Patents by Inventor Takuma Takimoto

Takuma Takimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11925027
    Abstract: A semiconductor structure includes a memory array including first and second bit lines and a sense amplifier circuit. The sense amplifier circuit includes a first sense amplifier array containing first active sense amplifier transistors that each have an active region having a first width, where the first active sense amplifier transistors are electrically connected to the first bit lines, and a second sense amplifier array including second active sense amplifier transistors that each have the active region having the first width, where the second active sense amplifier transistors are electrically connected to the second bit lines, and dummy active regions which are electrically inactive located between columns of the second active sense amplifier transistors.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: March 5, 2024
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: Takuma Takimoto, Masayuki Hiroi, Hiroyuki Ogawa, Masatoshi Okumura
  • Publication number: 20230209832
    Abstract: A semiconductor structure includes a memory array including first and second bit lines and a sense amplifier circuit. The sense amplifier circuit includes a first sense amplifier array containing first active sense amplifier transistors that each have an active region having a first width, where the first active sense amplifier transistors are electrically connected to the first bit lines, and a second sense amplifier array including second active sense amplifier transistors that each have the active region having the first width, where the second active sense amplifier transistors are electrically connected to the second bit lines, and dummy active regions which are electrically inactive located between columns of the second active sense amplifier transistors.
    Type: Application
    Filed: December 27, 2021
    Publication date: June 29, 2023
    Inventors: Takuma TAKIMOTO, Masayuki HIROI, Hiroyuki OGAWA, Masatoshi OKUMURA
  • Patent number: 11508749
    Abstract: A semiconductor structure includes a first-conductivity-type well located in a semiconductor substrate, a semiconductor active area region located adjacent to the a first-conductivity-type well, a first transistor including a source region, a drain region, a channel region located between the source region and the drain region, a gate dielectric layer located over the channel region and a gate electrode located over the gate dielectric layer, such that the transistor is located on the semiconductor active area region, and a cutoff gate electrode located over the semiconductor active area region, and between the first transistor and the first-conductivity-type well.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: November 22, 2022
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: Takuma Takimoto, Masayuki Hiroi, Akira Inoue
  • Publication number: 20210391351
    Abstract: A semiconductor structure includes a first-conductivity-type well located in a semiconductor substrate, a semiconductor active area region located adjacent to the a first-conductivity-type well, a first transistor including a source region, a drain region, a channel region located between the source region and the drain region, a gate dielectric layer located over the channel region and a gate electrode located over the gate dielectric layer, such that the transistor is located on the semiconductor active area region, and a cutoff gate electrode located over the semiconductor active area region, and between the first transistor and the first-conductivity-type well.
    Type: Application
    Filed: June 15, 2020
    Publication date: December 16, 2021
    Inventors: Takuma TAKIMOTO, Masayuki HIROI, Akira INOUE
  • Patent number: 11004974
    Abstract: A semiconductor structure includes a source region, a drain region, a channel region located between the source region and the drain region, a gate stack structure including a gate dielectric and a gate electrode that overlies the gate dielectric, such that a first gap region is present between an area of the source region and an area of the gate electrode in a plan view and a second gap region is present between an area of the drain region and the area of the gate electrode in the plan view, a contact-level dielectric layer overlying the source region and the drain region and laterally surrounding the gate stack structure, and at least one assist-field metallic plate located vertically above a top surface of the gate electrode and having an areal overlap with at least one of the first gap region and the second gap region in the plan view.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: May 11, 2021
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventor: Takuma Takimoto