Patents by Inventor Takuma HANAOKA

Takuma HANAOKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230416450
    Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains metaxylylenediamine and paraxylylenediamine at a mass ratio of 99/1 to 51/49, an epoxy resin composition, and a paint and an adhesive containing these.
    Type: Application
    Filed: September 10, 2021
    Publication date: December 28, 2023
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takuma HANAOKA, Kazuki KOUNO, Yuma OHNO
  • Patent number: 11572436
    Abstract: Provided is a curing agent for a water-based epoxy resin, which contains the following component (A) and component (B): (A); at least one selected from the group consisting of a polyamide amine-based curing agent (a1), a reaction product (a2) of a polyamine compound and a polyepoxy compound, and a Mannich reaction product (a3) of a polyamine compound, a phenol compound, and an aldehyde compound; (B): at least one selected from the group consisting of a reaction product (b1) of styrene and an amine compound represented by the following formula (1), and a reaction product (b2) of epichlorohydrin and an amine compound represented by the following formula (1); H2N—CH2-A-CH2—NH2??(1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: February 7, 2023
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventor: Takuma Hanaoka
  • Patent number: 11319405
    Abstract: A curing agent for a water-based epoxy resin, including a reaction composition (A) containing a reaction product of styrene and an amine compound represented by the following formula (1), a water-based epoxy resin composition containing the same, and a cured product thereof. H2N—CH2-A-CH2—NH2??(1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: May 3, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yuiga Asai, Takuma Hanaoka
  • Publication number: 20220010054
    Abstract: Provided is a water-based epoxy resin composition and a cured product thereof, the water-based epoxy resin composition obtained by blending a water-based epoxy resin (A) and a curing agent composition (B) containing a reaction product (b1) of epichlorohydrin and an amine compound represented by the following formula (1), the water-based epoxy resin composition having a content ratio of the component (A) and the component (B) defined as [number of epoxy groups in component (A)/number of active amine hydrogens in component (B)] of 1/1.1 to 1/0.3: H2N—CH2—A—CH2—NH2 ??(1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.
    Type: Application
    Filed: November 1, 2019
    Publication date: January 13, 2022
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventor: Takuma HANAOKA
  • Patent number: 10941242
    Abstract: Provided are an amine compound represented by the following formula (1), which has a low active hydrogen equivalent weight and thus is capable of providing a cured product having good properties because the amine compound has sufficient curability even though the amount of amine compound blended in an epoxy resin composition is small when the amine compound is used as an epoxy resin curing agent, and an amine composition and an epoxy resin curing agent, which contain the compound: wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: March 9, 2021
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Saeko Sato, Yuiga Asai, Tomotaka Wada, Takuma Hanaoka
  • Publication number: 20210054135
    Abstract: Provided is a curing agent for a water-based epoxy resin, which contains the following component (A) and component (B): (A); at least one selected from the group consisting of a polyamide amine-based curing agent (a1), a reaction product (a2) of a polyamine compound and a polyepoxy compound, and a Mannich reaction product (a3) of a polyamine compound, a phenol compound, and an aldehyde compound; (B): at least one selected from the group consisting of a reaction product (b1) of styrene and an amine compound represented by the following formula (1), and a reaction product (b2) of epichlorohydrin and an amine compound represented by the following formula (1); H2N—CH2-A-CH2—NH2??(1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.
    Type: Application
    Filed: April 10, 2019
    Publication date: February 25, 2021
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventor: Takuma HANAOKA
  • Publication number: 20190256645
    Abstract: A curing agent for a water-based epoxy resin, including a reaction composition (A) containing a reaction product of styrene and an amine compound represented by the following formula (1), a water-based epoxy resin composition containing the same, and a cured product thereof. H2N—CH2-A-CH2—NH2??(1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.
    Type: Application
    Filed: October 26, 2017
    Publication date: August 22, 2019
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yuiga ASAI, Takuma HANAOKA
  • Publication number: 20190112416
    Abstract: Provided are an amine compound represented by the following formula (1), which has a low active hydrogen equivalent weight and thus is capable of providing a cured product having good properties because the amine compound has sufficient curability even though the amount of amine compound blended in an epoxy resin composition is small when the amine compound is used as an epoxy resin curing agent, and an amine composition and an epoxy resin curing agent, which contain the compound: wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.
    Type: Application
    Filed: April 4, 2017
    Publication date: April 18, 2019
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Saeko SATO, Yuiga ASAI, Tomotaka WADA, Takuma HANAOKA