Patents by Inventor Takumi WAKISAKA

Takumi WAKISAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11887873
    Abstract: A wafer placement apparatus includes a ceramic plate having an upper surface as a wafer placement surface and in which an electrode is embedded; and a cooling plate provided on a lower surface, opposite a wafer placement surface, of a ceramic plate and in which a refrigerant passage is provided, wherein a refrigerant passage includes a first passage forming a single continuous line and extending parallel to a wafer placement surface, and a second passage forming a single continuous line and extending along a first passage, an outlet of a second passage being positioned near an inlet of a first passage, an inlet of a second passage being positioned near an outlet of a first passage.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: January 30, 2024
    Assignee: NGK INSULATORS, LTD.
    Inventors: Keita Mine, Takumi Wakisaka
  • Publication number: 20220399223
    Abstract: A wafer placement table includes a ceramic substrate that has a wafer placement surface, a first electrode that is embedded in the ceramic substrate, a first power supply terminal that is inserted from a surface of the ceramic substrate opposite the wafer placement surface toward the first electrode, a first joint that joins the first electrode and the first power supply terminal to each other and a second electrode that is disposed between the wafer placement surface and the first electrode in the ceramic substrate. A linear portion that extends in the ceramic substrate from a position on the first electrode opposite the first joint to the wafer placement surface is composed of material of the ceramic substrate.
    Type: Application
    Filed: May 31, 2022
    Publication date: December 15, 2022
    Applicant: NGK Insulators, Ltd.
    Inventors: Tatsuya KUNO, Takumi WAKISAKA
  • Publication number: 20200312684
    Abstract: A wafer placement apparatus includes a ceramic plate having an upper surface as a wafer placement surface and in which an electrode is embedded; and a cooling plate provided on a lower surface, opposite a wafer placement surface, of a ceramic plate and in which a refrigerant passage is provided, wherein a refrigerant passage includes a first passage forming a single continuous line and extending parallel to a wafer placement surface, and a second passage forming a single continuous line and extending along a first passage, an outlet of a second passage being positioned near an inlet of a first passage, an inlet of a second passage being positioned near an outlet of a first passage.
    Type: Application
    Filed: March 18, 2020
    Publication date: October 1, 2020
    Applicant: NGK INSULATORS, LTD.
    Inventors: Keita MINE, Takumi WAKISAKA