Abstract: Provided is a mounting member having a light receiving element, capable of constraining increase in size and of arranging a plurality of laser element portions closer to each other. The mounting member includes three or more electrodes, which respectively include element mounting portions arranged in a first direction, and a light receiving element disposed in a second direction intersecting with the first direction relative to the element mounting portions. The length in the second direction of at least one of the element mounting portions disposed at both ends in the first direction among the three or more element mounting portions is smaller than the length in the second direction of an element mounting portion disposed at an inner position in the first direction among the three or more element mounting portions.

Abstract: Provided is a mounting member having a light receiving element, capable of constraining increase in size and of arranging a plurality of laser element portions closer to each other. The mounting member includes three or more electrodes, which respectively include element mounting portions arranged in a first direction, and a light receiving element disposed in a second direction intersecting with the first direction relative to the element mounting portions. The length in the second direction of at least one of the element mounting portions disposed at both ends in the first direction among the three or more element mounting portions is smaller than the length in the second direction of an element mounting portion disposed at an inner position in the first direction among the three or more element mounting portions.

Abstract: A semiconductor laser device that can suppress size increase of a semiconductor laser element and increase in an interval between light emitting portions and can improve productivity is provided. This semiconductor laser device has a first semiconductor laser element, and a second semiconductor laser element which is a monolithic multi-wavelength semiconductor laser element. The second semiconductor laser element includes a semiconductor substrate, and, of side faces of the semiconductor substrate of the second semiconductor laser element, a side face arranged opposite the first semiconductor laser element is inclined with respect to the normal direction of a major face of the semiconductor substrate so that a distance from the first semiconductor laser element is increasingly large away from a mounting member.

Abstract: There is provided an apparatus for producing a paving block comprising a block substrate and a solid top layer selected from a tile-like layer and a cured cement mortar layer firmly bonded onto the upper surface of the block substrate. The apparatus comprises a mortar applicator (21) consisting essentially of a mortar container and a masking bottom board (23) having an opening (24) to be located on the back of a top layer (1-2) or the upper surface of a block substrate (1-1) during application of cement mortar thereon, a clamping plate (25) to be located on the top layer (1-2) placed on the block substrate (1-1) during bonding them, and a scraping frame (26) for scraping excess mortar remaining on the side surfaces of the bonded block. When the apparatus is used to produce a novel paving block comprising a block substrate and a solid top layer having a plane dimension smaller than the substrate, squeeze-out deposits (6) of the cement mortar (7) are further formed around the bonded top layer (1-2).

Abstract: A system for making a composite block, including a block body formed of mortar or concrete and a covering material such as a tile, natural stone or mortar sheet applied to the upper surface of the block body, includes an applicator for applying an adhesive material to the block body or covering material. The system also includes a press for loading vibration and/or pressure on a composite block assembly including the block body, the covering material placed thereon and an adhesive material disposed therebetween. Additionally, this system includes a finishing mechanism for finishing the pressed composite block assembly into the composite block by passing it through a hole of a size substantially corresponding to the contour of the composite block. The hole is formed through a scraper constructed from a flexible material.

Abstract: The fracture-free paving block comprises a cement block substrate and a top solid layer, and is characterized in that the top layer is selected from a cured cement mortar layer and tile-like layer firmly bonded to the substrate with cement mortar; the top layer is bonded to the block substrate with lateral margins of 1 to 8 mm wide in horizontal distance from the peripheral edges of the substrate; and the vertical distance from the surface of the top layer to the peripheral edge of the substrate is 5 to 50 mm.

Abstract: The fracture-free paving block (1) comprises a cement block substrate (1-1) and a top solid layer (1-2), and is characterized in that the top layer is selected from a cured cement mortar layer and a tile-like layer firmly bonded to the substrate with cement mortar; the top layer is bonded to the block substrate with lateral margins (2) of 1 to 8 mm wide in horizontal distance (1.sub.5) from the peripheral edges of the substrate: and the vertical distance (1.sub.6) from the surface of the top layer to the peripheral edge of the substrate is 5 to 50 mm. The method for producing the paving block (1) having a tile-like top layer comprises applying adhesive cement mortar between the back of the top layer (1-2) and the upper surface of the substrate (1-1); placing the top layer on the substrate with the above-mentioned margins (2) of the substrate surface: and applying vibration and/or pressurization between the top layer and the substrate.