Abstract: An alternating stack of insulating layers and spacer material layers is formed over a substrate. At least one dielectric material portion is formed over the substrate adjacent to the alternating stack. Memory stack structures are formed through the alternating stack. A trench extending through the alternating stack and a via cavity extending through the at least one dielectric material portion are formed using a same anisotropic etch process. The via cavity is deeper than the trench and the via cavity extends into an upper portion of the substrate. The sacrificial material layers are replaced with electrically conductive layers using the trench as a conduit for an etchant and a reactant. A trench fill structure is formed in the trench, and a via structure assembly is formed in the via cavity using simultaneous deposition of material portions. A bonding pad may be formed on the bottom surface of the via structure assembly.

Abstract: A protection circuit protects a rectifier circuit from an inrush current inputted to a smoothing circuit. A short-circuiting circuit does not short the protection circuit while an inrush current may occur, and shorts it while an inrush current does not occur. A transformer has a primary winding, a secondary winding and an auxiliary winding. A delay circuit delays a timing at which an operation of a load connected to the auxiliary winding is started with respect to a timing at which an operation of the short-circuiting circuit is started. A rectifying and smoothing circuit generates an output voltage by rectifying and smoothing the secondary side voltage. The short-circuiting circuit is driven by the output voltage.

Abstract: A power source apparatus includes a plurality of first power sources, each connected to a load through a power supply line, and at least one second power source, which is a sub power source to be used when the first power source is unable to output a predetermined voltage. The second power source is connected in parallel to the power supply line of at least one of the first power source through a diode. The second power source is provided on an anode side of the diode, the load is configured to operate at a voltage equal to or more than a first voltage, the first power source outputs a second voltage higher than the first voltage, the second power source outputs a third voltage, which is higher than the first voltage, the voltage output through the diode from the second power source being lower than the second voltage.

Abstract: An alternating stack of insulating layers and sacrificial material layers is formed over a substrate. A memory opening is formed through the alternating stack. A memory film including a silicon nitride layer and a tunneling dielectric layer is formed in the memory opening, and an opening is formed through the memory film. A chemical oxide layer is formed on a physically exposed surface of an underlying semiconductor material portion. A silicon nitride ring can be formed by selectively growing a silicon nitride material from an annular silicon nitride layer portion of the silicon nitride layer while suppressing deposition of the silicon nitride material on the tunneling dielectric layer and on the chemical oxide layer. A vertical semiconductor channel can be formed by depositing a continuous semiconductor material layer on the underlying semiconductor material portion and the tunneling dielectric layer and on the silicon nitride ring.

Abstract: Provided is a power supply apparatus, which is capable of saving power at the time of low output power even in a configuration using an inrush current prevention resistor and a switch as an inrush current prevention circuit in order to increase power of a low power supply. An AC/DC power supply includes a rectifier configured to rectify an input AC voltage, a smoothing capacitor configured to smooth the rectified voltage, a resistor configured to limit an inrush current input to the smoothing capacitor, a relay configured to control whether to input a current to the resistor, and a current detection circuit. The AC/DC power supply further includes a converter connected at the subsequent stage of the smoothing capacitor and configured to adjust the voltage smoothed by the smoothing capacitor to a predetermined voltage.

Abstract: A three-dimensional memory device includes a source-level material layer stack located over a substrate that includes, from bottom to top, a lower source-level semiconductor layer, a semiconductor oxide tunneling layer, a source contact layer including a doped semiconductor material, and an upper source-level semiconductor layer, an alternating stack of electrically conductive layers and insulating layers located over the source-level material layer stack, and memory stack structures that extend through the alternating stack and into an upper portion of the lower source-level semiconductor layer, in which each memory stack structure includes a vertical semiconductor channel and a memory film laterally surrounding the vertical semiconductor channel, and each of the vertical semiconductor channels vertically extends through, and is electrically connected to, the source contact layer.

Abstract: An alternating stack of insulating layers and sacrificial material layers is formed over a substrate. A memory opening is formed through the alternating stack. A memory film including a silicon nitride layer and a tunneling dielectric layer is formed in the memory opening, and an opening is formed through the memory film. A chemical oxide layer is formed on a physically exposed surface of an underlying semiconductor material portion. A silicon nitride ring can be formed by selectively growing a silicon nitride material from an annular silicon nitride layer portion of the silicon nitride layer while suppressing deposition of the silicon nitride material on the tunneling dielectric layer and on the chemical oxide layer. A vertical semiconductor channel can be formed by depositing a continuous semiconductor material layer on the underlying semiconductor material portion and the tunneling dielectric layer and on the silicon nitride ring.

Abstract: In-process source-level material layers including a source-level sacrificial layer are formed over a substrate, and an alternating stack of insulating layers and spacer material layers and memory stack structures are formed over the in-process source-level layers. A backside trench is formed through the alternating stack, and a source cavity is formed by removing the source-level sacrificial layer employing an etchant provided through the backside trench. A source contact layer including a doped semiconductor material is formed on vertical semiconductor channels of the memory stack structures within the source cavity. The source contact layer includes an unfilled cavity, which is subsequently filled with a silicon nitride liner, a silicon oxide fill material and a semiconductor cap. A semiconductor oxide structure can be formed by filling voids in the silicon oxide fill material by oxidizing the semiconductor cap into a thermal semiconductor oxide material portion.

Abstract: An alternating stack of insulating layers and spacer material layers is formed over a substrate. At least one dielectric material portion is formed over the substrate adjacent to the alternating stack. Memory stack structures are formed through the alternating stack. A trench extending through the alternating stack and a via cavity extending through the at least one dielectric material portion are formed using a same anisotropic etch process. The via cavity is deeper than the trench and the via cavity extends into an upper portion of the substrate. The sacrificial material layers are replaced with electrically conductive layers using the trench as a conduit for an etchant and a reactant. A trench fill structure is formed in the trench, and a via structure assembly is formed in the via cavity using simultaneous deposition of material portions. A bonding pad may be formed on the bottom surface of the via structure assembly.

Abstract: A lower source-level semiconductor layer, a sacrificial semiconductor layer, an upper source-level semiconductor layer, and an alternating stack of insulating layers and sacrificial material layers are sequentially formed over a substrate. An array of memory stack structures containing vertical semiconductor channels that extend through the alternating stack and into an upper portion of the lower source-level semiconductor layer is formed. A backside trench is formed through the alternating stack, and a source cavity is formed by removing the sacrificial semiconductor layer. A doped source contact layer is formed on each of the vertical semiconductor channels in the source cavity. A silicon nitride liner is formed on the doped source contact layer. The sacrificial material layers are replaced with electrically conductive layers. A dielectric wall structure is formed in the backside trench.

Abstract: Provided is a power supply apparatus, which is capable of saving power at the time of low output power even in a configuration using an inrush current prevention resistor and a switch as an inrush current prevention circuit in order to increase power of a low power supply. An AC/DC power supply includes a rectifier configured to rectify an input AC voltage, a smoothing capacitor configured to smooth the rectified voltage, a resistor configured to limit an inrush current input to the smoothing capacitor, a relay configured to control whether to input a current to the resistor, and a current detection circuit. The AC/DC power supply further includes a converter connected at the subsequent stage of the smoothing capacitor and configured to adjust the voltage smoothed by the smoothing capacitor to a predetermined voltage.