Patents by Inventor Takuji Shimizu

Takuji Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6063893
    Abstract: A curing agent having less odor and providing a cured resin which is excellent in appearance, mechanical properties, water resistance and chemical resistance, and a one-component type humidity-curing resin composition having excellent storage stability and providing a cured matter which is excellent in appearance and physical properties. Specifically, provided are polyaminoamide or ketimine obtained by dehydration of 2,5- and/or 2,6-bis(aminomethyl)-bicyclo[2.2.1]heptane with carboxylic acids or ketones, a curing agent for epoxy resins using the same and a one-component type humidity-curing epoxy resin or urethane prepolymer composition containing the curing agent.
    Type: Grant
    Filed: May 26, 1998
    Date of Patent: May 16, 2000
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Minato Karasawa, Takeya Abe, Takuji Shimizu, Takeshi Iwaki
  • Patent number: 6002915
    Abstract: In an interactive on-line system, a registration management system mounted on a server 10 includes a teaching affairs management system which registers information on teaching subjects, teaching schedules and teachers, and a reservation management system includes a lecture booking system which provides a trainee of the information registered in the teaching affairs management system in an on-line state when the trainee books a lecture and manages the information on the teaching subject, teaching schedule and teacher selected by the trainee. According to the registration management system, the booking state of lectures or the like inputted from the terminal of each user and such service resources as the teaching subject, teaching schedule or the like which can be supplied to users are easily managed.
    Type: Grant
    Filed: April 14, 1997
    Date of Patent: December 14, 1999
    Assignee: Cyber School Japan Co., Ltd.
    Inventor: Takuji Shimizu
  • Patent number: 5789520
    Abstract: A curing agent having less odor and providing a cured resin which is excellent in appearance, mechanical properties, water resistance and chemical resistance, and a one-component type humidity-curing resin composition having excellent storage stability and providing a cured matter which is excellent in appearance and physical properties. Specifically, provided are polyaminoamide or ketimine obtained by dehydration of 2,5- and/or 2,6-bis(aminomethyl)-bicyclo?2.2.1!heptane with carboxylic acids or ketones, a curing agent for epoxy resins using the same and a one-component type humidity-curing epoxy resin or urethane prepolymer composition containing the curing agent.
    Type: Grant
    Filed: December 19, 1996
    Date of Patent: August 4, 1998
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Minato Karasawa, Takeya Abe, Takuji Shimizu, Takeshi Iwaki
  • Patent number: 5735081
    Abstract: The present invention is directed to provide an improved structure of a sash of the side door for automobiles, wherein rigidity of the door sash, hence rigidity of the side door as a whole, is augmented without increase in weight of the door sash, and without causing hindrance to the surrounding view. Such structure is realized by the box-shaped transverse sectional part (45) provided over the entire length of the door sash (4, 4A, 4B, 4C), of which the size (w) in the breadthwise direction of the vehicle is gradually changed, thereby progressively reducing thickness (W) of the door sash (4, 4A, 4B, 4C) in the breadthwise direction of the vehicle.
    Type: Grant
    Filed: November 13, 1996
    Date of Patent: April 7, 1998
    Inventors: Takashi Yamanaka, Takuji Shimizu
  • Patent number: 5631332
    Abstract: A curing agent for epoxy resins, prepared by reacting 2,5- and 2,6-bis(aminomethyl)-bicyclo[2.2.1]heptanes (1 equivalent of the active hydrogen in the amino group) with an epoxy resin (a reaction product of bisphenols or a novolak resin with epichlorohydrin; an epoxy equivalent of 150-300 g/eq.; two or more epoxy groups per molecule; bisphenol-A diglycidyl ether or bisphenol-F diglycidyl ether in particular)(0.025-0.50 equivalents of the epoxy group). The reaction temperature is 40.degree.-120.degree. C. The amount of the curing agent is within the range of 20-75 parts by weight relative to 100 parts by weight of an epoxy resin to be cured. The curing agent has a high curing rate at a room temperature, and the epoxy resins cured by it have a good appearance as well as excellent adhesion, water resistance, and chemical resistance. Therefore, the curing agent is suitable for paints, civil engineering and construction materials, adhesives, casting resins, laminates, etc.
    Type: Grant
    Filed: January 11, 1996
    Date of Patent: May 20, 1997
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Minato Karasawa, Takuji Shimizu