Abstract: A method for manufacturing a grinding wheel which is formed by fitting a cylindrical grindstone chip including abrasive grains to a base metal formed to be of a columnar shape, comprises an adhesive agent applying step, a linear guide member arranging step for arranging and attaching a plurality of linear guide members on at least one of the outer peripheral surface of the base metal and the inner peripheral surface of the cylindrical grindstone chip, in parallel with a rotation axis of the base metal and with an equal distance separated in a circumferential direction from one another and a base metal and grindstone chip fitting step for fitting the base metal and the cylindrical grindstone chip to each other by relatively moving the base metal and the cylindrical grindstone chip, interposing therebetween the plurality of linear guide members arranged and attached with the equal distance separated from one another.

Abstract: The abrasive grinding wheel includes an annular abrasive grain layer formed by a diamond abrasive grain or CBN abrasive grain and fixed to an outer peripheral surface of a cylindrical grinding wheel core by an adhesive agent. The abrasive grinding wheel further includes a waterproof agent applied on both side end surfaces and an inner peripheral surface of the cylindrical grinding wheel core in order to prevent any water ingress into the inside of the core.

Abstract: A method for manufacturing a grinding wheel which is formed by fitting a cylindrical grindstone chip including abrasive grains to a base metal formed to be of a columnar shape, comprises an adhesive agent applying step, a linear guide member arranging step for arranging and attaching a plurality of linear guide members on at least one of the outer peripheral surface of the base metal and the inner peripheral surface of the cylindrical grindstone chip, in parallel with a rotation axis of the base metal and with an equal distance separated in a circumferential direction from one another and a base metal and grindstone chip fitting step for fitting the base metal and the cylindrical grindstone chip to each other by relatively moving the base metal and the cylindrical grindstone chip, interposing therebetween the plurality of linear guide members arranged and attached with the equal distance separated from one another.

Abstract: The abrasive grinding wheel includes an annular abrasive grain layer formed by a diamond abrasive grain or CBN abrasive grain and fixed to an outer peripheral surface of a cylindrical grinding wheel core by an adhesive agent. The abrasive grinding wheel further includes a waterproof agent applied on both side end surfaces and an inner peripheral surface of the cylindrical grinding wheel core in order to prevent any water ingress into the inside of the core.

Abstract: A plurality of segmented chips are reinforced by applying an adhesive to the circumferentially opposite end portions thereof, and the adjoining segmented chips adjoining in the circumferential direction are adhered to the circumferential surface of a disc-like core with the adhesives at the circumferentially opposite end portions being not jointed with each other. Thus, the segmented chips can be prevented from being loaded with an unnatural force even when the disc-like core with the segmented chips adhered thereto expands and contracts radially due to thermal expansion and thermal contract. Thereby, expansion and contraction of the disc-like core do not impose a compression stress or the like on adhesives situated between adjoining segmented chips.

Abstract: A plurality of segmented chips are reinforced by applying an adhesive to the circumferentially opposite end portions thereof, and the adjoining segmented chips adjoining in the circumferential direction are adhered to the circumferential surface of a disc-like core with the adhesives at the circumferentially opposite end portions being not jointed with each other. Thus, the segmented chips can be prevented from being loaded with an unnatural force even when the disc-like core with the segmented chips adhered thereto expands and contracts radially due to thermal expansion and thermal contract. Thereby, expansion and contraction of the disc-like core do not impose a compression stress or the like on adhesives situated between adjoining segmented chips.