Patents by Inventor Takuma Onda

Takuma Onda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9499885
    Abstract: A Cu—Co—Si alloy having an improved balance between electrical conductivity and strength is provided. Disclosed is a copper alloy for electronic materials, which contains 0.5% to 4.0% by mass of Co and 0.1% to 1.2% by mass of Si, with the balance being Cu and unavoidable impurities, and in which the mass % ratio of Co and Si (Co/Si) is 3.5?Co/Si?5.5, an area ratio of discontinuous precipitation (DP) cells is 5% or less, and an average value of a maximum width of discontinuous precipitation (DP) cells is 2 ?m or less.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: November 22, 2016
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Takuma Onda
  • Publication number: 20130180630
    Abstract: A Cu—Co—Si-based alloy that has even mechanical properties and that is provided with favorable mechanical and electrical properties as a copper alloy for an electronic material is provided. The copper alloy for an electronic material comprises 0.5% by mass to 3.0% by mass of Co, 0.1% by mass to 1.0% by mass of Si, and the balance Cu with inevitable impurities. An average grain size is in the range of 3 ?m to 15 ?m and an average difference between a maximum grain size and a minimum grain size in every observation field of 0.05 mm2 is 5 ?m or less.
    Type: Application
    Filed: September 6, 2011
    Publication date: July 18, 2013
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventors: Yasuhiro Okafuji, Takuma Onda, Hiroshi Kuwagaki
  • Publication number: 20130098511
    Abstract: A Cu—Co—Si alloy having an improved balance between electrical conductivity and strength is provided. Disclosed is a copper alloy for electronic materials, which contains 0.5% to 4.0% by mass of Co and 0.1% to 1.2% by mass of Si, with the balance being Cu and unavoidable impurities, and in which the mass % ratio of Co and Si (Co/Si) is 3.5?Co/Si?5.5, an area ratio of discontinuous precipitation (DP) cells is 5% or less, and an average value of a maximum width of discontinuous precipitation (DP) cells is 2 ?m or less.
    Type: Application
    Filed: April 8, 2011
    Publication date: April 25, 2013
    Applicant: JX Nippon Mining & Metals Corporation
    Inventor: Takuma Onda
  • Publication number: 20120031533
    Abstract: The present invention provides Cu—Co—Si system alloys that have desirable mechanical and electrical characteristics as a copper alloy for electronic materials, and have uniform mechanical characteristics. The copper alloys for electronic materials contain 0.5 to 4.0 mass % Co, 0.1 to 1.2 mass % Si, and the balance being Cu and unavoidable impurities. An average grain size is 15 to 30 ?m and an average difference between maximum grain size and minimum grain size in every observation field of 0.5 mm2 is not more than 10 ?m.
    Type: Application
    Filed: February 17, 2010
    Publication date: February 9, 2012
    Applicant: JX Nippon Mining & Metals Corporation
    Inventors: Takuma Onda, Hiroshi Kuwagaki