Patents by Inventor Takumi Asanuma
Takumi Asanuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11845865Abstract: The present disclosure provides a base film for an adhesive tape used in a manufacturing process of a semiconductor that can be used in a plurality of processes including a reflow process. A thermoplastic resin film, which is a resin composite of a first resin component that is a crystalline thermoplastic resin having a melting point of 290° C. or higher and a second resin component that has a glass transition temperature of 150° C. or higher, wherein the crystallinity of the first resin component is more than 5.0% of the entire resin composite.Type: GrantFiled: November 11, 2020Date of Patent: December 19, 2023Assignee: Furukawa Electric Co., Ltd.Inventors: Takumi Asanuma, Hideyuki Ikeda, Shota Sugiyama
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Patent number: 10988646Abstract: An adhesive composition, having: a polyalkylene oxide-added polyfunctional epoxy compound (a) represented by formula (A); a polyfunctional (meth)acrylate monomer (b), and a photo-acid generator (c); a method of bonding the adherends and a method of producing a stack, each of which uses the same: wherein R designates a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); X designates a divalent linking group having a ring structure and 6 to 20 carbon atoms, or a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); and m and n each are 0, or a positive number, independently.Type: GrantFiled: June 14, 2018Date of Patent: April 27, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Tetsuya Mieda, Takumi Asanuma, Yasushi Ishizaka
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Publication number: 20210061998Abstract: The present disclosure provides a base film for an adhesive tape used in a manufacturing process of a semiconductor that can be used in a plurality of processes including a reflow process. A thermoplastic resin film, which is a resin composite of a first resin component that is a crystalline thermoplastic resin having a melting point of 290° C. or higher and a second resin component that has a glass transition temperature of 150° C. or higher, wherein the crystallinity of the first resin component is more than 5.0% of the entire resin composite.Type: ApplicationFiled: November 11, 2020Publication date: March 4, 2021Applicant: Furukawa Electric Co., Ltd.Inventors: Takumi ASANUMA, Hideyuki IKEDA, Shota SUGIYAMA
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Patent number: 10829669Abstract: A curable and hygroscopic resin composition for sealing electronic devices, comprising: a cationically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a cationic polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.Type: GrantFiled: January 19, 2018Date of Patent: November 10, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Tetsuya Mieda, Takumi Asanuma, Yasushi Ishizaka
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Patent number: 10556974Abstract: A curable and hygroscopic resin composition for sealing electronic devices, having at least a (meth)acrylate oligomer (a) having the number-average molecular weight of 1,500 to 5,000, a low molecular weight (meth)acrylate (b) having an average molecular weight of 170 to 500, a moisture-reactive organometallic compound (c), and a polymerization initiator (d), wherein the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b) are multifunctional (meth)acrylates in which the number of (meth)acryloyl groups is from 1.5 to 3 in one molecule of each of the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b); a sealing resin; and an electronic device.Type: GrantFiled: July 28, 2017Date of Patent: February 11, 2020Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Tetsuya Mieda, Takumi Asanuma, Yasushi Ishizaka
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Patent number: 10196547Abstract: A resin composition for sealing an electronic device and other things being capable of sealing an electronic device without trapping air and being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth) acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C?C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted, non-N-containing divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group; l and m each represent 0 or 1; n represents an integer from 15 to 150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.Type: GrantFiled: August 26, 2016Date of Patent: February 5, 2019Assignee: FURUKAWA ELECTRICS CO., LTD.Inventors: Masami Aoyama, Takumi Asanuma, Yasushi Ishizaka
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Patent number: 10196534Abstract: A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C?C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.Type: GrantFiled: August 26, 2016Date of Patent: February 5, 2019Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Takumi Asanuma, Masami Aoyama, Yasushi Ishizaka, Tetsuya Mieda
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Publication number: 20180291242Abstract: An adhesive composition, having: a polyalkylene oxide-added polyfunctional epoxy compound (a) represented by formula (A); a polyfunctional (meth)acrylate monomer (b), and a photo-acid generator (c); a method of bonding the adherends and a method of producing a stack, each of which uses the same: wherein R designates a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); X designates a divalent linking group having a ring structure and 6 to 20 carbon atoms, or a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); and m and n each are 0, or a positive number, independently.Type: ApplicationFiled: June 14, 2018Publication date: October 11, 2018Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Tetsuya MIEDA, Takumi ASANUMA, Yasushi ISHIZAKA
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Patent number: 10079360Abstract: An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand: M(ORx)n??Formula (1) wherein, in formula (1), M designates Al, B, Ti or Zr; Rx in the ligand designates an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by formula (a); at least one of Rx's has a crosslinkable group; and n designates a valence of M. wherein, in formula (a), O* designates O of ORx in formula (1); R1 designates an alkyl group, an alkenyl group or an acyl group; R2 designates a hydrogen atom or an alkyl group; and R3 designates an alkyl group or an alkoxy group.Type: GrantFiled: July 28, 2017Date of Patent: September 18, 2018Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Tetsuya Mieda, Takumi Asanuma, Yasushi Ishizaka, Keiji Saito
