Patents by Inventor Takuma SHIMOICHI
Takuma SHIMOICHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11410985Abstract: The present invention provides a chip component that achieves outstanding LC characteristics. The present invention provides a chip component (1), including: a substrate (12); an inorganic insulating layer (13), formed on the substrate (12); an organic insulating layer (14), formed on the inorganic insulating layer (13); and an LC circuit (6), including a first capacitor (C1) formed in the inorganic insulating layer (13), and a first inductor (L1) formed, in a manner of being electrically connected to the first capacitor (C1), in the organic insulating layer (14).Type: GrantFiled: June 11, 2020Date of Patent: August 9, 2022Assignee: FUJI ELECTRIC CO., LTD.Inventor: Takuma Shimoichi
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Publication number: 20210350970Abstract: A chip inductor includes a sealing body having a mounting surface and a coil conductor sealed in an interior of the sealing body, wherein the coil conductor includes a first coil end exposed from the mounting surface of the sealing body, a second coil end exposed from the mounting surface of the sealing body, and a spiral portion of spiral form connected to the first coil end and the second coil end and routed along a normal direction of the mounting surface of the sealing body from the first coil end and the second coil end.Type: ApplicationFiled: July 21, 2021Publication date: November 11, 2021Inventor: Takuma SHIMOICHI
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Patent number: 11094447Abstract: A chip inductor includes a sealing body having a mounting surface and a coil conductor sealed in an interior of the sealing body, wherein the coil conductor includes a first coil end exposed from the mounting surface of the sealing body, a second coil end exposed from the mounting surface of the sealing body, and a spiral portion of spiral form connected to the first coil end and the second coil end and routed along a normal direction of the mounting surface of the sealing body from the first coil end and the second coil end.Type: GrantFiled: March 29, 2018Date of Patent: August 17, 2021Assignee: ROHM CO., LTD.Inventor: Takuma Shimoichi
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Publication number: 20200395353Abstract: The present invention provides a chip component that achieves outstanding LC characteristics. The present invention provides a chip component (1), including: a substrate (12); an inorganic insulating layer (13), formed on the substrate (12); an organic insulating layer (14), formed on the inorganic insulating layer (13); and an LC circuit (6), including a first capacitor (C1) formed in the inorganic insulating layer (13), and a first inductor (L1) formed, in a manner of being electrically connected to the first capacitor (C1), in the organic insulating layer (14).Type: ApplicationFiled: June 11, 2020Publication date: December 17, 2020Applicant: ROHM CO., LTD.Inventor: Takuma SHIMOICHI
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Patent number: 10706993Abstract: A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.Type: GrantFiled: September 13, 2017Date of Patent: July 7, 2020Assignee: ROHM CO., LTD.Inventors: Takuma Shimoichi, Yasuhiro Kondo, Keishi Watanabe, Takamichi Torii, Katsuya Matsuura
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Patent number: 10586774Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.Type: GrantFiled: October 27, 2017Date of Patent: March 10, 2020Assignee: ROHM CO., LTD.Inventors: Takuma Shimoichi, Yasuhiro Kondo
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Patent number: 10566126Abstract: A chip inductor includes a substrate having a main surface, an insulating layer covering the main surface of the substrate, an external terminal formed on the insulating layer, and a coil conductor of a spiral-shape routed to a region outside the external terminal and a region facing the external terminal at the main surface of the substrate.Type: GrantFiled: September 13, 2017Date of Patent: February 18, 2020Assignee: ROHM CO., LTD.Inventor: Takuma Shimoichi
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Publication number: 20190304663Abstract: The present technology provides a chip inductor of which the height can be reduced. The chip inductor includes a sealing resin having a mounting face; a coil conductor disposed in the sealing resin, including an inner end and an outer end, and spirally wound; an inner terminal disposed on the mounting face, and electrically connected to the inner end; and an outer terminal disposed on the mounting face and electrically connected to the outer end.Type: ApplicationFiled: March 29, 2019Publication date: October 3, 2019Inventor: TAKUMA SHIMOICHI
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Publication number: 20180286561Abstract: A chip inductor includes a sealing body having a mounting surface and a coil conductor sealed in an interior of the sealing body, wherein the coil conductor includes a first coil end exposed from the mounting surface of the sealing body, a second coil end exposed from the mounting surface of the sealing body, and a spiral portion of spiral form connected to the first coil end and the second coil end and routed along a normal direction of the mounting surface of the sealing body from the first coil end and the second coil end.Type: ApplicationFiled: March 29, 2018Publication date: October 4, 2018Applicant: ROHM CO., LTD.Inventor: Takuma SHIMOICHI
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Publication number: 20180082775Abstract: A chip inductor includes a substrate having a main surface, an insulating layer covering the main surface of the substrate, an external terminal formed on the insulating layer, and a coil conductor of a spiral-shape routed to a region outside the external terminal and a region facing the external terminal at the main surface of the substrate.Type: ApplicationFiled: September 13, 2017Publication date: March 22, 2018Applicant: ROHM CO., LTD.Inventor: Takuma SHIMOICHI
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Publication number: 20180053736Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.Type: ApplicationFiled: October 27, 2017Publication date: February 22, 2018Applicant: ROHM CO., LTD.Inventors: Takuma SHIMOICHI, Yasuhiro KONDO
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Publication number: 20180005732Abstract: A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.Type: ApplicationFiled: September 13, 2017Publication date: January 4, 2018Applicant: ROHM CO., LTD.Inventors: Takuma SHIMOICHI, Yasuhiro KONDO, Keishi WATANABE, Takamichi TORII, Katsuya MATSUURA
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Patent number: 9812412Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.Type: GrantFiled: December 28, 2015Date of Patent: November 7, 2017Assignee: ROHM CO., LTD.Inventors: Takuma Shimoichi, Yasuhiro Kondo
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Patent number: 9773588Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.Type: GrantFiled: May 15, 2015Date of Patent: September 26, 2017Assignee: ROHM CO., LTD.Inventors: Takuma Shimoichi, Yasuhiro Kondo, Keishi Watanabe, Takamichi Torii, Katsuya Matsuura
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Publication number: 20160190076Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.Type: ApplicationFiled: December 28, 2015Publication date: June 30, 2016Applicant: ROHM CO., LTD.Inventors: Takuma SHIMOICHI, Yasuhiro KONDO
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Publication number: 20150332842Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.Type: ApplicationFiled: May 15, 2015Publication date: November 19, 2015Applicant: ROHM CO., LTD.Inventors: Takuma SHIMOICHI, Yasuhiro KONDO, Keishi WATANABE, Takamichi TORII, Katsuya MATSUURA