Patents by Inventor Takumi SUEI

Takumi SUEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240093016
    Abstract: Provided is a technique of obtaining films with higher dielectric breakdown strength at high temperatures and folding resistance. A resin composition comprises (1) a syndiotactic polystyrene resin, (2) a polyphenylene ether resin, and (3) at least one member selected from the group consisting of styrene-based thermoplastic elastomers and atactic polystyrene resins, wherein the content of the polyphenylene ether resin in the resin composition is 6 mass % or more.
    Type: Application
    Filed: October 7, 2020
    Publication date: March 21, 2024
    Applicant: Oji Holdings Corporation
    Inventors: Takumi SUEI, Kazuo IKEDA, Akihiro KAKEHI