Patents by Inventor Takuma Ebata
Takuma Ebata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8440384Abstract: A compound has a partial structure shown by a following formula (1), wherein R1 represents a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 8 carbon atoms, R2 represents a substituted or unsubstituted hydrocarbon group having 1 to 8 carbon atoms, Rf represents a fluorine atom or a perfluoroalkyl group having 1 to 4 carbon atoms, L represents an integer from 0 to 4, n represents an integer from 0 to 10, and m represents an integer from 1 to 4.Type: GrantFiled: April 14, 2010Date of Patent: May 14, 2013Assignee: JSR CorporationInventors: Takuma Ebata, Tomoki Nagai
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Patent number: 8431324Abstract: A radiation-sensitive resin composition includes a resin, a radiation-sensitive acid generator, an acid diffusion controller, and a mixed solvent. The radiation-sensitive acid generator includes a compound (I) shown by a following general formula (I). The mixed solvent includes about 50 mass % to about 90 mass % of propylene glycol monomethyl ether acetate, wherein M+ represents a sulfonium cation or an iodonium cation, R represents a hydrogen atom or a hydrocarbon group having 1 to 8 carbon atoms, Rf represents a fluorine atom or a perfluoroalkyl group having 1 to 4 carbon atoms, n represents an integer from 1 to 10, and m represents an integer from 1 to 4.Type: GrantFiled: May 7, 2010Date of Patent: April 30, 2013Assignee: JSR CorporationInventors: Tsutomu Shimokawa, Takuma Ebata
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Patent number: 8273837Abstract: A radiation-sensitive resin composition which has high transparency to radiation, excelling in basic properties as a resist such as sensitivity, resolution, and pattern shape, and, in particular, exhibiting high resolution performance, excellent DOF and LER, and high resistance to a liquid medium used in liquid immersion lithography is provided. Also provided are a polymer which can be used in the composition, a novel compound useful for synthesizing the polymer, and a method of producing the composition.Type: GrantFiled: December 13, 2006Date of Patent: September 25, 2012Assignee: JSR CorporationInventors: Tomoki Nagai, Takuma Ebata, Nobuji Matsumura
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Patent number: 8026039Abstract: A radiation-sensitive resin composition includes a resin that includes a repeating unit shown by the following formula (1) and a solvent. The radiation-sensitive resin composition has an excellent performance as a radiation-sensitive acid generator, includes a resin that adversely affects the environment and a human body to only a small extent, and can form a resist film that has a high resolution and forms an excellent resist pattern. wherein R1 represents a hydrogen atom or the like, M+ represents a specific cation, and n represents an integer from 1 to 5.Type: GrantFiled: November 9, 2007Date of Patent: September 27, 2011Assignee: JSR CorporationInventors: Tomoki Nagai, Takuma Ebata, Makoto Shimizu
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Publication number: 20110223537Abstract: A radiation-sensitive resin composition includes a polymer, a photoacid generator, and an acid diffusion controller. The polymer includes a first repeating unit shown by a following formula (a-1). The acid diffusion controller includes at least one of a base shown by a following formula (C-1) and a photodegradable base, wherein each R1 represents a hydrogen atom or the like, R represents a monovalent group shown by an above formula (a?), each R19 represents a chain hydrocarbon group having 1 to 5 carbon atoms or the like, A represents a divalent chain hydrocarbon group having 1 to 30 carbon atoms or the like, and m and n are integers from 0 to 3 (m+n=1 to 3), wherein each of R2 and R3 represents a monovalent chain hydrocarbon group having 1 to 20 carbon atoms or the like.Type: ApplicationFiled: March 10, 2011Publication date: September 15, 2011Applicant: JSR CorporationInventors: Takuma Ebata, Hiroki Nakagawa, Yasuhiko Matsuda, Kazuki Kasahara, Kenji Hoshiko, Hiromitsu Nakashima, Norihiko Ikeda, Kaori Sakai, Saki Harada
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Publication number: 20110143279Abstract: A radiation-sensitive resin composition includes a sulfonate or sulfonic acid group-containing photoacid generator and a resin. The sulfonate or sulfonic acid group-containing photoacid generator includes a partial structure shown by a following formula (1), wherein R1 represents a substituted or unsubstituted linear or branched monovalent hydrocarbon group having 1 to 30 carbon atoms, a substituted or unsubstituted cyclic or partially cyclic monovalent hydrocarbon group having 3 to 30 carbon atoms, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms, or a substituted or unsubstituted cyclic monovalent organic group having 4 to 30 carbon atoms that include a hetero atom.Type: ApplicationFiled: January 13, 2011Publication date: June 16, 2011Applicant: JSR CorporationInventors: Tsutomu SHIMOKAWA, Takuma Ebata, Kaori Sakai, Yoshifumi Oizumi, Akimasa Soyano, Noboru Otsuka
