Abstract: A non-curable thermally conductive grease composition includes: A 100 parts by mass of an ethylene-?-olefin copolymer with a kinematic viscosity of 10000 mm2/s or less at 40° C.; and B. 115 to 580 parts by mass of thermally conductive particles with respect to 100 parts by mass of the component A. The thermally conductive particles contain the following: B1. 55 to 350 parts by mass of irregularly-shaped alumina with a median particle size of 0.1 to 1 ?m, in which a part or all of the alumina is surface treated with a specific alkoxysilane compound or its partial hydrolysate; B2. 5 to 60 parts by mass of plate-shaped boron nitride with a median particle size of 0.1 to 10 ?m; and B3. 55 to 170 parts by mass of aggregated boron nitride with a median particle size of 20 to 70 ?m. The B3/B2 mass ratio is 2 to 20. Thus, the thermally conductive grease composition is less likely to generate low molecular siloxane and has high drop resistance and a low specific gravity.

Abstract: A silicone gel composition of the present invention contains the following components; A 100 parts by mass of an organopolysiloxane that is curable by an addition reaction; B. 0.01 to 10 parts by mass of an unsaturated hydrocarbon compound having one alkenyl group per molecule; and C. an addition reaction curing catalyst in a catalytic amount. The unsaturated hydrocarbon compound is at least one selected from the group consisting of an a-olefin that is liquid at room temperature (25° C.) and does not volatilize or decompose at 100° C. and ?-methylstyrene. A silicone gel sheet of the present invention is obtained by molding the silicone gel composition into a sheet, and curing the sheet.

Abstract: Composite resin granules 5 contain a binder resin 2 and a thermally conductive filler. The thermally conductive filler includes a non-anisotropic thermally conductive filler 3 and an anisotropic thermally conductive filler 4. The composite resin granules containing the binder resin and the thermally conductive filler are formed into a spherical shape. The particles of the anisotropic thermally conductive filler 4 are oriented in random directions. A thermally conductive rein molded body 6 of the present invention is obtained by compressing the composite resin granules 5. Thus, the present invention provides the thermally conductive resin molded body that has relatively high thermal conductivities in the in-plane direction and the thickness direction, well-balanced directional properties of thermal conduction, and a low specific gravity, the composite resin granules suitable for the thermally conductive resin molded body, and methods for producing them.

Abstract: A non-curable thermally conductive silicone grease composition includes: A. 100 parts by mass of a non-curable silicone oil with a kinematic viscosity of 50 to 10000 mm2/s at 40° C.; and B. 105 to 500 parts by mass of thermally conductive particles with respect to 100 parts by mass of the component A. The thermally conductive particles contain the following: B1. 50 to 300 parts by mass of irregularly-shaped alumina with a median particle size of 0.1 to 1 µm, in which a part or all of the alumina is surface treated; B2. 5 to 50 parts by mass of plate-like boron nitride with a median particle size of 0.1 to 10 µm; and B3. 50 to 150 parts by mass of aggregated boron nitride with a median particle size of 20 to 70 µm. The B3/B2 blending ratio is 2 to 20. Thus, the thermally conductive silicone grease composition has a high thermal conductivity, but still has a relatively low specific gravity, and also has a viscosity for good workability and good coating properties.

Abstract: A thermally conductive grease of the present invention contains a liquid olefin polymer and thermally conductive particles. The liquid olefin polymer is an ethylene ?-olefin copolymer having a kinematic viscosity at 40° C. of 10,000 mm2/s or less. The thermally conductive grease contains 400 to 2000 parts by mass of the thermally conductive particles based on 100 parts by mass of the liquid olefin polymer. Alumina particles with a median particle diameter of 0.1 to 5 ?m constitute 5 to 80% by mass of 100% by mass of the thermally conductive particles. Other thermally conductive particles constitute 20 to 95% by mass of 100% by mass of the thermally conductive particles. The thermally conductive grease has an absolute viscosity at 23° C. of 300 to 7000 Pa·s measured by a B-type viscometer using a T-E spindle at a rotational speed of 5 rpm.

Abstract: A thermally-conductive silicone gel composition of the present invention contains A to D components below. A: a linear organopolysiloxane having one vinyl group at each terminal end of a molecular chain and a kinematic viscosity of 1 to 600 mm2/s, B: a linear organopolysiloxane having three or more Si—H groups in one molecule and an Si—H group content of 0.05 to 6 mol/kg, in an amount such that a ratio of the number of Si—H groups in B component to the number of vinyl groups in A component is 0.2 to 0.5, C: a platinum catalyst in a catalytic amount, and D: a thermally-conductive filler in an amount of 300 to 1000 parts by mass when a total amount of A and B is taken as 100 parts by mass.