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Patent number: 10043996Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.Type: GrantFiled: September 28, 2015Date of Patent: August 7, 2018Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Masami Aoyama, Tetsuya Mieda, Keiji Saito, Kunihiko Ishiguro, Toshimitsu Nakamura, Naoaki Mihara, Takumi Asanuma
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Publication number: 20180208804Abstract: A curable and hygroscopic resin composition for sealing electronic devices, comprising: a cationically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a cationic polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.Type: ApplicationFiled: January 19, 2018Publication date: July 26, 2018Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Tetsuya MIEDA, Takumi ASANUMA, Yasushi ISHIZAKA
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Publication number: 20170327608Abstract: A curable and hygroscopic resin composition for sealing electronic devices, having at least a (meth)acrylate oligomer (a) having the number-average molecular weight of 1,500 to 5,000, a low molecular weight (meth)acrylate (b) having an average molecular weight of 170 to 500, a moisture-reactive organometallic compound (c), and a polymerization initiator (d), wherein the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b) are multifunctional (meth)acrylates in which the number of (meth)acryloyl groups is from 1.5 to 3 in one molecule of each of the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b); a sealing resin; and an electronic device.Type: ApplicationFiled: July 28, 2017Publication date: November 16, 2017Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Tetsuya MIEDA, Takumi ASANUMA, Yasushi ISHIZAKA
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Publication number: 20170331070Abstract: An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand: M(ORx)n??Formula (1) wherein, in formula (1), M designates Al, B, Ti or Zr; Rx in the ligand designates an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by formula (a); at least one of Rx's has a crosslinkable group; and n designates a valence of M. wherein, in formula (a), O* designates O of ORx in formula (1); R1 designates an alkyl group, an alkenyl group or an acyl group; R2 designates a hydrogen atom or an alkyl group; and R3 designates an alkyl group or an alkoxy group.Type: ApplicationFiled: July 28, 2017Publication date: November 16, 2017Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Tetsuya MIEDA, Takumi ASANUMA, Yasushi ISHIZAKA, Keiji SAITO
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Patent number: 9758690Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value excluding the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.Type: GrantFiled: June 25, 2015Date of Patent: September 12, 2017Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Kunihiko Ishiguro, Tetsuya Mieda, Keiji Saito, Masami Aoyama, Toshimitsu Nakamura, Naoaki Mihara, Takumi Asanuma
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Publication number: 20160362587Abstract: A resin composition for sealing an electronic device and other things being capable of sealing an electronic device without trapping air and being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth) acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C?C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted, non-N-containing divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group; l and m each represent 0 or 1; n represents an integer from 15 to 150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.Type: ApplicationFiled: August 26, 2016Publication date: December 15, 2016Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Masami AOYAMA, Takumi Asanuma, Yasushi Ishizaka
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Publication number: 20160362576Abstract: A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C?C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.Type: ApplicationFiled: August 26, 2016Publication date: December 15, 2016Applicant: Furukawa Electric Co., Ltd.Inventors: Takumi ASANUMA, Masami AOYAMA, Yasushi ISHIZAKA, Tetsuya MIEDA
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Publication number: 20160020426Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.Type: ApplicationFiled: September 28, 2015Publication date: January 21, 2016Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Masami AOYAMA, Tetsuya MIEDA, Keiji SAITO, Kunihiko ISHIGURO, Toshimitsu NAKAMURA, Naoaki MIHARA, Takumi ASANUMA
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Publication number: 20160017186Abstract: A sealant composition being adhesive for used in electronic devices, the sealant composition including an olefin-based polymer and a tackifier, wherein the olefin-based polymer is at least one selected from an ethylene/?-olefin copolymer and an ethylene/?-olefin/non-conjugated diene copolymer, and the content of the tackifier is 10% by mass or more and 70% by mass or less in the resin composition that constitutes the sealant composition.Type: ApplicationFiled: September 28, 2015Publication date: January 21, 2016Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Masami AOYAMA, Tetsuya MIEDA, Keiji SAITO, Kunihiko ISHIGURO, Toshimitsu NAKAMURA, Naoaki MIHARA, Takumi ASANUMA
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Publication number: 20150291824Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value except the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.Type: ApplicationFiled: June 25, 2015Publication date: October 15, 2015Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Kunihiko ISHIGURO, Tetsuya Mieda, Keiji Saito, Masami Aoyama, Toshimitsu Nakamura, Naoaki Mihara, Takumi Asanuma
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Patent number: 9023453Abstract: A honeycomb structure includes at least one pillar-shaped honeycomb unit and a pair of electrodes. The pillar-shaped honeycomb unit includes an outer peripheral wall and cell walls. The cell walls extend along a longitudinal direction of the honeycomb unit to define cells. The cell walls are composed of a ceramic aggregate having pores. The cell walls contain a substance having an electrical resistivity lower than an electrical resistivity of ceramic forming the ceramic aggregate. The pair of electrodes is arranged at the cell walls and/or the outer peripheral wall.Type: GrantFiled: February 7, 2011Date of Patent: May 5, 2015Assignee: Ibiden Co., Ltd.Inventors: Takahiko Ido, Yoshihiro Koga, Takumi Asanuma, Takashi Ito