Abstract: An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

Abstract: An LED light source unit for a backlight of a liquid crystal display is provided. The light source unit includes a plurality of LED chips, an insulating substrate, and a metal film covering a principal surface of the substrate. The LED chips are mounted on the metal film. With this arrangement, brightness of the light source unit is enhanced.

Abstract: An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

Abstract: An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

Abstract: An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

Abstract: An LED light source unit for a backlight of a liquid crystal display is provided. The light source unit includes a plurality of LED chips, an insulating substrate, and a metal film covering a principal surface of the substrate. The LED chips are mounted on the metal film. With this arrangement, brightness of the light source unit is enhanced.

Abstract: A thermal printhead (A1) includes a substrate (1) and a heating resistor (3) supported by the substrate (1). An electrode pattern (2) is formed in contact with the heating resistor (3) for applying driving voltage. The heating resistor (3) is covered with a protective film (5). The protective film (5) includes a high thermal conductivity layer (51) and a low thermal conductivity layer (52) laminated on the high thermal conductivity layer. The low thermal conductivity layer (52) is positioned farther from the heating resistor (3) than the high thermal conductivity layer (51) is.

Abstract: A thermal printhead (A) includes an insulating substrate (1), a heating resistor (2) provided on the substrate (1) and a protective film (4) covering the heating resistor (2). The protective film (4) is made up of a first layer (41), a second layer (42) and a third layer (43). The first layer (41) is held in contact with the heating resistor (2). The second layer (42) covers the first layer (41). The second layer (42) is harder than the first layer (41) and has a higher thermal conductivity than that of the first layer (41). The third layer (43) is the outermost layer and covers the second layer (42). The third layer (43) is harder than the second layer (42) and thinner than the second layer (42).

Abstract: A thermal print head A includes a substrate 1, a heat generating resistor 3 supported by the substrate 1, and a protective layer 4 which covers the heat generating resistor 3. The protective layer 4 includes a first inner layer 41 which is in contact with the heat generating resistor 3, a second inner layer 42 formed on the first inner layer 41, and an outer layer 43. Part of the second inner layer 42 is formed as a rough surface 42a which has a surface roughness of Ra 0.1 through 0.3. The rough surface 42a is disposed at a position corresponding to the heat generating resistor 3. The outer layer 43 is made of a metal nitride or a chemical compound containing a metal nitride, and has a thickness of 0.1 through 0.5 ?m.

Abstract: A thermal printhead A includes a glaze layer 2 formed on an insulating substrate 1, a resistor layer 3 formed on the glaze layer, a conductor layer 4 formed so that part of the resistor layer is exposed to serve as a heating portion 3c and a protective film 5 formed to cover the conductor layer 4 and the heating portion 3c. The protective film 5 includes a lower first protective layer 5a, and an upper second protective layer 5b overlapping the first protective layer 5a and serving as the outermost layer. The first protective layer 5a has a hardness of 500 to 800 Hk and a thickness of 1 to 2 ?m. The second protective layer 5b has a hardness of 1000 to 2000 Hk and a thickness of 5 to 8 ?m.

Abstract: A thermal printhead (A1) includes an insulating substrate (1), a glaze (2), a plurality of pairs of first and second electrodes (3A, 3B) and heating resistors (5). Each of the heating resistors (5) includes a heating portion (5a) spaced apart from the first electrode (3A) and the second electrode (3B). The respective ends (31A, 31B) of the electrodes (3A, 3B) are embedded in the glaze (2). An insulating film (4) is provided between the heating portion (5a) of each heating resistor (5) and the glaze (2). The hardness of the insulating film (4) is higher than that of the glaze (2) and lower than that of the heating resistor (5). The thermal conductivity of the insulating film (4) is higher than that of the glaze (2) and lower than that of the heating resistor (5).

Abstract: A thermal printhead (A1) includes a substrate (1) and a heating resistor (3) supported by the substrate (1). An electrode pattern (2) is formed in contact with the heating resistor (3) for applying driving voltage. The heating resistor (3) is covered with a protective film (5). The protective film (5) includes a high thermal conductivity layer (51) and a low thermal conductivity layer (52) laminated on the high thermal conductivity layer. The low thermal conductivity layer (52) is positioned farther from the heating resistor (3) than the high thermal conductivity layer (51) is.

