Patents by Inventor Takumi Ootani

Takumi Ootani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NEGATIVE ELECTRODE ACTIVE MATERIAL COMPOSITION, AND ALL-SOLID-STATE SECONDARY BATTERY INCLUDING SAME
    Publication number: 20240113291
    Abstract: Provided is a negative electrode active material composition including a lithium titanate powder whose main component is Li4Ti5O12 and an inorganic solid electrolyte having conductivity for metal ions belonging to Group 1 of Periodic Table, wherein at least one metal element selected from the group consisting of Al, W, Ce, and Mo is present on the surfaces of lithium titanate particles constituting the lithium titanate powder.
    Type: Application
    Filed: February 3, 2022
    Publication date: April 4, 2024
    Applicant: UBE Corporation
    Inventors: Kei SHIMAMOTO, Shinichirou OOTANI, Takumi TAKENAKA
  • Mobile instrument with flexible printed wiring board
    Patent number: 7589975
    Abstract: A flexible connection substrate includes a first flexible substrate and a second flexible substrate. The first flexible substrate electrically connects first signal lines that are formed on a first circuit substrate to second signal lines that are formed on a second circuit substrate. The second flexible substrate is a flexible substrate for grounding, has a planar shape that is substantially the same as the first flexible substrate, and contains a conductive material throughout. The second flexible substrate connects to any of a plurality of grounding points that are formed on the first circuit substrate and any of a plurality of grounding points that are formed on the second circuit substrate. The first flexible substrate and the second flexible substrate are bonded to each other on one surface.
    Type: Grant
    Filed: August 5, 2005
    Date of Patent: September 15, 2009
    Assignee: NEC Corporation
    Inventor: Takumi Ootani
  • Flexible connection substrate and folding electronic apparatus
    Publication number: 20060050490
    Abstract: A flexible connection substrate includes a first flexible substrate and a second flexible substrate. The first flexible substrate electrically connects first signal lines that are formed on a first circuit substrate to second signal lines that are formed on a second circuit substrate. The second flexible substrate is a flexible substrate for grounding, has a planar shape that is substantially the same as the first flexible substrate, and contains a conductive material throughout. The second flexible substrate connects to any of a plurality of grounding points that are formed on the first circuit substrate and any of a plurality of grounding points that are formed on the second circuit substrate. The first flexible substrate and the second flexible substrate are bonded to each other on one surface.
    Type: Application
    Filed: August 5, 2005
    Publication date: March 9, 2006
    Inventor: Takumi Ootani