Patents by Inventor Takumi Shinohara

Takumi Shinohara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240093432
    Abstract: A method for manufacturing a molded product of the present disclosure includes a deposition step of depositing a mixture including a fiber and starch in air, a humidification step of applying water to the mixture, and a molding step of heating and pressurizing the mixture applied with water to obtain a molded product. The starch has a gelatinized and then pulverized particle diameter d50 of 0.30 mm or more and 1.0 mm or less, which is the average particle diameter of the finely pulverized product determined by a prescribed measuring method.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 21, 2024
    Inventors: Masahiko NAKAZAWA, Shigemi WAKABAYASHI, Takashi SHINOHARA, Takumi SAGO, Naoko OMAGARI, Masahide NAKAMURA
  • Patent number: 11926754
    Abstract: Provided is a coating film having excellent durability and wear resistance, and utility as mold surface release coating. The coating film has excellent releasability (non-adhesiveness) over a long period of time. Further provided is a coating composition capable of forming such a coating film, the coating composition containing a fluoropolymer and an oil that is a liquid at 25° C., wherein the decomposition temperature of the oil is higher than the melting point of the fluoropolymer.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: March 12, 2024
    Assignees: THE CHEMOURS COMPANY FC, LLC, CHEMOURS-MITSUI FLUOROPRODUCTS CO., LTD.
    Inventors: Hoai-Nam Pham, Daisaku Shinohara, Takumi Terao, Akihiro Matsui
  • Patent number: 11332230
    Abstract: The method for producing an assembly is a method for producing an assembly equipped with a member to be reinforced (20), a reinforcing member body (41), and a filler (42), wherein the reinforcing member body (41) has a pair of flanges (44) arranged spaced on the surface (20B) of the member to be reinforced (20), a web (45), and a connection portion (46) which connects the flanges (44) and the web (45) and forms a filler space (V) with the surface (20B). The method for producing an assembly includes a step for inserting a filler (42) into the filler space (V), a step for attaching a crack control member (43) to cover the end of the filler (42), a step for joining the flanges (44) and the member to be reinforced (20), and a step for curing at least the member to be reinforced (20).
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: May 17, 2022
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Akihito Suzuki, Kenji Murakami, Kana Sakon, Akihisa Okuda, Takayuki Shimizu, Takumi Shinohara, Jun Eto, Yukifumi Toyama, Junichiro Miyagaki, Kenichi Kawakami
  • Publication number: 20210114712
    Abstract: The method for producing an assembly is a method for producing an assembly equipped with a member to be reinforced (20), a reinforcing member body (41), and a filler (42), wherein the reinforcing member body (41) has a pair of flanges (44) arranged spaced on the surface (20B) of the member to be reinforced (20), a web (45), and a connection portion (46) which connects the flanges (44) and the web (45) and forms a filler space (V) with the surface (20B). The method for producing an assembly includes a step for inserting a filler (42) into the filler space (V), a step for attaching a crack control member (43) to cover the end of the filler (42), a step for joining the flanges (44) and the member to be reinforced (20), and a step for curing at least the member to be reinforced (20).
    Type: Application
    Filed: November 26, 2018
    Publication date: April 22, 2021
    Inventors: Akihito SUZUKI, Kenji MURAKAMI, Kana SAKON, Akihisa OKUDA, Takayuki SHIMIZU, Takumi SHINOHARA, Jun ETO, Yukifumi TOYAMA, Junichiro MIYAGAKI, Kenichi KAWAKAMI
  • Patent number: 8278016
    Abstract: An electrophotographic photoconductor including an electroconductive support and a photoconductive layer provided thereon, wherein the photoconductive layer includes a charge generating material, an electron transporting material and a hole transporting material, the electron transporting material being a diphenoquinone compound represented by formula (1) described herein, the hole transporting material being a compound represented by formula (2) described herein.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: October 2, 2012
    Assignee: Ricoh Company, Ltd.
    Inventors: Keisuke Shimoyama, Eiji Kurimoto, Takaaki Ikegami, Kohsuke Yamamoto, Tadayoshi Uchida, Takumi Shinohara, Hajime Suzuki
  • Publication number: 20090311616
    Abstract: An electrophotographic photoconductor including an electroconductive support and a photoconductive layer provided thereon, wherein the photoconductive layer includes a charge generating material, an electron transporting material and a hole transporting material, the electron transporting material being a diphenoquinone compound represented by formula (1) described herein, the hole transporting material being a compound represented by formula (2) described herein.
    Type: Application
    Filed: June 9, 2009
    Publication date: December 17, 2009
    Inventors: Keisuke SHIMOYAMA, Eiji KURIMOTO, Takaaki IKEGAMI, Kohsuke YAMAMOTO, Tadayoshi UCHIDA, Takumi SHINOHARA, Hajime SUZUKI
  • Patent number: 5443933
    Abstract: An electrophotographic photoreceptor which is highly sensitive to light having a wavelength in the oscillatory wavelength region of semiconductor laser and responds quickly and is excellent in other electrophotographic characteristics and which consists an electroconductive support, a charge-generating layer and a charge-transfer layer, the two layers being placed on the support, and said charge-transfer layer containing a specific butadiene compound having formula (I); ##STR1## and a monophenol type antioxidant, the weight ratio of the monophenol type antioxidant/the butadiene compound ranging from 5/95 to 40/80.
    Type: Grant
    Filed: September 10, 1993
    Date of Patent: August 22, 1995
    Assignees: Shindengen Electric Manufacturing Co., Ltd., Yamanashi Electronics Co., Ltd., Takasago International Corporation
    Inventors: Kenichi Fujimori, Yoshitaro Nakayama, Takumi Shinohara, Atsushi Iwanami, Toshimitsu Hagiwara, Tohru Kobayashi