Abstract: A thermal printhead (A1) includes a substrate (1), a glaze layer (2), a heating resistor (3), an electrode (4) for energizing the heating resistor (3), the electrode being mainly composed of Au, and a protective film (6) covering the heating resistor (3) and the electrode (4). The electrode (4) has a surface formed with a plurality of recesses.

Abstract: A thermal printhead (A) includes an insulating substrate (1), a heating resistor (2) provided on the substrate (1) and a protective film (4) covering the heating resistor (2). The protective film (4) is made up of a first layer (41), a second layer (42) and a third layer (43). The first layer (41) is held in contact with the heating resistor (2). The second layer (42) covers the first layer (41). The second layer (42) is harder than the first layer (41) and has a higher thermal conductivity than that of the first layer (41). The third layer (43) is the outermost layer and covers the second layer (42). The third layer (43) is harder than the second layer (42) and thinner than the second layer (42).

Abstract: A thermal printhead (A) includes an insulating substrate (1), a glaze layer (2), a resistor layer (3), an electrode layer (4) and a protective layer (5). The electrode layer (4) has a two-layer structure made up of a lower first electrode layer (4a) and an upper second electrode layer (4b). The resistor layer (3) includes a heating portion (7). The heating portion (7) is exposed from both the first electrode layer (4a) and the second electrode layer (4b) and is positioned on a bulging portion (2c) of the glaze layer (2).

Abstract: A thermal print head A includes a substrate 1, a heat generating resistor 3 supported by the substrate 1, and a protective layer 4 which covers the heat generating resistor 3. The protective layer 4 includes a first inner layer 41 which is in contact with the heat generating resistor 3, a second inner layer 42 formed on the first inner layer 41, and an outer layer 43. Part of the second inner layer 42 is formed as a rough surface 42a which has a surface roughness of Ra 0.1 through 0.3. The rough surface 42a is disposed at a position corresponding to the heat generating resistor 3. The outer layer 43 is made of a metal nitride or a chemical compound containing a metal nitride, and has a thickness of 0.1 through 0.5 ?m.

Abstract: A thermal printhead A includes a glaze layer 2 formed on an insulating substrate 1, a resistor layer 3 formed on the glaze layer, a conductor layer 4 formed so that part of the resistor layer is exposed to serve as a heating portion 3c and a protective film 5 formed to cover the conductor layer 4 and the heating portion 3c. The protective film 5 includes a lower first protective layer 5a, and an upper second protective layer 5b overlapping the first protective layer 5a and serving as the outermost layer. The first protective layer 5a has a hardness of 500 to 800 Hk and a thickness of 1 to 2 ?m. The second protective layer 5b has a hardness of 1000 to 2000 Hk and a thickness of 5 to 8 ?m.

Abstract: A thermal printhead (A1) includes an insulating substrate (1), a glaze (2), a plurality of pairs of first and second electrodes (3A, 3B) and heating resistors (5). Each of the heating resistors (5) includes a heating portion (5a) spaced apart from the first electrode (3A) and the second electrode (3B). The respective ends (31A, 31B) of the electrodes (3A, 3B) are embedded in the glaze (2). An insulating film (4) is provided between the heating portion (5a) of each heating resistor (5) and the glaze (2). The hardness of the insulating film (4) is higher than that of the glaze (2) and lower than that of the heating resistor (5). The thermal conductivity of the insulating film (4) is higher than that of the glaze (2) and lower than that of the heating resistor (5).

Abstract: A thermal printhead (A) includes an insulating substrate (1), a glaze layer (2), a resistor layer (3), an electrode layer (4) and a protective layer (5). The electrode layer (4) has a two-layer structure made up of a lower first electrode layer (4a) and an upper second electrode layer (4b). The resistor layer (3) includes a heating portion (7). The heating portion (7) is exposed from both the first electrode layer (4a) and the second electrode layer (4b) and is positioned on a bulging portion (2c) of the glaze layer (2).

Abstract: A thermal printhead (A1) includes a substrate (1), a glaze layer (2), a heating resistor (3), an electrode (4) for energizing the heating resistor (3), the electrode being mainly composed of Au, and a protective film (6) covering the heating resistor (3) and the electrode (4). The electrode (4) has a surface formed with a plurality of recesses.