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Patent number: 7956142Abstract: A resin that includes a repeating unit shown by the following formula (10) has an excellent performance as a radiation sensitive acid generator, and exhibits only a small adverse effect on the environment and a human body. wherein R1 represents a hydrogen atom or the like, M+ represents a specific cation, and n is an integer from 1 to 5.Type: GrantFiled: November 9, 2007Date of Patent: June 7, 2011Assignees: JSR Corporation, Central Glass Co., Ltd.Inventors: Tomoki Nagai, Takuma Ebata, Makoto Shimizu, Jonathan Joachim Jodry, Satoru Narizuka, Masaki Fujiwara
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Patent number: 7897821Abstract: A compound is shown by the following formula (5) in which at least one of Rf groups represents a fluorine atom or a linear or branched perfluoroalkyl group having 1 to 10 carbon atoms, A? represents a substituted or unsubstituted, linear or branched alkylene group having 1 to 20 carbon atoms, an alkylene group having at least one hetero atom, or a single bond, G represents a divalent organic group having a fluorine atom or a single bond, Mm+ represents an onium cation, m represents a natural number of 1 to 3, and p represents a natural number of 1 to 8.Type: GrantFiled: August 31, 2010Date of Patent: March 1, 2011Assignee: JSR CorporationInventors: Tomoki Nagai, Eiji Yoneda, Takuma Ebata, Takanori Kawakami, Makoto Sugiura, Tsutomu Shimokawa, Makoto Shimizu
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Publication number: 20100324329Abstract: A compound is shown by the following formula (5) in which at least one of Rf groups represents a fluorine atom or a linear or branched perfluoroalkyl group having 1 to 10 carbon atoms, A? represents a substituted or unsubstituted, linear or branched alkylene group having 1 to 20 carbon atoms, an alkylene group having at least one hetero atom, or a single bond, G represents a divalent organic group having a fluorine atom or a single bond, Mm+ represents an onium cation, m represents a natural number of 1 to 3, and p represents a natural number of 1 to 8.Type: ApplicationFiled: August 31, 2010Publication date: December 23, 2010Applicant: JSR CorporationInventors: Tomoki Nagai, Eiji Yoneda, Takuma Ebata, Takanori Kawakami, Makoto Sugiura, Tsutomu Shimokawa, Makoto Shimizu
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Publication number: 20100285405Abstract: A radiation-sensitive resin composition includes a resin, a radiation-sensitive acid generator, an acid diffusion controller, and a mixed solvent. The radiation-sensitive acid generator includes a compound (I) shown by a following general formula (I). The mixed solvent includes about 50 mass % to about 90 mass % of propylene glycol monomethyl ether acetate, wherein M+ represents a sulfonium cation or an iodonium cation, R represents a hydrogen atom or a hydrocarbon group having 1 to 8 carbon atoms, Rf represents a fluorine atom or a perfluoroalkyl group having 1 to 4 carbon atoms, n represents an integer from 1 to 10, and m represents an integer from 1 to 4.Type: ApplicationFiled: May 7, 2010Publication date: November 11, 2010Applicant: JSR CorporationInventors: Tsutomu SHIMOKAWA, Takuma Ebata
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Patent number: 7812105Abstract: A radiation-sensitive resin composition is provided which has high transparency to radiation, excelling in basic properties as a resist such as sensitivity, resolution, and pattern shape, and, in particular, a high resolution radiation-sensitive resin composition providing a wide DOF and excelling in LER. Also provided are a polymer which can be used in the composition and a novel compound useful for synthesizing the polymer. The novel compound is shown by the following formula (2), wherein R4 represents a methyl group, a trifluoromethyl group, or a hydrogen atom, at least one of the Rfs represents a fluorine atom or a linear or branched perfluoroalkyl group having 1 to 10 carbon atoms, A represents a divalent organic group or a single bond, G represents a divalent organic group having a fluorine atom or a single bond, Mm+ represents a metal ion or an onium cation, m represents an integer of 1 to 3, and p is an integer of 1 to 8.Type: GrantFiled: May 11, 2006Date of Patent: October 12, 2010Assignee: JSR CorporationInventors: Tomoki Nagai, Eiji Yoneda, Takuma Ebata, Takanori Kawakami, Makoto Sugiura, Tsutomu Shimokawa, Makoto Shimizu
