Patents by Inventor Takuma Tsubota

Takuma Tsubota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
    Publication number: 20220033317
    Abstract: There is provided an aluminum/ceramic bonding substrate having a ceramic substrate, an aluminum plate of an aluminum alloy which is bonded directly to one side of the ceramic substrate, an aluminum base plate of the aluminum alloy which is bonded directly to the other side of the ceramic substrate, and a plate-shaped reinforcing member which has a higher strength than that of the aluminum base plate and which is arranged in the aluminum base plate to be bonded directly to the aluminum base plate, wherein the aluminum alloy contains 0.01 to 0.2% by weight of magnesium, 0.01 to 0.1% by weight of silicon, and the balance being aluminum and unavoidable impurities.
    Type: Application
    Filed: July 23, 2021
    Publication date: February 3, 2022
    Applicants: DOWA METALTECH CO, LTD., Mitsubishi Electric Corporation
    Inventors: Koji Kobayashi, Takuma Tsubota, Hideyo Osanai, Daisuke Oya