Patents by Inventor Takumi Suemoto

Takumi Suemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing multi-layer wiring board
    Patent number: 7584535
    Abstract: A method of manufacturing a multi-layer circuit wiring board, including simultaneously laminating a second flexible resin film on one surface of a first flexible resin film having a first wiring pattern on at least one surface thereof, and a third wiring pattern on another surface of the first flexible resin film, the second flexible resin film having a second wiring pattern formed on at least one surface thereof, and the third flexible resin film having a third wiring pattern formed on at least one surface thereof.
    Type: Grant
    Filed: March 27, 2007
    Date of Patent: September 8, 2009
    Assignee: Toppan Printing Co., Ltd.
    Inventors: Takehito Tsukamoto, Hiroshi Matsuzawa, Satoshi Akimoto, Masataka Maehara, Takumi Suemoto, Masayuki Ode, Yuichi Sakaki
  • Method of manufacturing multi-layer wiring board
    Publication number: 20070175025
    Abstract: A method of manufacturing a multi-layer circuit wiring board, including simultaneously laminating a second flexible resin film on one surface of a first flexible resin film having a first wiring pattern on at least one surface thereof, and a third wiring pattern on another surface of the first flexible resin film, the second flexible resin film having a second wiring pattern formed on at least one surface thereof, and the third flexible resin film having a third wiring pattern formed on at least one surface thereof.
    Type: Application
    Filed: March 27, 2007
    Publication date: August 2, 2007
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Takehito Tsukamoto, Hiroshi Matsuzawa, Satoshi Akimoto, Masataka Maehara, Takumi Suemoto, Masayuki Ode, Yuichi Sakaki
  • Multi-layer wiring board, IC package, and method of manufacturing multi-layer wiring board
    Publication number: 20040178492
    Abstract: A multi-layer circuit wiring board comprising a laminate of films, each film having a wiring pattern formed on at least one surface thereof, wherein the wiring pattern formed on each film is electrically connected with the wiring pattern formed on another film which is disposed neighboring thereto through a via-contact layer provided on any one of the neighboring films.
    Type: Application
    Filed: March 25, 2004
    Publication date: September 16, 2004
    Applicant: TOPPAN PRINTING CO., LTD.
    Inventors: Takehito Tsukamoto, Hiroshi Matsuzawa, Satoshi Akimoto, Masataka Maehara, Takumi Suemoto, Masayuki Ode, Yuichi Sakaki