Abstract: A heat conductive sheet of the present invention is a heat conductive sheet containing a curing reaction catalyst, wherein a heat conductive uncured composition 2 not containing a curing reaction catalyst is joined to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst. The heat conductive sheet 1 containing a curing reaction catalyst contains the curing reaction catalyst in an amount necessary to cure the heat conductive uncured composition. A mounting method of the present invention includes: joining a heat conductive uncured composition 2 not containing a curing reaction catalyst to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst, and curing the heat conductive uncured composition by diffusion of the curing reaction catalyst contained in the heat conductive sheet 1.

Abstract: A thermally conductive silicone gel composition of the present invention includes the following A to F: (A) an organopolysiloxane having two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having two Si—H groups per molecule; (C) an organohydrogenpolysiloxane having three or more Si—H groups per molecule; (D) at least one compound selected from the group consisting of D1 and D2: (D1) an organopolysiloxane having one alkenyl group per molecule and (D2) an organohydrogenpolysiloxane having one Si—H group per molecule; (E) a platinum catalyst; and (F) a thermally conductive filler in an amount of 100 to 600 vol % with respect to 100 vol % of the total amount of the A to E. The components A to F are cured. With this configuration, the thermally conductive silicone gel composition can reduce oil bleeding, even though the composition is a gel cured product.

Abstract: Composite resin granules 5 contain a binder resin 2 and a thermally conductive filler. The thermally conductive filler includes a non-anisotropic thermally conductive filler 3 and an anisotropic thermally conductive filler 4. The composite resin granules containing the binder resin and the thermally conductive filler are formed into a spherical shape. The particles of the anisotropic thermally conductive filler 4 are oriented in random directions. A thermally conductive rein molded body 6 of the present invention is obtained by compressing the composite resin granules 5. Thus, the present invention provides the thermally conductive resin molded body that has relatively high thermal conductivities in the in-plane direction and the thickness direction, well-balanced directional properties of thermal conduction, and a low specific gravity, the composite resin granules suitable for the thermally conductive resin molded body, and methods for producing them.

Abstract: A heat conductive sheet of the present invention is a heat conductive sheet containing a curing reaction catalyst, wherein a heat conductive uncured composition 2 not containing a curing reaction catalyst is joined to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst. The heat conductive sheet 1 containing a curing reaction catalyst contains the curing reaction catalyst in an amount necessary to cure the heat conductive uncured composition. A mounting method of the present invention includes: joining a heat conductive uncured composition 2 not containing a curing reaction catalyst to at least one principal surface of the heat conductive sheet 1 containing a curing reaction catalyst, and curing the heat conductive uncured composition by diffusion of the curing reaction catalyst contained in the heat conductive sheet 1.

Abstract: A phosphor-containing identification substance of the present invention includes a substrate and a phosphor-containing silicone thin layer. The whole or part of the surface of the substrate is covered with the phosphor-containing silicone thin layer. The phosphor has identification properties that the phosphor emits light when irradiated with ultraviolet rays or black light, and does not emit light when irradiated with visible rays. A method for producing the phosphor-containing identification substance of the present invention includes bringing a silicone composition for forming a phosphor-containing thin layer into contact with the substrate after or simultaneously with the molding of the substrate, followed by heating. This provides the phosphor-containing identification substance that can be applied to a silicone thin film, has excellent adhesive properties with the substrate, and maintains the inherent properties of the substrate without being impaired by marking, and the method for producing the same.

Abstract: A phosphor-containing identification substance of the present invention includes a substrate and a phosphor-containing silicone thin layer. The whole or part of the surface of the substrate is covered with the phosphor-containing silicone thin layer. The phosphor has identification properties that the phosphor emits light when irradiated with ultraviolet rays or black light, and does not emit light when irradiated with visible rays. A method for producing the phosphor-containing identification substance of the present invention includes bringing a silicone composition for forming a phosphor-containing thin layer into contact with the substrate after or simultaneously with the molding of the substrate, followed by heating. This provides the phosphor-containing identification substance that can be applied to a silicone thin film, has excellent adhesive properties with the substrate, and maintains the inherent properties of the substrate without being impaired by marking, and the method for producing the same.

Abstract: Disclosed is a wire array rubber connector (10), including: an electrical insulating rubber (2); and a plurality of conductive metal wires (1) that are arrayed in a thickness direction of the electrical insulating rubber so as to pass through front and back surfaces of the electrical insulating rubber, and localized so as to be electrically connectable to electrical terminals that are disposed at predetermined positions on the front and back surfaces of the electrical insulating rubber. The electrical insulating rubber (2) is a flame-resistant rubber achieving V-0 based on the UL-94 standard.

Abstract: Disclosed is a wire array rubber connector (10), including: an electrical insulating rubber (2); and a plurality of conductive metal wires (1) that are arrayed in a thickness direction of the electrical insulating rubber so as to pass through front and back surfaces of the electrical insulating rubber, and localized so as to be electrically connectable to electrical terminals that are disposed at predetermined positions on the front and back surfaces of the electrical insulating rubber. The electrical insulating rubber (2) is a flame-resistant rubber achieving V-0 based on the UL-94 standard.