Patents by Inventor Takuma HITOTSUMATSU

Takuma HITOTSUMATSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cover film for flexible printed circuit board and flexible printed circuit board
    Patent number: 11477884
    Abstract: According to one aspect of the present disclosure, a cover film for a flexible printed circuit board includes: an adhesive layer; and a protective layer that is layered on a surface of the adhesive layer, wherein a lamination temperature range in which a ratio of a viscosity of the protective layer to a viscosity of the adhesive layer is five times or more is present within a temperature range of 50° C. or more and 150° C. or less.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: October 18, 2022
    Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Takuma Hitotsumatsu, Hideki Kashihara
  • COVER FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD
    Publication number: 20210014968
    Abstract: According to one aspect of the present disclosure, a cover film for a flexible printed circuit board includes: an adhesive layer; and a protective layer that is layered on a surface of the adhesive layer, wherein a lamination temperature range in which a ratio of a viscosity of the protective layer to a viscosity of the adhesive layer is five times or more is present within a temperature range of 50° C. or more and 150° C. or less.
    Type: Application
    Filed: April 3, 2019
    Publication date: January 14, 2021
    Inventors: Takuma HITOTSUMATSU, Hideki KASHIHARA