Patents by Inventor Takuma KOGAWA

Takuma KOGAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240068884
    Abstract: A thermosensitive part sensing temperature; a temperature sensor for measurement provided in the unit and measuring temperature by contacting the unit with a body to be measured; a temperature detecting part detecting, from when the unit contacts the body, the time when the sensor senses a difference from an initial temperature of the sensor, and a measured temperature of the sensor at that time, and detecting, from when the difference is sensed, a time after a certain length of time and a measured temperature of the sensor at that time; an estimating part estimating, from the time when the difference is sensed and a time after a certain length of time, the time when the thermosensitive part contacts the body, and the measured temperature at that time; and a heat conduction analyzing part estimating the measured temperature based on output information from the temperature detecting part and the estimating part.
    Type: Application
    Filed: January 12, 2022
    Publication date: February 29, 2024
    Applicants: SEMITEC Corporation, National Institute of Technology, HIROSAKI UNIVERSITY
    Inventors: Shigenao MARUYAMA, Yuya ISEKI, Takuma KOGAWA, Takashi NONAKA, Yasushi HOSOKAWA, Takahiro OKABE, Yutaro TABATA, Tadashi MATSUDATE, Toshinori NAKAJIMA, Masaya HIGASHI, Manabu ORITO
  • Publication number: 20230296447
    Abstract: A temperature measurement device (10) comprises: a thermosensitive unit (41) that senses temperature; a thin film thermosensitive element (1) for measurement capable of measuring the temperature by bringing the thermosensitive unit (41) into contact with a subject; a thin film thermosensitive element (2) for protective heating disposed to enable heat exchange with the thin film thermosensitive element (1) via an insulating layer (S1), and controlled so that the temperature thereof is equal to the temperature of the thin film thermosensitive element (1); a temperature control element (3) capable of causing the thin film thermosensitive element (1) to be in a temperature state in which the temperature thereof is a certain degree lower than the temperature of the subject; and a control processing unit (5) controlling the thin film thermosensitive element (1), the thin film thermosensitive element (2), and the temperature control element (3).
    Type: Application
    Filed: June 15, 2021
    Publication date: September 21, 2023
    Applicants: SEMITEC Corporation, National Institute of Technology, HIROSAKI UNIVERSITY
    Inventors: Shigenao MARUYAMA, Takahiro OKABE, Yuya ISEKI, Takashi NONAKA, Takuma KOGAWA, Yasushi HOSOKAWA, Yutaro TABATA, Tadashi MATSUDATE, Toshinori NAKAJIMA, Masaya HIGASHI, Manabu ORITO