barrier properties and a hydrophobic thermoplastic resin are also disclosed.
    Type: Grant
    Filed: February 12, 1987
    Date of Patent: March 7, 1989
    Assignees: Kuraray Co., Ltd., Nippon Petrochemical Co., Ltd.
    Inventors: Toshiyuki Akazawa, Takuji Okaya, Takashi Inoue, Toshitaka Kobayashi