Abstract: A cutting insert comprising a cutting edge formed by an intersection ridge between a rake face and a side face, the cutting edge including a major cutting edge, a flat cutting edge, and a chamfer edge disposed between the major cutting edge and the flat cutting edge, wherein in a direct view of a side face near the flat cutting edge, a ratio of installation area length L2 of the chamfer edge to installation area length L3 of the major cutting edge is L2:L3=2:8 to 5:5, and inclination angle ?1 of the chamfer edge with respect to the flat cutting edge and inclination angle ?2 of the major cutting edge with respect to the flat cutting edge are set to have a relationship of ?1<?2.

Abstract: A bit exchangeable drill includes a detachable cutting head at the tip of a drill body, and the cutting head includes a cutting edge extending linearly from a rotation center to a radial outer end in axial end view, and a helical flute. At a rake face continuous with the cutting edge, a thinning face inclined relative to the rotation axis and rendering an axial rake angle of the cutting edge negative is formed entirely from a radial inner end to a radial outer end of the cutting edge.

Abstract: A bit exchangeable drill includes a detachable cutting head at the tip of a drill body, and the cutting head includes a cutting edge extending linearly from a rotation center to a radial outer end in axial end view, and a helical flute. At a rake face continuous with the cutting edge, a thinning face inclined relative to the rotation axis and rendering an axial rake angle of the cutting edge negative is formed entirely from a radial inner end to a radial outer end of the cutting edge.

Abstract: A blister packaging multilayer resin film is used to produce a blister package in which an item is sealed between a support substrate and the multilayer resin film, wherein the multilayer resin film includes an oxygen barrier layer that is arranged on a side of the multilayer resin film which side faces the support substrate, and a moisture proof layer that is arranged on a side of the oxygen barrier layer which side does not face the support substrate.

Abstract: In semiconductor production plants a highly clean state is required. In a plant building, through which air is forcibly circulated, a clean room in a low or medium cleanliness state is formed using a filter. A plurality of processing units are provided in the clean room and held in a high cleanliness state. A transport robot transfers a workpiece or like object to and from each processing unit. The robot is capable of being driven to positions corresponding to the processing units and holds the workpiece or object in a highly clean state. Thus, there is no need of holding the entire building highly clean, and only a required part of the building may be held in a highly clean state, which is advantageous from the standpoint of cost.