Patents by Inventor Takumi Hatanaka

Takumi Hatanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240359360
    Abstract: A smoother includes a conveying device for a molded body; a pair of arms that are respectively disposed to face both widthwise ends of the conveying device, and in which longitudinal ends of the arms are swingable in upward and downward directions with respect to a conveying surface of the conveying device; a smoother plate fixed to a pair of facing ends of the longitudinal ends of the pair of arms; weights that are respectively attached to the pair of arms and are movable along a longitudinal direction of the arms; a weight position changing device configured to change positions of the weights on the arms; and a first control device configured to control the positions of the weights on the arms via the weight position changing device.
    Type: Application
    Filed: August 25, 2022
    Publication date: October 31, 2024
    Inventors: Takumi HATANAKA, Seiji TANIKAWA
  • Patent number: 9701131
    Abstract: A thermal head capable of reducing a possibility of separation of a connector is provided. A thermal head includes a substrate; a plurality of heat generating portions disposed on the substrate; a plurality of electrodes which are disposed on the substrate and are electrically connected to the plurality of heat generating portions, respectively; and a connector including a plurality of connector pins which pinch the substrate and are electrically connected to the plurality of electrodes, respectively, and a housing for containing the plurality of connector pins. The housing is disposed adjacent to the substrate in a sub-scanning direction, and the housing includes a support portion disposed under the substrate. This can reduce a possibility of separation of the connector.
    Type: Grant
    Filed: November 27, 2014
    Date of Patent: July 11, 2017
    Assignee: KYOCERA CORPORATION
    Inventors: Yuuna Ookubo, Yasumitsu Yamamoto, Masafumi Hirayama, Shouji Hirose, Takumi Hatanaka, Hisatoshi Takada, Youichi Moto, Yui Tanaka, Yousuke Iwamoto
  • Publication number: 20160325557
    Abstract: A thermal head capable of reducing a possibility of separation of a connector is provided. A thermal head includes a substrate; a plurality of heat generating portions disposed on the substrate; a plurality of electrodes which are disposed on the substrate and are electrically connected to the plurality of heat generating portions, respectively; and a connector including a plurality of connector pins which pinch the substrate and are electrically connected to the plurality of electrodes, respectively, and a housing for containing the plurality of connector pins. The housing is disposed adjacent to the substrate in a sub-scanning direction, and the housing includes a support portion disposed under the substrate. This can reduce a possibility of separation of the connector.
    Type: Application
    Filed: November 27, 2014
    Publication date: November 10, 2016
    Applicant: KYOCERA Corporation
    Inventors: Yuuna OOKUBO, Yasumitsu YAMAMOTO, Masafumi HIRAYAMA, Shouji HIROSE, Takumi HATANAKA, Hisatoshi TAKADA, Youichi MOTO, Yui TANAKA, Yousuke IWAMOTO
  • Patent number: 8382923
    Abstract: A gypsum board forming device (10) constitutes an apparatus of producing gypsum boards. A layered formation of a lower sheet (1), an upper sheet (2) and a gypsum slurry (6) passes through a forming gate (40). The forming device forms the formation into a plate-like configuration with use of upper and lower plates (20, 30). The upper plate (20) is constituted from a fixed substrate plate (21) and a movable plate (22), and the movable plate is in surface-to-surface contact with the upper sheet of the layered formation. A plurality of actuators (50) is supported by the substrate plate. Each of the actuators applies an upward or downward load (P) to the movable plate locally for a local deformation of the movable plate owing to a deflection thereof. A gate size (T) is locally changed by displacement of the movable plate relative to the substrate plate.
    Type: Grant
    Filed: April 29, 2008
    Date of Patent: February 26, 2013
    Assignee: Yoshino Gypsum Co., Ltd.
    Inventors: Shoichi Okazaki, Takumi Hatanaka, Ken Hayase
  • Publication number: 20100132869
    Abstract: A gypsum board forming device (10) constitutes an apparatus of producing gypsum boards. A layered formation of a lower sheet (1), an upper sheet (2) and a gypsum slurry (6) passes through a forming gate (40). The forming device forms the formation into a plate-like configuration with use of upper and lower plates (20, 30). The upper plate (20) is constituted from a fixed substrate plate (21) and a movable plate (22), and the movable plate is in surface-to-surface contact with the upper sheet of the layered formation. A plurality of actuators (50) is supported by the substrate plate. Each of the actuators applies an upward or downward load (P) to the movable plate locally for a local deformation of the movable plate owing to a deflection thereof. A gate size (T) is locally changed by displacement of the movable plate relative to the substrate plate.
    Type: Application
    Filed: April 29, 2008
    Publication date: June 3, 2010
    Inventors: Shoichi Okazaki, Takumi Hatanaka, Ken Hayase