Patents by Inventor Takuma SUGAI

Takuma SUGAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting resin composition, coverlay film, adhesive sheet, and flexible printed wiring board
    Patent number: 11884815
    Abstract: A thermosetting resin composition contains a solid epoxy resin that is solid at 25° C. a non-solid epoxy resin that is non-solid at 25° C., particulate rubber dispersed in the non-solid epoxy resin, a curing agent, an inorganic filler, and polycarbonate diol-derived polyurethane. The content of the particulate rubber is from 3 to 15 parts by mass with respect to the total parts by mass of the solid epoxy resin and the non-solid epoxy resin, the acid value of the polycarbonate diol-derived polyurethane is from 10 to 30 mgKOH/g, and the weight average molecular weight of the polycarbonate diol-derived polyurethane is from 15,000 to 50,000.
    Type: Grant
    Filed: July 5, 2021
    Date of Patent: January 30, 2024
    Assignee: ARISAWA MFG. CO., LTD.
    Inventors: Takashi Gondaira, Katsuhiko Furukawa, Shota Abe, Takuma Sugai
  • THERMOSETTING RESIN COMPOSITION, COVERLAY FILM, ADHESIVE SHEET, AND FLEXIBLE PRINTED WIRING BOARD
    Publication number: 20230134682
    Abstract: A thermosetting resin composition contains a solid epoxy resin that is solid at 25° C., a non-solid epoxy resin that is non-solid at 25° C., particulate rubber dispersed in the non-solid epoxy resin, a curing agent, an inorganic filler, and polycarbonate diol-derived polyurethane. The content of the particulate rubber is from 3 to 15 parts by mass with respect to the total parts by mass of the solid epoxy resin and the non-solid epoxy resin, the acid value of the polycarbonate diol-derived polyurethane is from 10 to 30 mgKOH/g, and the weight average molecular weight of the polycarbonate diol-derived polyurethane is from 15,000 to 50,000.
    Type: Application
    Filed: July 5, 2021
    Publication date: May 4, 2023
    Inventors: Takashi GONDAIRA, Katsuhiko FURUKAWA, Shota ABE, Takuma SUGAI