Patents by Inventor Takumi EBE

Takumi EBE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11773237
    Abstract: A resin composition containing heat-expandable microspheres including a thermoplastic resin shell and a thermally vaporizable blowing agent encapsulated therein and at least one base resin selected from rubbers, olefin resins and thermoplastic elastomers. The thermoplastic resin is a polymer of a polymerizable component containing N-substituted maleimide and a nitrile monomer containing methacrylonitrile. Also disclosed are molded articles manufactured by molding the resin composition.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: October 3, 2023
    Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Takumi Ebe, Katsushi Miki
  • Publication number: 20200332085
    Abstract: A resin composition containing heat-expandable microspheres including a thermoplastic resin shell and a thermally vaporizable blowing agent encapsulated therein and at least one base resin selected from rubbers, olefin resins and thermoplastic elastomers. The thermoplastic resin is a polymer of a polymerizable component containing N-substituted maleimide and a nitrile monomer containing methacrylonitrile. Also disclosed are molded articles manufactured by molding the resin composition.
    Type: Application
    Filed: December 14, 2018
    Publication date: October 22, 2020
    Applicant: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Takumi EBE, Katsushi MIKI
  • Publication number: 20170009039
    Abstract: A masterbatch containing an organic base component and heat-expandable microspheres including a thermoplastic resin shell and a thermally vaporizable blowing agent encapsulated therein. The organic base component has a melting point not higher than the expansion-initiation temperature of the heat-expandable microspheres and a melt flow rate (MFR, g/10 mm) higher than 50 and not higher than 2200. A ratio of the heat-expandable microspheres ranges from 30 to 80 wt % of the total weight of the heat-expandable microspheres and the organic base component. Also disclosed is a molding composition, a foamed molded article manufactured by molding the molding composition and a weathers tripping.
    Type: Application
    Filed: January 30, 2015
    Publication date: January 12, 2017
    Applicant: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Takumi EBE, Katsushi MIKI