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Publication number: 20100255420Abstract: A radiation-sensitive resin composition includes a polymer, an acid-labile group-containing resin, a radiation-sensitive acid generator, and a solvent, the polymer including repeating units shown by following general formulas (1) and (2). wherein R1 and R2 represent a hydrogen atom, a methyl group, or a trifluoromethyl group, R3 represents a linear or branched alkyl group having 1 to 6 carbon atoms or an alicyclic hydrocarbon group having 4 to 20 carbon atoms in which at least one hydrogen atom is substituted with a fluorine atom, or a derivative thereof, and Z represents a group that includes a group that generates an acid upon exposure to light. The radiation-sensitive resin composition produces an excellent pattern shape, reduces the amount of elution into an immersion liquid upon contact during liquid immersion lithography, ensures that a high receding contact angle is formed by a resist film and an immersion liquid, and rarely causes development defects.Type: ApplicationFiled: October 21, 2008Publication date: October 7, 2010Applicant: JSR CORPORATIONInventors: Hirokazu Sakakibara, Makoto Shimizu, Takehiko Naruoka, Yoshifumi Ooizumi, Kentarou Harada, Takuma Ebata
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Publication number: 20100221659Abstract: A compound has a partial structure shown by a following formula (1), wherein R1 represents a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 8 carbon atoms, R2 represents a substituted or unsubstituted hydrocarbon group having 1 to 8 carbon atoms, Rf represents a fluorine atom or a perfluoroalkyl group having 1 to 4 carbon atoms, L represents an integer from 0 to 4, n represents an integer from 0 to 10, and m represents an integer from 1 to 4.Type: ApplicationFiled: April 14, 2010Publication date: September 2, 2010Applicant: JSR CorporationInventors: Takuma Ebata, Tomoki Nagai
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Publication number: 20100063232Abstract: A resin that includes a repeating unit shown by the following formula (10) has an excellent performance as a radiation sensitive acid generator, and exhibits only a small adverse effect on the environment and a human body. wherein R1 represents a hydrogen atom or the like, M+ represents a specific cation, and n is an integer from 1 to 5.Type: ApplicationFiled: November 9, 2007Publication date: March 11, 2010Applicants: JSR CORPORATION, CENTRAL GLASS CO., LTD.Inventors: Tomoki Nagai, Takuma Ebata, Makoto Shimizu, Jonathan Joachim Jodry, Satoru Narizuka, Masaki Fujiwara
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Publication number: 20100040977Abstract: A radiation-sensitive resin composition includes a resin that includes a repeating unit shown by the following formula (1) and a solvent. The radiation-sensitive resin composition has an excellent performance as a radiation-sensitive acid generator, includes a resin that adversely affects the environment and a human body to only a small extent, and can form a resist film that has a high resolution and forms an excellent resist pattern. wherein R1 represents a hydrogen atom or the like, M+ represents a specific cation, and n represents an integer from 1 to 5.Type: ApplicationFiled: November 9, 2007Publication date: February 18, 2010Applicant: JSR CorporationInventors: Tomoki Nagai, Takuma Ebata, Makoto Shimizu
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Publication number: 20090318652Abstract: A radiation-sensitive resin composition which has high transparency to radiation, excelling in basic properties as a resist such as sensitivity, resolution, and pattern shape, and, in particular, exhibiting high resolution performance, excellent DOF and LER, and high resistance to a liquid medium used in liquid immersion lithography is provided. Also provided are a polymer which can be used in the composition, a novel compound useful for synthesizing the polymer, and a method of producing the composition.Type: ApplicationFiled: December 13, 2006Publication date: December 24, 2009Applicant: JSR CORPORATIONInventors: Tomoki Nagai, Takuma Ebata, Nobuji Matsumura
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Publication number: 20090069521Abstract: A radiation-sensitive resin composition is provided which has high transparency to radiation, excelling in basic properties as a resist such as sensitivity, resolution, and pattern shape, and, in particular, a high resolution radiation-sensitive resin composition providing a wide DOF and excelling in LER. Also provided are a polymer which can be used in the composition and a novel compound useful for synthesizing the polymer. The novel compound is shown by the following formula (2), wherein R4 represents a methyl group, a trifluoromethyl group, or a hydrogen atom, at least one of the Rfs represents a fluorine atom or a linear or branched perfluoroalkyl group having 1 to 10 carbon atoms, A represents a divalent organic group or a single bond, G represents a divalent organic group having a fluorine atom or a single bond, Mm+ represents a metal ion or an onium cation, m represents an integer of 1 to 3, and p is an integer of 1 to 8.Type: ApplicationFiled: May 11, 2006Publication date: March 12, 2009Applicant: JSR CORPORATIONInventors: Tomoki Nagai, Eiji Yoneda, Takuma Ebata, Takanori Kawakami, Makoto Sugiura, Tsutomu Shimokawa, Makoto Shimizu